JPS6411095A - Production of granular solder - Google Patents

Production of granular solder

Info

Publication number
JPS6411095A
JPS6411095A JP27693887A JP27693887A JPS6411095A JP S6411095 A JPS6411095 A JP S6411095A JP 27693887 A JP27693887 A JP 27693887A JP 27693887 A JP27693887 A JP 27693887A JP S6411095 A JPS6411095 A JP S6411095A
Authority
JP
Japan
Prior art keywords
solder
hole
blanked
stock
granular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27693887A
Other languages
Japanese (ja)
Other versions
JPH0150520B2 (en
Inventor
Shigeaki Otake
Akira Ikeda
Toshihiro Kunii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anritsu Corp
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Priority to JP27693887A priority Critical patent/JPS6411095A/en
Publication of JPS6411095A publication Critical patent/JPS6411095A/en
Publication of JPH0150520B2 publication Critical patent/JPH0150520B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom

Abstract

PURPOSE:To improve the efficiency of preplaced soldering by crushing the burr of blanked solder by a return punch and forming the granular solder curved to a semispherical shape by means of a knock out bar having roundness at the tip. CONSTITUTION:The flat plate-shaped solder stock 6 is inserted between an upper die 7 and a lower die 8 and is blanked by lowering a hammer 9 from the hole of the upper die 7. The blanked solder 10 is then pushed back by the return punch 12 from the hole of the lower die into a hole 13 generated by blanking of the stock 6. The burr around the blanked solder 10 is pressed by the return punch and is removed by the edge of the hole 13 so as to be fitted into the hole 13. The solder 14 returned and fitted into the hole 13 of the stock 6 is further ejected from the hole of the upper die 7 by the knock-out bar 15 having the roundness at the tip, by which the granular solder 16 having no burr around the rounded hole and having the shape curved to project downward is obtd. The fall of the granular solder from a guide plate is thereby facilitated.
JP27693887A 1987-10-30 1987-10-30 Production of granular solder Granted JPS6411095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27693887A JPS6411095A (en) 1987-10-30 1987-10-30 Production of granular solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27693887A JPS6411095A (en) 1987-10-30 1987-10-30 Production of granular solder

Publications (2)

Publication Number Publication Date
JPS6411095A true JPS6411095A (en) 1989-01-13
JPH0150520B2 JPH0150520B2 (en) 1989-10-30

Family

ID=17576496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27693887A Granted JPS6411095A (en) 1987-10-30 1987-10-30 Production of granular solder

Country Status (1)

Country Link
JP (1) JPS6411095A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010051994A (en) * 2008-08-27 2010-03-11 Toyota Motor Corp Solder feeding device and solder feeding method
CN102612867A (en) * 2011-09-30 2012-07-25 千住金属工业株式会社 Solder piece, small solder piece provider, and method for producing solder piece

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010051994A (en) * 2008-08-27 2010-03-11 Toyota Motor Corp Solder feeding device and solder feeding method
CN102612867A (en) * 2011-09-30 2012-07-25 千住金属工业株式会社 Solder piece, small solder piece provider, and method for producing solder piece
US8991679B2 (en) 2011-09-30 2015-03-31 Senju Metal Industry Co., Ltd. Solder piece, chip solder and method of fabricating solder piece
US9327364B2 (en) 2011-09-30 2016-05-03 Senju Metal Industry Co., Ltd. Solder piece, chip solder and method of fabricating solder piece

Also Published As

Publication number Publication date
JPH0150520B2 (en) 1989-10-30

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