JPH0145414B2 - - Google Patents
Info
- Publication number
- JPH0145414B2 JPH0145414B2 JP58241639A JP24163983A JPH0145414B2 JP H0145414 B2 JPH0145414 B2 JP H0145414B2 JP 58241639 A JP58241639 A JP 58241639A JP 24163983 A JP24163983 A JP 24163983A JP H0145414 B2 JPH0145414 B2 JP H0145414B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- epoxy resin
- base material
- glass cloth
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 37
- 239000004744 fabric Substances 0.000 claims description 24
- 239000003822 epoxy resin Substances 0.000 claims description 21
- 229920000647 polyepoxide Polymers 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 19
- 239000004745 nonwoven fabric Substances 0.000 claims description 11
- 239000003365 glass fiber Substances 0.000 description 12
- 238000004080 punching Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000123 paper Substances 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 239000002131 composite material Substances 0.000 description 6
- 238000003475 lamination Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000009941 weaving Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24163983A JPS60132751A (ja) | 1983-12-21 | 1983-12-21 | 積層板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24163983A JPS60132751A (ja) | 1983-12-21 | 1983-12-21 | 積層板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60132751A JPS60132751A (ja) | 1985-07-15 |
JPH0145414B2 true JPH0145414B2 (ko) | 1989-10-03 |
Family
ID=17077303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24163983A Granted JPS60132751A (ja) | 1983-12-21 | 1983-12-21 | 積層板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60132751A (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63141738A (ja) * | 1986-12-04 | 1988-06-14 | 住友ベークライト株式会社 | 熱硬化性樹脂積層板 |
JPS63312832A (ja) * | 1987-06-16 | 1988-12-21 | Toshiba Chem Corp | エポキシ樹脂銅張積層板 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS517504A (ko) * | 1974-06-10 | 1976-01-21 | Westinghouse Electric Corp | |
JPS5129911A (ja) * | 1974-09-06 | 1976-03-13 | Alps Electric Co Ltd | Jikihetsudoniokeruhoorudokeesu no seizohoho |
JPS5418885A (en) * | 1977-07-14 | 1979-02-13 | Fujitsu Ltd | Laminate sheet |
JPS5540424A (en) * | 1978-09-14 | 1980-03-21 | Canon Inc | Processor camera |
JPS57152941A (en) * | 1981-03-19 | 1982-09-21 | Shin Kobe Electric Machinery | Laminated board |
-
1983
- 1983-12-21 JP JP24163983A patent/JPS60132751A/ja active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS517504A (ko) * | 1974-06-10 | 1976-01-21 | Westinghouse Electric Corp | |
JPS5129911A (ja) * | 1974-09-06 | 1976-03-13 | Alps Electric Co Ltd | Jikihetsudoniokeruhoorudokeesu no seizohoho |
JPS5418885A (en) * | 1977-07-14 | 1979-02-13 | Fujitsu Ltd | Laminate sheet |
JPS5540424A (en) * | 1978-09-14 | 1980-03-21 | Canon Inc | Processor camera |
JPS57152941A (en) * | 1981-03-19 | 1982-09-21 | Shin Kobe Electric Machinery | Laminated board |
Also Published As
Publication number | Publication date |
---|---|
JPS60132751A (ja) | 1985-07-15 |
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