JPH0148352B2 - - Google Patents

Info

Publication number
JPH0148352B2
JPH0148352B2 JP59237496A JP23749684A JPH0148352B2 JP H0148352 B2 JPH0148352 B2 JP H0148352B2 JP 59237496 A JP59237496 A JP 59237496A JP 23749684 A JP23749684 A JP 23749684A JP H0148352 B2 JPH0148352 B2 JP H0148352B2
Authority
JP
Japan
Prior art keywords
tin
plating
acid
plating solution
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59237496A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61117297A (ja
Inventor
Kanji Oono
Sayuri Hotsuta
Terubumi Takeda
Hidenori Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Udylite Co Ltd
Original Assignee
Ebara Udylite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Udylite Co Ltd filed Critical Ebara Udylite Co Ltd
Priority to JP23749684A priority Critical patent/JPS61117297A/ja
Publication of JPS61117297A publication Critical patent/JPS61117297A/ja
Publication of JPH0148352B2 publication Critical patent/JPH0148352B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3473Plating of solder
JP23749684A 1984-11-13 1984-11-13 スズ属金属めつき液 Granted JPS61117297A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23749684A JPS61117297A (ja) 1984-11-13 1984-11-13 スズ属金属めつき液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23749684A JPS61117297A (ja) 1984-11-13 1984-11-13 スズ属金属めつき液

Publications (2)

Publication Number Publication Date
JPS61117297A JPS61117297A (ja) 1986-06-04
JPH0148352B2 true JPH0148352B2 (zh) 1989-10-18

Family

ID=17016176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23749684A Granted JPS61117297A (ja) 1984-11-13 1984-11-13 スズ属金属めつき液

Country Status (1)

Country Link
JP (1) JPS61117297A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63161188A (ja) * 1986-12-24 1988-07-04 Nippon Mining Co Ltd リフロ−半田めつき材の製造法
JPS63161185A (ja) * 1986-12-24 1988-07-04 Nippon Mining Co Ltd リフロ−錫めつき材の製造法
JPS63162894A (ja) * 1986-12-26 1988-07-06 Nippon Mining Co Ltd リフロ−錫めつき材の製造方法
JPH01149987A (ja) * 1987-12-05 1989-06-13 Kosaku:Kk スズ−コバルト、スズ−ニッケル、スズ−鉛二元合金電気めっき浴組成物
JP5410201B2 (ja) * 2009-08-26 2014-02-05 三菱伸銅株式会社 銅合金板への高電流密度Snめっき用硫酸浴及びSnめっき方法
US20150122662A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4866537A (zh) * 1971-12-16 1973-09-12
US4072582A (en) * 1976-12-27 1978-02-07 Columbia Chemical Corporation Aqueous acid plating bath and additives for producing bright electrodeposits of tin
JPS54134041A (en) * 1978-04-05 1979-10-18 Hull & Co R O Brightener composition for electrodeposition of tin and*or lead* plating solution* and electrodeposition using same
JPS59182986A (ja) * 1983-04-01 1984-10-17 Keigo Obata スズ、鉛及びすず−鉛合金メツキ浴

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4866537A (zh) * 1971-12-16 1973-09-12
US4072582A (en) * 1976-12-27 1978-02-07 Columbia Chemical Corporation Aqueous acid plating bath and additives for producing bright electrodeposits of tin
JPS54134041A (en) * 1978-04-05 1979-10-18 Hull & Co R O Brightener composition for electrodeposition of tin and*or lead* plating solution* and electrodeposition using same
JPS59182986A (ja) * 1983-04-01 1984-10-17 Keigo Obata スズ、鉛及びすず−鉛合金メツキ浴

Also Published As

Publication number Publication date
JPS61117297A (ja) 1986-06-04

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