JPH0141030B2 - - Google Patents

Info

Publication number
JPH0141030B2
JPH0141030B2 JP57123547A JP12354782A JPH0141030B2 JP H0141030 B2 JPH0141030 B2 JP H0141030B2 JP 57123547 A JP57123547 A JP 57123547A JP 12354782 A JP12354782 A JP 12354782A JP H0141030 B2 JPH0141030 B2 JP H0141030B2
Authority
JP
Japan
Prior art keywords
film
leads
bonding
notch
film carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57123547A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5913338A (ja
Inventor
Ryuichi Toyoda
Takeshi Mizutani
Koichi Kawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57123547A priority Critical patent/JPS5913338A/ja
Publication of JPS5913338A publication Critical patent/JPS5913338A/ja
Publication of JPH0141030B2 publication Critical patent/JPH0141030B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP57123547A 1982-07-14 1982-07-14 電子素子の接続方法 Granted JPS5913338A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57123547A JPS5913338A (ja) 1982-07-14 1982-07-14 電子素子の接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57123547A JPS5913338A (ja) 1982-07-14 1982-07-14 電子素子の接続方法

Publications (2)

Publication Number Publication Date
JPS5913338A JPS5913338A (ja) 1984-01-24
JPH0141030B2 true JPH0141030B2 (enrdf_load_stackoverflow) 1989-09-01

Family

ID=14863296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57123547A Granted JPS5913338A (ja) 1982-07-14 1982-07-14 電子素子の接続方法

Country Status (1)

Country Link
JP (1) JPS5913338A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS5913338A (ja) 1984-01-24

Similar Documents

Publication Publication Date Title
JPH10150072A (ja) 半導体装置および半導体装置用のリードフレーム
JPH0141030B2 (enrdf_load_stackoverflow)
JP3352471B2 (ja) フィルムキャリア
JPH0126535B2 (enrdf_load_stackoverflow)
JPH06334059A (ja) 半導体搭載用基板及びその製造方法
JPS63185035A (ja) 半導体装置
JPH0350736A (ja) 半導体チップのバンプ製造方法
JP2918342B2 (ja) リードフレーム及びその製造方法
JP2636778B2 (ja) 半導体装置製造用金型
JPH0451056B2 (enrdf_load_stackoverflow)
JP2000323515A (ja) Ｉｃチップと回路基板との接続方法
JPS625652A (ja) テ−プキヤリヤ半導体実装用テ−プ
JPH0358538B2 (enrdf_load_stackoverflow)
JPH05283473A (ja) フィルムキャリア半導体装置とその製造方法
JP2806816B2 (ja) ボンディング装置およびこれを用いたボンディング方法
JP2771301B2 (ja) Ｔａｂリード型半導体装置
JPH04241447A (ja) 半導体モジュール
JPH04299544A (ja) フィルムキャリヤ半導体装置の製造方法
JP2679197B2 (ja) 樹脂封止型半導体装置
JPS5874064A (ja) リ−ドフレ−ム
JPS6396932A (ja) フイルムキヤリアのボンデイングステ−ジ
JPH01147847A (ja) 半導体装置の製造方法
JPH04154137A (ja) フィルムキャリヤーテープの製造方法
JPH04259232A (ja) 半導体チップの実装方法
JPS63283139A (ja) 半導体素子の実装方法