JPH0145980B2 - - Google Patents

Info

Publication number
JPH0145980B2
JPH0145980B2 JP58026146A JP2614683A JPH0145980B2 JP H0145980 B2 JPH0145980 B2 JP H0145980B2 JP 58026146 A JP58026146 A JP 58026146A JP 2614683 A JP2614683 A JP 2614683A JP H0145980 B2 JPH0145980 B2 JP H0145980B2
Authority
JP
Japan
Prior art keywords
chip
cavity
carrier
arm
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58026146A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58194358A (ja
Inventor
Deii Mooton Juniaa Uiriamu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PURESHIJON MONORISHITSUKUSU Inc
Original Assignee
PURESHIJON MONORISHITSUKUSU Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PURESHIJON MONORISHITSUKUSU Inc filed Critical PURESHIJON MONORISHITSUKUSU Inc
Publication of JPS58194358A publication Critical patent/JPS58194358A/ja
Publication of JPH0145980B2 publication Critical patent/JPH0145980B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
JP58026146A 1982-02-19 1983-02-18 リ−ド線のない集積回路チツプ用キヤリヤ Granted JPS58194358A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US350246 1982-02-19
US06/350,246 US4444309A (en) 1982-02-19 1982-02-19 Carrier for a leadless integrated circuit chip

Publications (2)

Publication Number Publication Date
JPS58194358A JPS58194358A (ja) 1983-11-12
JPH0145980B2 true JPH0145980B2 (cg-RX-API-DMAC7.html) 1989-10-05

Family

ID=23375867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58026146A Granted JPS58194358A (ja) 1982-02-19 1983-02-18 リ−ド線のない集積回路チツプ用キヤリヤ

Country Status (4)

Country Link
US (1) US4444309A (cg-RX-API-DMAC7.html)
EP (1) EP0087897B1 (cg-RX-API-DMAC7.html)
JP (1) JPS58194358A (cg-RX-API-DMAC7.html)
DE (1) DE3371158D1 (cg-RX-API-DMAC7.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4623577A (en) * 1985-02-01 1986-11-18 Allied Corporation Circuit board made from cross-linked polycyanurate polymer, thermoplastic polymer and polyaramid fiber
US4683423A (en) * 1985-10-30 1987-07-28 Precision Monolithics, Inc. Leadless chip test socket
US4733778A (en) * 1986-09-25 1988-03-29 Illinois Tool Works Inc. Reuseable carrier tape
US4681221A (en) * 1986-10-30 1987-07-21 International Business Machines Corporation Holder for plastic leaded chip carrier
GB2197293B (en) * 1986-11-17 1990-06-06 Instance Ltd David J Labels and manufacture thereof
US4718548A (en) * 1986-12-19 1988-01-12 Advanced Micro Devices, Inc. Protective housing for a leadless chip carrier or plastic leaded chip carrier package
JPH0298576A (ja) * 1988-09-27 1990-04-10 Murata Mfg Co Ltd チップ型電子部品の保持治具およびその取り扱い方法
GB8823030D0 (en) * 1988-09-30 1988-11-09 British Telecomm Holder
US5291994A (en) * 1993-01-08 1994-03-08 R. H. Murphy Co., Inc. Slide tab carrier for flatpack electronic component carriers
US6527998B1 (en) * 1994-02-25 2003-03-04 Xilinx, Inc. Method of fabricating integrated circuit pack trays using modules
US5636745A (en) * 1994-10-27 1997-06-10 Illinois Tool Works Inc. Tray for a component and an apparatus for accurately placing a component within the tray
JPH08330761A (ja) * 1995-05-31 1996-12-13 Mitsumi Electric Co Ltd 機構部品の取付構造
DE19527021A1 (de) * 1995-07-24 1997-01-30 Siemens Ag Verpackung für ein elektronisches Bauelement
US5758776A (en) * 1996-09-12 1998-06-02 Kinetrix, Inc. Integrated circuit tray with flexural bearings
US5971156A (en) * 1997-09-05 1999-10-26 Kinetrix, Inc. Semiconductor chip tray with rolling contact retention mechanism
US7394658B2 (en) * 2005-09-01 2008-07-01 Harman International Industries, Incorporated Heat sink with twist lock mounting mechanism

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3417865A (en) * 1966-10-03 1968-12-24 Signetics Corp Flat package carrier block and assembly
US3529277A (en) * 1968-05-01 1970-09-15 Barnes Corp Integrated circuit carrier
US3892312A (en) * 1973-06-11 1975-07-01 Milross Controls Inc Integrated circuit carrier
US3904262A (en) * 1974-09-27 1975-09-09 John M Cutchaw Connector for leadless integrated circuit packages
US4329642A (en) * 1979-03-09 1982-05-11 Siliconix, Incorporated Carrier and test socket for leadless integrated circuit
US4323155A (en) * 1980-01-21 1982-04-06 Kling Jarrett B Integrated circuit carrier

Also Published As

Publication number Publication date
EP0087897B1 (en) 1987-04-22
DE3371158D1 (en) 1987-05-27
US4444309A (en) 1984-04-24
EP0087897A2 (en) 1983-09-07
JPS58194358A (ja) 1983-11-12
EP0087897A3 (en) 1984-01-25

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