JPH0155573B2 - - Google Patents

Info

Publication number
JPH0155573B2
JPH0155573B2 JP58192727A JP19272783A JPH0155573B2 JP H0155573 B2 JPH0155573 B2 JP H0155573B2 JP 58192727 A JP58192727 A JP 58192727A JP 19272783 A JP19272783 A JP 19272783A JP H0155573 B2 JPH0155573 B2 JP H0155573B2
Authority
JP
Japan
Prior art keywords
wafer
etching
tank
washing
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58192727A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6084823A (ja
Inventor
Masatoshi Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP19272783A priority Critical patent/JPS6084823A/ja
Publication of JPS6084823A publication Critical patent/JPS6084823A/ja
Publication of JPH0155573B2 publication Critical patent/JPH0155573B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
JP19272783A 1983-10-15 1983-10-15 半導体ウエハのエツチング装置 Granted JPS6084823A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19272783A JPS6084823A (ja) 1983-10-15 1983-10-15 半導体ウエハのエツチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19272783A JPS6084823A (ja) 1983-10-15 1983-10-15 半導体ウエハのエツチング装置

Publications (2)

Publication Number Publication Date
JPS6084823A JPS6084823A (ja) 1985-05-14
JPH0155573B2 true JPH0155573B2 (enrdf_load_stackoverflow) 1989-11-27

Family

ID=16296057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19272783A Granted JPS6084823A (ja) 1983-10-15 1983-10-15 半導体ウエハのエツチング装置

Country Status (1)

Country Link
JP (1) JPS6084823A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0736400B2 (ja) * 1985-12-23 1995-04-19 東洋設備工業株式会社 ウエハのエツチング装置
JP2601827B2 (ja) * 1987-07-15 1997-04-16 株式会社日立製作所 ウエット処理装置
JP2601829B2 (ja) * 1987-07-15 1997-04-16 株式会社日立製作所 ウエット処理装置
US5944941A (en) * 1996-10-09 1999-08-31 Ebara Corporation Turning-over machine and polishing apparatus
CN114554713B (zh) * 2022-01-25 2023-03-24 富璟信息数字科技(深圳)有限公司 一种用于集成电路生产用的蚀刻设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49107480A (enrdf_load_stackoverflow) * 1973-02-15 1974-10-12
JPS5752138A (en) * 1980-09-16 1982-03-27 Mitsubishi Electric Corp Etching device for semiconductor substrate

Also Published As

Publication number Publication date
JPS6084823A (ja) 1985-05-14

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