JPH02180046A - Semiconductor wafer - Google Patents

Abstract

PURPOSE:To enable electrical check of difference in position between a probes and a pad by containing a semiconductor chip which is provided with pads whose number and arrangement are the same as those of pads inside a semicon ductor chip and all the pads are connected by a conductor. CONSTITUTION:A semiconductor chip 2 which is provided with required function and a semiconductor chip 4 which is provided wit pads 5 whose arrangement and number are the same as those of a pad 3 inside the semiconductor chip 2 and with a conductor 6 for connecting all the pads 5 are arranged on a semi conductor wafer 11. When probes are brought into contact with the pad 5 of the semiconductor chip 4, probes always are in an electrically shorted state each other if all the probes are in contact with the pad 5. And, if a probe is not in contact with the pad 5, only the probe is in an electrically open state from all the other probes. Thereby, it is possible to electrically check whether or not a probe is no in contact with a pad by using the semiconductor chip 4.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to semiconductor wafers, and particularly relates to a probe used for electrical testing of semiconductor wafers (hereinafter referred to as a probing probe) and a pad on the semiconductor wafer. This relates to electrically confirming the misalignment.

[Conventional technology]

Conventional semiconductor wafers include semiconductor wafer 1 shown in FIG.
As shown in FIG.
are arranged all over. A test of the functions required of the semiconductor chip 2 is performed by bringing a probing probe into contact with a pad 3 inside the semiconductor chip 2. Therefore, if the probing probe is off the pad 3, the functions required of the semiconductor chip 2 cannot be accurately tested, and the semiconductor chip 2 is determined to be defective.

As in the past, if the number of pads on a semiconductor chip is small and the size of the pads is large compared to the thickness of the floating probe, it is easy to visually check the misalignment between the pads and the probe.
We were able to correct the deviation during testing. however,
Nowadays, the degree of integration of semiconductor chips is increasing, the number of pads is increasing, and the size of the pads is also becoming smaller. Therefore, it becomes difficult to visually confirm the misalignment between the probe and the pad, and the test may be conducted with the probe dislocated from the pad.

[Problem to be solved by the invention]

As mentioned above, with conventional semiconductor wafers, when testing the functions required of a semiconductor chip, the only way to test the functions required for the semiconductor chip is to visually check the misalignment between the probing probe and the pad on the semiconductor chip. There is a drawback that the test may be conducted while the pad is detached from the pad.

[Means to solve the problem]

The semiconductor wafer of the present invention includes, in addition to a semiconductor chip having a required function, a semiconductor chip having the same number of pads in the same arrangement as the pad arrangement in the semiconductor chip, and all of the pads are connected with a conductor. I'm here.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a diagram showing a first embodiment of the present invention. On a semiconductor wafer 11, there are a semiconductor chip 2 having a required function and the same number of pads 3 arranged in the same manner as the pads 3 in the semiconductor chip 2. Semiconductor chips 4 having pads 5 and conductors 6 connecting all the pads 5 are arranged.

When the probes for probing are brought into contact with the pads 5 of the semiconductor chip 4, if all the probes are in contact with the pads 5, the probes will definitely be electrically short-circuited. If any of the probes is removed from the pad 5, only that probe becomes electrically open from all other probes. That is, it is possible to electrically check using the semiconductor chip 4 whether the probe for probing has come off the pad.

FIG. 2 is a diagram showing a second embodiment of the present invention.

The difference from the first embodiment is that the size of the pad 8 on the semiconductor chip γ, which electrically confirms the misalignment between the floating probe and the pad, is smaller than the pad 3 on the semiconductor chip 2. It is that you are.

By reducing the size of the pad, if there is even a slight deviation between the probe and the pad, the probe becomes electrically open from all the probes that are not displaced from the other pads 8. In other words, the misalignment between the floating probe and the pad can be confirmed with higher accuracy.

〔Effect of the invention〕

As explained above, the present invention has the same number of pads in the same arrangement as the pad arrangement in the semiconductor chip, in addition to the semiconductor chip having the required functions in the semiconductor wafer, and all the pads are made of conductive material. By including the connected semiconductor chip, it is possible to electrically confirm the misalignment between the probe for probing and the pad.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a first embodiment of the invention, FIG. 2 is a plan view showing a second embodiment of the invention, and FIG. 3 is a plan view illustrating a conventional technique. 1.11.21...Semiconductor wafer 2,4゜7...Semiconductor chip, 3,5.8...
Pad, 6.9...A conductor that connects all pads. Agent Patent Attorney Susumu Uchihara

Claims (1)

[Claims] In addition to a semiconductor chip having a required function, a semiconductor wafer includes a semiconductor chip having the same number of pads in the same arrangement as the pad arrangement in the semiconductor chip, and all of the pads are connected with a conductor. Features of semiconductor wafers.