JPH0284748A - Semiconductor wafer - Google Patents

Abstract

PURPOSE:To enable semiconductor chips to be electrically tested without doing any damage to the pads inside the chips by a method wherein the other pads for electrical testing of semiconductor chips are provided on the positions excluding the regions of semiconductor chips independently from the pads inside the semiconductor chips. CONSTITUTION:Within a semiconductor wafer 1 including semiconductor chips 2 provided with the required functions, pads 5 for electrical testing of the semiconductor chips 2 are provided on the positions excluding the regions of said semiconductor chips 2 independently from the pads 4 inside the semiconductor chips 2. For example, the semiconductor chips 2 with pads 4 for leading-out the required functions are arranged on a semiconductor wafer 1 while the pads 5 respectively connected to all pads 4 inside the semiconductor chips 2 are formed around respective semiconductor chips 2. Then, in order to test the electrical functions of the semiconductor chips 2 in a wafer state, a probe is brought into contact with the pads 5 around respective semiconductor chips 2 to transmit electrical signals from the probe to the pads 5 for testing the electrical functions of the semiconductor chips 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor wafer 1-, and particularly to a method for electrically testing a semiconductor chip without damaging the pads of the semiconductor chip on the semiconductor wafer 1-. Concerning what you do.

[Conventional technology]

Conventional semiconductor wafers include semiconductor wafer 1 shown in FIG.
As shown in FIG.
are arranged all over. Pads 4 necessary for extracting the above-mentioned functions to the outside of the semiconductor chip 2 are formed in the semiconductor chip 2 . When extracting the functions of the semiconductor chip 2 to the outside, electrical signals are always exchanged via the pads 4.

Therefore, when conducting an electrical test of the function of the semiconductor chip 20 in the state of a semiconductor wafer, a probe for conducting the electrical test is brought into direct contact with the pad 4, and an electrical signal is applied from the probe to the pad 4.

[Problem to be solved by the invention]

As mentioned above, in conventional semiconductor wafers, when electrically testing a semiconductor wafer, the test probe is brought into contact with the pads inside the semiconductor chip, which has the disadvantage of damaging the pads. be.

[Means to solve the problem]

The semiconductor wafer of the present invention has a pad for electrically testing the semiconductor chip, in addition to the pads inside the semiconductor chip, at a location outside the area where the semiconductor chip is mounted.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a diagram showing a first embodiment of the present invention, in which semiconductor chips 2 having pads 4 for extracting required functions to the outside are arranged on a semiconductor wafer 1, and each semiconductor chip Pads 5 each connected to all the pads 4 in the semiconductor chip 2 are formed around the semiconductor chip 2 .

When electrically testing the functions of the semiconductor chips 20 in a semiconductor wafer state, a probe for electrical testing is brought into contact with the pad 5 around each semiconductor chip 2, and an electrical signal is transmitted from the probe to the pad 5. and test it.

FIG. 2 is a diagram showing a second embodiment of the present invention.

The difference from the first embodiment is that semiconductor chips 3, which are different in size and function from the semiconductor chips 2 in FIG. 1, are arranged on a semiconductor wafer l. The arrangement of the pads 5 is exactly the same as in FIG. Therefore, even when electrically testing the function of the semiconductor chip 20, the arrangement of the pads 5 is the same as that of the semiconductor wafer of the semiconductor chip 1. The advantage is that the probe can be used as is.

〔Effect of the invention〕

As explained above, the present invention provides a semiconductor wafer with a pad for electrically testing the semiconductor chip in a location other than the area of the semiconductor chip, in addition to pads in the semiconductor chip. This has the effect of making it possible to conduct electrical tests on semiconductor chips without damaging the pads.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a first embodiment of the present invention, FIG. 2 is a plan view showing a second embodiment of the present invention, and FIG. 3 is a plan view illustrating a conventional technique. . 1... Semiconductor wafer 2, 3... Semiconductor chip, 4... Pad in semiconductor chip,
5...Pad outside the semiconductor chip. Agent: Susumu Uchihara, patent attorney Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] In a semiconductor wafer including a semiconductor chip having a required function, in a location other than the area of the semiconductor chip,
A semiconductor wafer characterized in that it has a pad for electrically testing the semiconductor chip, in addition to pads within the semiconductor chip.