JPH0160935B2 - - Google Patents
Info
- Publication number
- JPH0160935B2 JPH0160935B2 JP7046281A JP7046281A JPH0160935B2 JP H0160935 B2 JPH0160935 B2 JP H0160935B2 JP 7046281 A JP7046281 A JP 7046281A JP 7046281 A JP7046281 A JP 7046281A JP H0160935 B2 JPH0160935 B2 JP H0160935B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film
- spacer
- electroplating
- ray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010408 film Substances 0.000 claims description 37
- 239000010409 thin film Substances 0.000 claims description 37
- 125000006850 spacer group Chemical group 0.000 claims description 31
- 238000009713 electroplating Methods 0.000 claims description 18
- 239000006096 absorbing agent Substances 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- -1 oxygen ions Chemical class 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Drying Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7046281A JPS57185438A (en) | 1981-05-11 | 1981-05-11 | Production of x-ray exposure mask |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7046281A JPS57185438A (en) | 1981-05-11 | 1981-05-11 | Production of x-ray exposure mask |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57185438A JPS57185438A (en) | 1982-11-15 |
JPH0160935B2 true JPH0160935B2 (enrdf_load_stackoverflow) | 1989-12-26 |
Family
ID=13432203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7046281A Granted JPS57185438A (en) | 1981-05-11 | 1981-05-11 | Production of x-ray exposure mask |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57185438A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4899660B2 (ja) * | 2006-06-26 | 2012-03-21 | 株式会社デンソー | 熱交換器用コルゲートフィンの成形方法、およびコルゲートフィン成形用ローラ |
-
1981
- 1981-05-11 JP JP7046281A patent/JPS57185438A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57185438A (en) | 1982-11-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4528071A (en) | Process for the production of masks having a metal carrier foil | |
JP3131765B2 (ja) | 位相シフトマスクの製造方法 | |
JPH0160935B2 (enrdf_load_stackoverflow) | ||
JPS60117723A (ja) | 微細パタ−ンの形成方法 | |
US5700381A (en) | Method for manufacturing thin film magnetic head | |
JPH0160934B2 (enrdf_load_stackoverflow) | ||
JP2001118780A (ja) | 電子線用転写マスクブランクス、電子線用転写マスク及びそれらの製造方法 | |
JP2899542B2 (ja) | 転写マスクの製造方法 | |
JPH0430134B2 (enrdf_load_stackoverflow) | ||
JPH0416009B2 (enrdf_load_stackoverflow) | ||
JPH059756A (ja) | エツチング方法 | |
JPS604221A (ja) | 半導体装置の製造方法 | |
JPS5856422A (ja) | パタ−ン形成法 | |
JPS61150326A (ja) | 半導体装置の製造方法 | |
JPS58199525A (ja) | X線用マスク | |
JPS6355209B2 (enrdf_load_stackoverflow) | ||
JPH06112112A (ja) | 半導体装置の製造方法 | |
JPH0312452B2 (enrdf_load_stackoverflow) | ||
JPS5898932A (ja) | 半導体装置の製造方法 | |
JPH07161721A (ja) | 厚膜レジストの平坦化方法 | |
JPS5892223A (ja) | レジストパタ−ン形成方法 | |
JPH0644550B2 (ja) | 半導体装置の製造方法 | |
JPS62291029A (ja) | X線露光用マスク | |
JPH02103921A (ja) | パターン形成方法及びパターン形成用マスク | |
JPS634700B2 (enrdf_load_stackoverflow) |