JPH0159353B2 - - Google Patents
Info
- Publication number
- JPH0159353B2 JPH0159353B2 JP62136245A JP13624587A JPH0159353B2 JP H0159353 B2 JPH0159353 B2 JP H0159353B2 JP 62136245 A JP62136245 A JP 62136245A JP 13624587 A JP13624587 A JP 13624587A JP H0159353 B2 JPH0159353 B2 JP H0159353B2
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- sputtering
- vacuum processing
- vacuum
- chambers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13624587A JPS63303059A (ja) | 1987-05-30 | 1987-05-30 | 真空処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13624587A JPS63303059A (ja) | 1987-05-30 | 1987-05-30 | 真空処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63303059A JPS63303059A (ja) | 1988-12-09 |
| JPH0159353B2 true JPH0159353B2 (enExample) | 1989-12-15 |
Family
ID=15170679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13624587A Granted JPS63303059A (ja) | 1987-05-30 | 1987-05-30 | 真空処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63303059A (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4933966A (en) * | 1989-01-23 | 1990-06-12 | Intellicall, Inc. | Method and apparatus for performing an automated collect call |
| JPH0793348B2 (ja) * | 1989-05-19 | 1995-10-09 | アプライド マテリアルズ インコーポレーテッド | 多重チャンバ真空式処理装置及び多重チャンバ真空式半導体ウェーハ処理装置 |
| TW539918B (en) | 1997-05-27 | 2003-07-01 | Tokyo Electron Ltd | Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process |
| CN1192417C (zh) | 1999-11-02 | 2005-03-09 | 东京威力科创股份有限公司 | 工件的超临界处理的方法和装置 |
| US6748960B1 (en) | 1999-11-02 | 2004-06-15 | Tokyo Electron Limited | Apparatus for supercritical processing of multiple workpieces |
| CN1216415C (zh) | 2000-04-25 | 2005-08-24 | 东京毅力科创株式会社 | 沉积金属薄膜的方法和包括超临界干燥/清洁组件的金属沉积组合工具 |
| EP1303870A2 (en) | 2000-07-26 | 2003-04-23 | Tokyo Electron Limited | High pressure processing chamber for semiconductor substrate |
| JP3883929B2 (ja) | 2001-09-25 | 2007-02-21 | 大日本スクリーン製造株式会社 | 薄膜形成装置および薄膜形成方法 |
| US7001468B1 (en) | 2002-02-15 | 2006-02-21 | Tokyo Electron Limited | Pressure energized pressure vessel opening and closing device and method of providing therefor |
| US7021635B2 (en) | 2003-02-06 | 2006-04-04 | Tokyo Electron Limited | Vacuum chuck utilizing sintered material and method of providing thereof |
| US7077917B2 (en) | 2003-02-10 | 2006-07-18 | Tokyo Electric Limited | High-pressure processing chamber for a semiconductor wafer |
| US7225820B2 (en) | 2003-02-10 | 2007-06-05 | Tokyo Electron Limited | High-pressure processing chamber for a semiconductor wafer |
| US7270137B2 (en) | 2003-04-28 | 2007-09-18 | Tokyo Electron Limited | Apparatus and method of securing a workpiece during high-pressure processing |
| US7163380B2 (en) | 2003-07-29 | 2007-01-16 | Tokyo Electron Limited | Control of fluid flow in the processing of an object with a fluid |
| US7186093B2 (en) | 2004-10-05 | 2007-03-06 | Tokyo Electron Limited | Method and apparatus for cooling motor bearings of a high pressure pump |
| US7250374B2 (en) | 2004-06-30 | 2007-07-31 | Tokyo Electron Limited | System and method for processing a substrate using supercritical carbon dioxide processing |
| US7307019B2 (en) | 2004-09-29 | 2007-12-11 | Tokyo Electron Limited | Method for supercritical carbon dioxide processing of fluoro-carbon films |
| US7491036B2 (en) | 2004-11-12 | 2009-02-17 | Tokyo Electron Limited | Method and system for cooling a pump |
| US7140393B2 (en) | 2004-12-22 | 2006-11-28 | Tokyo Electron Limited | Non-contact shuttle valve for flow diversion in high pressure systems |
| US7434590B2 (en) | 2004-12-22 | 2008-10-14 | Tokyo Electron Limited | Method and apparatus for clamping a substrate in a high pressure processing system |
| US7291565B2 (en) | 2005-02-15 | 2007-11-06 | Tokyo Electron Limited | Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid |
| US7435447B2 (en) | 2005-02-15 | 2008-10-14 | Tokyo Electron Limited | Method and system for determining flow conditions in a high pressure processing system |
| US7380984B2 (en) | 2005-03-28 | 2008-06-03 | Tokyo Electron Limited | Process flow thermocouple |
| US7494107B2 (en) | 2005-03-30 | 2009-02-24 | Supercritical Systems, Inc. | Gate valve for plus-atmospheric pressure semiconductor process vessels |
| US7524383B2 (en) | 2005-05-25 | 2009-04-28 | Tokyo Electron Limited | Method and system for passivating a processing chamber |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54153740A (en) * | 1978-05-25 | 1979-12-04 | Ulvac Corp | Continuous vacuum treatment apparatus |
| JPS5877239A (ja) * | 1981-11-04 | 1983-05-10 | Ulvac Corp | 連続式真空処理装置 |
| JPS59179786A (ja) * | 1983-03-30 | 1984-10-12 | Hitachi Ltd | 連続スパツタ装置 |
| JPS59208074A (ja) * | 1983-05-13 | 1984-11-26 | Toshiba Corp | 枚葉式膜形成装置 |
| JPS6155926A (ja) * | 1984-08-27 | 1986-03-20 | Nec Corp | 半導体製造装置 |
-
1987
- 1987-05-30 JP JP13624587A patent/JPS63303059A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63303059A (ja) | 1988-12-09 |
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