JPH0158864B2 - - Google Patents

Info

Publication number
JPH0158864B2
JPH0158864B2 JP58008366A JP836683A JPH0158864B2 JP H0158864 B2 JPH0158864 B2 JP H0158864B2 JP 58008366 A JP58008366 A JP 58008366A JP 836683 A JP836683 A JP 836683A JP H0158864 B2 JPH0158864 B2 JP H0158864B2
Authority
JP
Japan
Prior art keywords
metal
protrusion
metal lead
lead
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58008366A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59139636A (ja
Inventor
Kenzo Hatada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58008366A priority Critical patent/JPS59139636A/ja
Publication of JPS59139636A publication Critical patent/JPS59139636A/ja
Publication of JPH0158864B2 publication Critical patent/JPH0158864B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58008366A 1983-01-20 1983-01-20 ボンデイング方法 Granted JPS59139636A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58008366A JPS59139636A (ja) 1983-01-20 1983-01-20 ボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58008366A JPS59139636A (ja) 1983-01-20 1983-01-20 ボンデイング方法

Publications (2)

Publication Number Publication Date
JPS59139636A JPS59139636A (ja) 1984-08-10
JPH0158864B2 true JPH0158864B2 (OSRAM) 1989-12-13

Family

ID=11691236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58008366A Granted JPS59139636A (ja) 1983-01-20 1983-01-20 ボンデイング方法

Country Status (1)

Country Link
JP (1) JPS59139636A (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0323257U (OSRAM) * 1989-07-17 1991-03-11
JPH0394468U (OSRAM) * 1990-01-19 1991-09-26
JPH0684067U (ja) * 1993-05-19 1994-12-02 株式会社荒井製作所 往復動用オイルシール

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0793344B2 (ja) * 1987-05-20 1995-10-09 松下電器産業株式会社 フイルムキヤリア
EP0349756A3 (en) * 1988-05-30 1991-03-20 Canon Kabushiki Kaisha Method of making electric circuit device
US5197892A (en) * 1988-05-31 1993-03-30 Canon Kabushiki Kaisha Electric circuit device having an electric connecting member and electric circuit components
US5081520A (en) * 1989-05-16 1992-01-14 Minolta Camera Kabushiki Kaisha Chip mounting substrate having an integral molded projection and conductive pattern
JPH03290937A (ja) * 1989-12-29 1991-12-20 Orient Watch Co Ltd バンプ付き金属リード及びその製造方法
US5819406A (en) * 1990-08-29 1998-10-13 Canon Kabushiki Kaisha Method for forming an electrical circuit member
DE69233232T2 (de) * 1991-02-22 2004-08-05 Canon K.K. Elektrischer Verbindungskörper und Herstellungsverfahren dafür
EP0501361B1 (en) * 1991-02-25 2002-05-15 Canon Kabushiki Kaisha Electrical connecting member and method of manufacturing the same
DE69216658T2 (de) * 1991-02-25 1997-08-07 Canon Kk Vorrichtung und Verfahren zur Verbindung elektrischer Bauelemente

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0323257U (OSRAM) * 1989-07-17 1991-03-11
JPH0394468U (OSRAM) * 1990-01-19 1991-09-26
JPH0684067U (ja) * 1993-05-19 1994-12-02 株式会社荒井製作所 往復動用オイルシール

Also Published As

Publication number Publication date
JPS59139636A (ja) 1984-08-10

Similar Documents

Publication Publication Date Title
KR100437436B1 (ko) 반도체패키지의제조법및반도체패키지
US5652461A (en) Semiconductor device with a convex heat sink
JPH11111896A (ja) 半導体装置及びその製造方法
WO1998018161A1 (fr) Dispositif a semi-conducteur, procede de fabrication, substrat de circuit et bande porteuse de film
JP2004119726A (ja) 回路装置の製造方法
JP4260617B2 (ja) 半導体装置の製造方法
US6037662A (en) Chip scale package
US20020017706A1 (en) Lead frame, semiconductor device and manufacturing method therefor, circuit board and electronic equipment
JPH0158864B2 (OSRAM)
JP3650596B2 (ja) 半導体装置の製造方法
JPH0214779B2 (OSRAM)
EP0723293B1 (en) Semiconductor device with a heat sink and method of producing the heat sink
JPS6234143B2 (OSRAM)
JP2748759B2 (ja) フィルムキャリアテープの製造方法
JP3076302B2 (ja) 半導体装置
JP2000260921A (ja) リードフレームとそれを用いた樹脂封止型半導体装置およびその製造方法
JP4045718B2 (ja) 樹脂封止型半導体装置およびその製造方法
JPH0158863B2 (OSRAM)
JP2002164497A (ja) 半導体装置およびその製造方法
JP2000058705A (ja) 半導体装置およびその製造方法
KR100253323B1 (ko) 반도체 패키지 및 그 제조방법
JPH04154137A (ja) フィルムキャリヤーテープの製造方法
JPH1174310A (ja) 半導体装置およびその製造方法
JP2000091458A (ja) 半導体装置及びその製造方法
JPH03119755A (ja) リードフレームの製造方法