JPS6411095A - Production of granular solder - Google Patents

Production of granular solder

Info

Publication number
JPS6411095A
JPS6411095A JP27693887A JP27693887A JPS6411095A JP S6411095 A JPS6411095 A JP S6411095A JP 27693887 A JP27693887 A JP 27693887A JP 27693887 A JP27693887 A JP 27693887A JP S6411095 A JPS6411095 A JP S6411095A
Authority
JP
Japan
Prior art keywords
solder
hole
blanked
stock
granular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27693887A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0150520B2 (enrdf_load_stackoverflow
Inventor
Shigeaki Otake
Akira Ikeda
Toshihiro Kunii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anritsu Corp
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Priority to JP27693887A priority Critical patent/JPS6411095A/ja
Publication of JPS6411095A publication Critical patent/JPS6411095A/ja
Publication of JPH0150520B2 publication Critical patent/JPH0150520B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP27693887A 1987-10-30 1987-10-30 Production of granular solder Granted JPS6411095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27693887A JPS6411095A (en) 1987-10-30 1987-10-30 Production of granular solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27693887A JPS6411095A (en) 1987-10-30 1987-10-30 Production of granular solder

Publications (2)

Publication Number Publication Date
JPS6411095A true JPS6411095A (en) 1989-01-13
JPH0150520B2 JPH0150520B2 (enrdf_load_stackoverflow) 1989-10-30

Family

ID=17576496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27693887A Granted JPS6411095A (en) 1987-10-30 1987-10-30 Production of granular solder

Country Status (1)

Country Link
JP (1) JPS6411095A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010051994A (ja) * 2008-08-27 2010-03-11 Toyota Motor Corp はんだ供給装置およびはんだ供給方法
CN102612867A (zh) * 2011-09-30 2012-07-25 千住金属工业株式会社 焊料小块、焊料小块供给体、和焊料小块的制造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010051994A (ja) * 2008-08-27 2010-03-11 Toyota Motor Corp はんだ供給装置およびはんだ供給方法
CN102612867A (zh) * 2011-09-30 2012-07-25 千住金属工业株式会社 焊料小块、焊料小块供给体、和焊料小块的制造方法
US8991679B2 (en) 2011-09-30 2015-03-31 Senju Metal Industry Co., Ltd. Solder piece, chip solder and method of fabricating solder piece
US9327364B2 (en) 2011-09-30 2016-05-03 Senju Metal Industry Co., Ltd. Solder piece, chip solder and method of fabricating solder piece

Also Published As

Publication number Publication date
JPH0150520B2 (enrdf_load_stackoverflow) 1989-10-30

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