SG93090G - Wire for use in the bonding of a semiconductor device - Google Patents

Wire for use in the bonding of a semiconductor device

Info

Publication number
SG93090G
SG93090G SG93090A SG93090A SG93090G SG 93090 G SG93090 G SG 93090G SG 93090 A SG93090 A SG 93090A SG 93090 A SG93090 A SG 93090A SG 93090 G SG93090 G SG 93090G
Authority
SG
Singapore
Prior art keywords
bonding
wire
semiconductor device
semiconductor
Prior art date
Application number
SG93090A
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60062974A external-priority patent/JPS61221335A/en
Priority claimed from JP60250410A external-priority patent/JPS62111455A/en
Priority claimed from JP61035627A external-priority patent/JPS62193254A/en
Priority claimed from GB8607528A external-priority patent/GB2175009B/en
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Publication of SG93090G publication Critical patent/SG93090G/en

Links

SG93090A 1985-03-27 1990-11-17 Wire for use in the bonding of a semiconductor device SG93090G (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP60062974A JPS61221335A (en) 1985-03-27 1985-03-27 Manufacture of extremely soft copper material
JP60250410A JPS62111455A (en) 1985-11-08 1985-11-08 Very thin high-purity copper wire for wire-bonding semiconductor device
JP61035627A JPS62193254A (en) 1986-02-20 1986-02-20 Cu alloy ultrafine wire for semiconductor device
GB8607528A GB2175009B (en) 1985-03-27 1986-03-26 Wire for bonding a semiconductor device and process for producing the same

Publications (1)

Publication Number Publication Date
SG93090G true SG93090G (en) 1991-01-18

Family

ID=27449750

Family Applications (1)

Application Number Title Priority Date Filing Date
SG93090A SG93090G (en) 1985-03-27 1990-11-17 Wire for use in the bonding of a semiconductor device

Country Status (1)

Country Link
SG (1) SG93090G (en)

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