JPH0150520B2 - - Google Patents

Info

Publication number
JPH0150520B2
JPH0150520B2 JP27693887A JP27693887A JPH0150520B2 JP H0150520 B2 JPH0150520 B2 JP H0150520B2 JP 27693887 A JP27693887 A JP 27693887A JP 27693887 A JP27693887 A JP 27693887A JP H0150520 B2 JPH0150520 B2 JP H0150520B2
Authority
JP
Japan
Prior art keywords
solder
granular
punched
granular solder
shows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP27693887A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6411095A (en
Inventor
Shigeaki Ootake
Akira Ikeda
Toshihiro Kunii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anritsu Corp
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Priority to JP27693887A priority Critical patent/JPS6411095A/ja
Publication of JPS6411095A publication Critical patent/JPS6411095A/ja
Publication of JPH0150520B2 publication Critical patent/JPH0150520B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP27693887A 1987-10-30 1987-10-30 Production of granular solder Granted JPS6411095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27693887A JPS6411095A (en) 1987-10-30 1987-10-30 Production of granular solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27693887A JPS6411095A (en) 1987-10-30 1987-10-30 Production of granular solder

Publications (2)

Publication Number Publication Date
JPS6411095A JPS6411095A (en) 1989-01-13
JPH0150520B2 true JPH0150520B2 (enrdf_load_stackoverflow) 1989-10-30

Family

ID=17576496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27693887A Granted JPS6411095A (en) 1987-10-30 1987-10-30 Production of granular solder

Country Status (1)

Country Link
JP (1) JPS6411095A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013046450A1 (ja) * 2011-09-30 2013-04-04 千住金属工業株式会社 はんだ小片、チップソルダ、及びはんだ小片の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5240448B2 (ja) * 2008-08-27 2013-07-17 トヨタ自動車株式会社 はんだ供給装置およびはんだ供給方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013046450A1 (ja) * 2011-09-30 2013-04-04 千住金属工業株式会社 はんだ小片、チップソルダ、及びはんだ小片の製造方法

Also Published As

Publication number Publication date
JPS6411095A (en) 1989-01-13

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