JPH0160163B2 - - Google Patents

Info

Publication number
JPH0160163B2
JPH0160163B2 JP57109248A JP10924882A JPH0160163B2 JP H0160163 B2 JPH0160163 B2 JP H0160163B2 JP 57109248 A JP57109248 A JP 57109248A JP 10924882 A JP10924882 A JP 10924882A JP H0160163 B2 JPH0160163 B2 JP H0160163B2
Authority
JP
Japan
Prior art keywords
epoxy resin
weight
composition
type epoxy
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57109248A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58225120A (ja
Inventor
Takaaki Fukai
Hiromitsu Takanohashi
Takeshi Hatsutori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP10924882A priority Critical patent/JPS58225120A/ja
Publication of JPS58225120A publication Critical patent/JPS58225120A/ja
Publication of JPH0160163B2 publication Critical patent/JPH0160163B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP10924882A 1982-06-25 1982-06-25 半導体封止用エポキシ樹脂組成物 Granted JPS58225120A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10924882A JPS58225120A (ja) 1982-06-25 1982-06-25 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10924882A JPS58225120A (ja) 1982-06-25 1982-06-25 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS58225120A JPS58225120A (ja) 1983-12-27
JPH0160163B2 true JPH0160163B2 (enrdf_load_stackoverflow) 1989-12-21

Family

ID=14505364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10924882A Granted JPS58225120A (ja) 1982-06-25 1982-06-25 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS58225120A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2674701B2 (ja) * 1986-05-01 1997-11-12 日東電工株式会社 半導体装置
JPH0737513B2 (ja) * 1987-03-31 1995-04-26 日立化成工業株式会社 ハイブリツドｉｃの被覆材料
JP2576018B2 (ja) * 1993-06-14 1997-01-29 日東電工株式会社 半導体封止用樹脂タブレツト
KR100388141B1 (ko) * 1995-07-10 2003-10-17 도레이 가부시끼가이샤 에폭시수지조성물
JPH08239557A (ja) * 1996-02-15 1996-09-17 Nitto Denko Corp 半導体封止装置
JP2922151B2 (ja) * 1996-02-15 1999-07-19 日東電工株式会社 半導体封止装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4899249A (enrdf_load_stackoverflow) * 1972-03-29 1973-12-15
US4202811A (en) * 1978-06-21 1980-05-13 Dow Corning Corporation Siloxane-epoxy molding compound with improved crack resistance
JPS56122857A (en) * 1980-02-29 1981-09-26 Nitto Electric Ind Co Ltd Preparation of epoxy resin composition
JPS6018145B2 (ja) * 1980-09-22 1985-05-09 株式会社日立製作所 樹脂封止型半導体装置
JPS58210920A (ja) * 1982-05-31 1983-12-08 Shin Etsu Chem Co Ltd 熱硬化性エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS58225120A (ja) 1983-12-27

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