JPH03123318U - - Google Patents

Info

Publication number
JPH03123318U
JPH03123318U JP3209190U JP3209190U JPH03123318U JP H03123318 U JPH03123318 U JP H03123318U JP 3209190 U JP3209190 U JP 3209190U JP 3209190 U JP3209190 U JP 3209190U JP H03123318 U JPH03123318 U JP H03123318U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
signal electrode
printed
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3209190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3209190U priority Critical patent/JPH03123318U/ja
Publication of JPH03123318U publication Critical patent/JPH03123318U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例に係る複合電子部品
の構成図、第2図及び第3図は第1図に示す複合
電子部品の組立て工程説明図、第4図は第1図に
示す複合電子部品の完成状態を示す説明図、第5
図及び第6図は従来の複合電子部品の構成図であ
る。 1……複合電子部品、3……プリント基板、5
……外部接続端子、6……樹脂部材、20……イ
ンダクタンス素子、30……コンデンサ素子、4
0……電極部、IC……集積回路チツプ。
Figure 1 is a configuration diagram of a composite electronic component according to an embodiment of the present invention, Figures 2 and 3 are illustrations of the assembly process of the composite electronic component shown in Figure 1, and Figure 4 is shown in Figure 1. Explanatory diagram showing the completed state of the composite electronic component, No. 5
FIG. 6 is a configuration diagram of a conventional composite electronic component. 1...Composite electronic component, 3...Printed circuit board, 5
...External connection terminal, 6...Resin member, 20...Inductance element, 30...Capacitor element, 4
0...Electrode part, IC...Integrated circuit chip.

Claims (1)

【実用新案登録請求の範囲】 所定の回路パターンを印刷したプリント基板上
にインダクタンス素子、コンデンサ素子および集
積回路チツプとを実装し、前記プリント基板の端
部に少なくとも一つの信号電極を形成してなる複
合電子部品において、 前記信号電極と前記プリント基板の外側に配列
された外部接続端子とをワイヤーボンデイングに
より接続したことを特徴とする複合電子部品。
[Claims for Utility Model Registration] An inductance element, a capacitor element, and an integrated circuit chip are mounted on a printed circuit board on which a predetermined circuit pattern is printed, and at least one signal electrode is formed at the end of the printed circuit board. A composite electronic component, wherein the signal electrode and external connection terminals arranged on the outside of the printed circuit board are connected by wire bonding.
JP3209190U 1990-03-28 1990-03-28 Pending JPH03123318U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3209190U JPH03123318U (en) 1990-03-28 1990-03-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3209190U JPH03123318U (en) 1990-03-28 1990-03-28

Publications (1)

Publication Number Publication Date
JPH03123318U true JPH03123318U (en) 1991-12-16

Family

ID=31534964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3209190U Pending JPH03123318U (en) 1990-03-28 1990-03-28

Country Status (1)

Country Link
JP (1) JPH03123318U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010530622A (en) * 2007-06-21 2010-09-09 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Electrical components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010530622A (en) * 2007-06-21 2010-09-09 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Electrical components

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