JPH0167080U - - Google Patents
Info
- Publication number
- JPH0167080U JPH0167080U JP1987161840U JP16184087U JPH0167080U JP H0167080 U JPH0167080 U JP H0167080U JP 1987161840 U JP1987161840 U JP 1987161840U JP 16184087 U JP16184087 U JP 16184087U JP H0167080 U JPH0167080 U JP H0167080U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- wiring terminal
- dam
- sealed structure
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の第１の実施例に係るＩＣカー
ドの樹脂封止構造を説明する図、第２図は本考案
の第２の実施例に係るＩＣカードの封止樹脂構造
を説明する図、第３図は従来例に係る樹脂封止の
構造図、第４図は従来例に係る樹脂封止の説明図
、第５図は従来例に係る別の樹脂封止の説明図で
ある。
符号の説明、１，２１，３１……プリント基板
、２，３１ａ……外部端子、３，２２，３２……
ＩＣチツプ、４，２４，３４……ワイヤ、５，２
７，３６……封止樹脂、６，２６，３５……スル
ーホール、７，２８，３７……プラスチツクカバ
ー、７ａ……キヤビテイ部、８……不一致部分、
９……型枠、１０……接着剤、１１……ワイヤ付
けの困難な部分、１２……位置ずれ部分、２３，
３３……厚銅堰堤手段（枠）、３３ａ……堰堤部
分、３３ｂ……配線端子部分。
FIG. 1 is a diagram illustrating a resin sealing structure of an IC card according to a first embodiment of the present invention, and FIG. 2 is a diagram explaining a resin sealing structure of an IC card according to a second embodiment of the present invention. 3 is a structural diagram of resin sealing according to the conventional example, FIG. 4 is an explanatory diagram of resin sealing according to the conventional example, and FIG. 5 is an explanatory diagram of another resin sealing according to the conventional example. . Explanation of symbols, 1, 21, 31... Printed circuit board, 2, 31a... External terminal, 3, 22, 32...
IC chip, 4, 24, 34...Wire, 5, 2
7, 36... Sealing resin, 6, 26, 35... Through hole, 7, 28, 37... Plastic cover, 7a... Cavity part, 8... Mismatched part,
9... Formwork, 10... Adhesive, 11... Part where it is difficult to attach wire, 12... Misaligned part, 23,
33... thick copper dam means (frame), 33a... dam part, 33b... wiring terminal part.
Claims (1)
層が、プリント基板２１上に設けられる配線端子
２５を形成する材料と同一の材料で、かつ上層が
該材料にメツキ可能な材料で形成されてなり、該
配線端子２５よりも厚い堰堤構造をなしているこ
とを特徴とするＩＣカードの樹脂封止構造。 (2) 前記配線端子２５は銅材料であることを特
徴とする実用新案登録請求の範囲第１項に記載の
ＩＣカードの樹脂封止構造。 (3) 前記枠２３の各堰堤構造が堰堤部分３３ａ
は分離され、かつ各配線端子部分３３ｂ毎に対応
して連結されていることを特徴とする実用新案登
録請求の範囲第１項に記載するＩＣカードの樹脂
封止構造。[Claims for Utility Model Registration] (1) The lower layer of the frame 23 that prevents the sealing resin 27 from flowing is made of the same material as the material forming the wiring terminals 25 provided on the printed circuit board 21, and the upper layer is the same material. A resin-sealed structure for an IC card, characterized in that it is made of a material that can be plated, and has a dam structure that is thicker than the wiring terminals 25. (2) The resin-sealed structure of an IC card according to claim 1, wherein the wiring terminal 25 is made of a copper material. (3) Each dam structure of the frame 23 is a dam part 33a.
A resin-sealed structure for an IC card according to claim 1, wherein the wiring terminal portions 33b are separated and connected correspondingly to each wiring terminal portion 33b.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161840U JPH0167080U (en) | 1987-10-22 | 1987-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161840U JPH0167080U (en) | 1987-10-22 | 1987-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167080U true JPH0167080U (en) | 1989-04-28 |
Family
ID=31445130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161840U Pending JPH0167080U (en) | 1987-10-22 | 1987-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167080U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002123808A (en) * | 2000-10-16 | 2002-04-26 | Dainippon Printing Co Ltd | Contact type/noncontact type common ic module and ic card using it |
-
1987
- 1987-10-22 JP JP1987161840U patent/JPH0167080U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002123808A (en) * | 2000-10-16 | 2002-04-26 | Dainippon Printing Co Ltd | Contact type/noncontact type common ic module and ic card using it |
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