JPH0140096B2 - - Google Patents

Info

Publication number
JPH0140096B2
JPH0140096B2 JP60062974A JP6297485A JPH0140096B2 JP H0140096 B2 JPH0140096 B2 JP H0140096B2 JP 60062974 A JP60062974 A JP 60062974A JP 6297485 A JP6297485 A JP 6297485A JP H0140096 B2 JPH0140096 B2 JP H0140096B2
Authority
JP
Japan
Prior art keywords
copper
copper material
wire
ppm
extremely soft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60062974A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61221335A (ja
Inventor
Naoyuki Hosoda
Naoki Uchama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP60062974A priority Critical patent/JPS61221335A/ja
Priority to US06/844,350 priority patent/US4676827A/en
Priority to GB8607528A priority patent/GB2175009B/en
Priority to DE19863610587 priority patent/DE3610587A1/de
Publication of JPS61221335A publication Critical patent/JPS61221335A/ja
Priority to US07/036,249 priority patent/US4717436A/en
Priority to GB8828948A priority patent/GB2210061B/en
Publication of JPH0140096B2 publication Critical patent/JPH0140096B2/ja
Priority to SG93090A priority patent/SG93090G/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent

Landscapes

  • Manufacture And Refinement Of Metals (AREA)
JP60062974A 1985-03-27 1985-03-27 極軟質銅材の製造法 Granted JPS61221335A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP60062974A JPS61221335A (ja) 1985-03-27 1985-03-27 極軟質銅材の製造法
US06/844,350 US4676827A (en) 1985-03-27 1986-03-26 Wire for bonding a semiconductor device and process for producing the same
GB8607528A GB2175009B (en) 1985-03-27 1986-03-26 Wire for bonding a semiconductor device and process for producing the same
DE19863610587 DE3610587A1 (de) 1985-03-27 1986-03-27 Zum bonden von halbleitervorrichtungen geeigneter draht und verfahren zu dessen herstellung
US07/036,249 US4717436A (en) 1985-03-27 1987-04-09 Wire for bonding a semiconductor device
GB8828948A GB2210061B (en) 1985-03-27 1988-12-12 Wire for use in the bonding of a semiconductor device
SG93090A SG93090G (en) 1985-03-27 1990-11-17 Wire for use in the bonding of a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60062974A JPS61221335A (ja) 1985-03-27 1985-03-27 極軟質銅材の製造法

Publications (2)

Publication Number Publication Date
JPS61221335A JPS61221335A (ja) 1986-10-01
JPH0140096B2 true JPH0140096B2 (de) 1989-08-25

Family

ID=13215831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60062974A Granted JPS61221335A (ja) 1985-03-27 1985-03-27 極軟質銅材の製造法

Country Status (1)

Country Link
JP (1) JPS61221335A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127437A (ja) * 1985-11-26 1987-06-09 Tatsuta Electric Wire & Cable Co Ltd 半導体素子用ボンデイング線
JP2553082B2 (ja) * 1987-05-26 1996-11-13 日立電線株式会社 銅の精製方法
JPH01159338A (ja) * 1987-12-15 1989-06-22 Fujikura Ltd 極細線用銅線材
CN113290217B (zh) * 2021-05-28 2022-09-23 金川集团股份有限公司 高纯无氧铜杆的真空连铸工艺

Also Published As

Publication number Publication date
JPS61221335A (ja) 1986-10-01

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