JPH0143459B2 - - Google Patents

Info

Publication number
JPH0143459B2
JPH0143459B2 JP56149438A JP14943881A JPH0143459B2 JP H0143459 B2 JPH0143459 B2 JP H0143459B2 JP 56149438 A JP56149438 A JP 56149438A JP 14943881 A JP14943881 A JP 14943881A JP H0143459 B2 JPH0143459 B2 JP H0143459B2
Authority
JP
Japan
Prior art keywords
dicing
wafer
jig
semiconductor wafer
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56149438A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5851521A (ja
Inventor
Tsutomu Mimata
Yoshuki Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56149438A priority Critical patent/JPS5851521A/ja
Publication of JPS5851521A publication Critical patent/JPS5851521A/ja
Publication of JPH0143459B2 publication Critical patent/JPH0143459B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
JP56149438A 1981-09-24 1981-09-24 半導体ウェハのダイシング方法 Granted JPS5851521A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56149438A JPS5851521A (ja) 1981-09-24 1981-09-24 半導体ウェハのダイシング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56149438A JPS5851521A (ja) 1981-09-24 1981-09-24 半導体ウェハのダイシング方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP63107646A Division JPS63288714A (ja) 1988-05-02 1988-05-02 ダイシング治具

Publications (2)

Publication Number Publication Date
JPS5851521A JPS5851521A (ja) 1983-03-26
JPH0143459B2 true JPH0143459B2 (enrdf_load_stackoverflow) 1989-09-20

Family

ID=15475111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56149438A Granted JPS5851521A (ja) 1981-09-24 1981-09-24 半導体ウェハのダイシング方法

Country Status (1)

Country Link
JP (1) JPS5851521A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59179510A (ja) * 1983-03-29 1984-10-12 Toa Nenryo Kogyo Kk エチレン共重合体の製造法
JPS60136236A (ja) * 1983-12-23 1985-07-19 Toshiba Corp ウエフア保持治具
JPH0353546A (ja) * 1989-07-21 1991-03-07 Mitsubishi Electric Corp 半導体装置の製造方法およびその製造装置
EP1073098A1 (en) * 1999-07-28 2001-01-31 Infineon Technologies AG Low stress wafer mounting assembly and method
JP2015162582A (ja) * 2014-02-27 2015-09-07 株式会社東京精密 ダイシング装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3809050A (en) * 1971-01-13 1974-05-07 Cogar Corp Mounting block for semiconductor wafers
JPS5011764A (enrdf_load_stackoverflow) * 1973-06-04 1975-02-06
JPS5811742B2 (ja) * 1974-12-28 1983-03-04 ソニー株式会社 ウエハキヨウキユウソウチ
JPS54111757A (en) * 1978-02-22 1979-09-01 Hitachi Ltd Dicing method
JPS54134973A (en) * 1978-04-12 1979-10-19 Kyushu Nippon Electric Sheet holding jig for semiconductor wafer
JPS5636149U (enrdf_load_stackoverflow) * 1979-08-28 1981-04-07

Also Published As

Publication number Publication date
JPS5851521A (ja) 1983-03-26

Similar Documents

Publication Publication Date Title
KR19990028523A (ko) 반도체웨이퍼의 보호점착테이프의 박리방법 및 그 장치
US8529314B2 (en) Method of transporting work and apparatus with work handover mechanism
US5006190A (en) Film removal method
JP2003124146A (ja) 保護シート剥離方法及び装置
US5472554A (en) Apparatus for adhering masking film
US5316853A (en) Expand tape
JP2002373870A (ja) 半導体ウエーハの加工方法
JPH0143459B2 (enrdf_load_stackoverflow)
JPH08148451A (ja) 半導体ウェーハ自動剥し装置
JP4822989B2 (ja) 基板貼合せ方法およびこれを用いた装置
JPS63288714A (ja) ダイシング治具
JPH05160102A (ja) スピンナ及びそれを用いた半導体装置の製造方法
JP2002151528A (ja) ダイボンディングシート貼着装置およびダイボンディングシートの貼着方法
JP2002064073A (ja) 半導体ウェーハ剥し装置および半導体ウェーハの製造方法
JPS61296734A (ja) ウエハテ−プマウント方法および装置
JPH10233431A (ja) ウェハマウンタおよび半導体ウェハへのテープ貼り付け方法
JPH0210727A (ja) 半導体ウエハの分割方法および装置
JP2003086540A (ja) 半導体装置の製造方法及びその製造装置
JPH0536827A (ja) ウエハステージ
JPH0888202A (ja) ダイシングテープ
JPS6325735Y2 (enrdf_load_stackoverflow)
JPS644903B2 (enrdf_load_stackoverflow)
JPS644339B2 (enrdf_load_stackoverflow)
JPS63160346A (ja) 半導体装置の製造方法
JPS59139645A (ja) ウエ−ハ支持装置