JPH0158672B2 - - Google Patents

Info

Publication number
JPH0158672B2
JPH0158672B2 JP56177415A JP17741581A JPH0158672B2 JP H0158672 B2 JPH0158672 B2 JP H0158672B2 JP 56177415 A JP56177415 A JP 56177415A JP 17741581 A JP17741581 A JP 17741581A JP H0158672 B2 JPH0158672 B2 JP H0158672B2
Authority
JP
Japan
Prior art keywords
semiconductor substrate
type semiconductor
semiconductor layer
semiconductor
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56177415A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5878470A (ja
Inventor
Mikio Betsusho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56177415A priority Critical patent/JPS5878470A/ja
Publication of JPS5878470A publication Critical patent/JPS5878470A/ja
Publication of JPH0158672B2 publication Critical patent/JPH0158672B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
JP56177415A 1981-11-04 1981-11-04 半導体圧力検出装置 Granted JPS5878470A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56177415A JPS5878470A (ja) 1981-11-04 1981-11-04 半導体圧力検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56177415A JPS5878470A (ja) 1981-11-04 1981-11-04 半導体圧力検出装置

Publications (2)

Publication Number Publication Date
JPS5878470A JPS5878470A (ja) 1983-05-12
JPH0158672B2 true JPH0158672B2 (enrdf_load_stackoverflow) 1989-12-13

Family

ID=16030519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56177415A Granted JPS5878470A (ja) 1981-11-04 1981-11-04 半導体圧力検出装置

Country Status (1)

Country Link
JP (1) JPS5878470A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6261374A (ja) * 1985-09-11 1987-03-18 Nec Corp シリコンダイアフラムの形成方法
JPS6381867A (ja) * 1986-09-25 1988-04-12 Yokogawa Electric Corp 半導体拡散ストレンゲ−ジ
JPH02116174A (ja) * 1988-10-25 1990-04-27 Nec Corp 半導体圧力センサ
JP3624597B2 (ja) * 1996-12-10 2005-03-02 株式会社デンソー 半導体装置及びその製造方法
JP3367458B2 (ja) * 1999-03-30 2003-01-14 株式会社デンソー 半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5938744B2 (ja) * 1976-09-29 1984-09-19 株式会社デンソー 圧力−電気変換装置およびその製造方法
JPS5696875A (en) * 1979-12-29 1981-08-05 Mitsubishi Electric Corp Semiconductor pressure sensing device and manufacture thereof

Also Published As

Publication number Publication date
JPS5878470A (ja) 1983-05-12

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