JPH0136254B2 - - Google Patents

Info

Publication number
JPH0136254B2
JPH0136254B2 JP13701181A JP13701181A JPH0136254B2 JP H0136254 B2 JPH0136254 B2 JP H0136254B2 JP 13701181 A JP13701181 A JP 13701181A JP 13701181 A JP13701181 A JP 13701181A JP H0136254 B2 JPH0136254 B2 JP H0136254B2
Authority
JP
Japan
Prior art keywords
electrode
layer
connection portion
external
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13701181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5839047A (ja
Inventor
Michio Oogami
Takayuki Wakui
Komei Yatsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56137011A priority Critical patent/JPS5839047A/ja
Priority to DE8282107381T priority patent/DE3276556D1/de
Priority to EP19820107381 priority patent/EP0073383B1/en
Publication of JPS5839047A publication Critical patent/JPS5839047A/ja
Priority to US06/880,942 priority patent/US4651191A/en
Publication of JPH0136254B2 publication Critical patent/JPH0136254B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/012—
    • H10W72/07236—
    • H10W72/251—
    • H10W72/923—
    • H10W72/9445—
    • H10W72/952—

Landscapes

  • Thyristors (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP56137011A 1981-09-02 1981-09-02 半導体装置およびその製法 Granted JPS5839047A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP56137011A JPS5839047A (ja) 1981-09-02 1981-09-02 半導体装置およびその製法
DE8282107381T DE3276556D1 (en) 1981-09-02 1982-08-13 Semiconductor device having external electrodes bonded to electrodes on a semiconductor substrate and method of fabricating such a semiconductor device
EP19820107381 EP0073383B1 (en) 1981-09-02 1982-08-13 Semiconductor device having external electrodes bonded to electrodes on a semiconductor substrate and method of fabricating such a semiconductor device
US06/880,942 US4651191A (en) 1981-09-02 1986-06-25 Semiconductor device and fabrication method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56137011A JPS5839047A (ja) 1981-09-02 1981-09-02 半導体装置およびその製法

Publications (2)

Publication Number Publication Date
JPS5839047A JPS5839047A (ja) 1983-03-07
JPH0136254B2 true JPH0136254B2 (cg-RX-API-DMAC10.html) 1989-07-31

Family

ID=15188722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56137011A Granted JPS5839047A (ja) 1981-09-02 1981-09-02 半導体装置およびその製法

Country Status (4)

Country Link
US (1) US4651191A (cg-RX-API-DMAC10.html)
EP (1) EP0073383B1 (cg-RX-API-DMAC10.html)
JP (1) JPS5839047A (cg-RX-API-DMAC10.html)
DE (1) DE3276556D1 (cg-RX-API-DMAC10.html)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3523808C3 (de) 1984-07-03 1995-05-04 Hitachi Ltd Verfahren zum Löten von Teilen einer elektronischen Anordnung aus unterschiedlichen Werkstoffen und dessen Verwendung
US4786962A (en) * 1986-06-06 1988-11-22 Hewlett-Packard Company Process for fabricating multilevel metal integrated circuits and structures produced thereby
DE3781861T2 (de) * 1986-10-27 1993-04-01 Electric Power Res Inst Herstellung einer mehrschichtigen leistungshalbleiterschaltung mit mehrfachen parallelen kontaktfingern.
DE68910015T2 (de) * 1988-06-17 1994-05-05 Ngk Insulators Ltd Struktur mit detailliertem Muster und Herstellungsverfahren.
US4935627A (en) * 1989-03-13 1990-06-19 Honeywell Inc. Electrical interconnection apparatus for achieving precise alignment of hybrid components
US5175609A (en) * 1991-04-10 1992-12-29 International Business Machines Corporation Structure and method for corrosion and stress-resistant interconnecting metallurgy
US5266522A (en) * 1991-04-10 1993-11-30 International Business Machines Corporation Structure and method for corrosion and stress-resistant interconnecting metallurgy
JPH0547812A (ja) * 1991-08-19 1993-02-26 Mitsubishi Electric Corp 半導体装置
JP3141364B2 (ja) * 1992-05-06 2001-03-05 住友電気工業株式会社 半導体チップ
JP3054021B2 (ja) * 1993-12-27 2000-06-19 株式会社東芝 化合物半導体装置
US6361959B1 (en) 1994-07-07 2002-03-26 Tessera, Inc. Microelectronic unit forming methods and materials
US6117694A (en) * 1994-07-07 2000-09-12 Tessera, Inc. Flexible lead structures and methods of making same
US6828668B2 (en) * 1994-07-07 2004-12-07 Tessera, Inc. Flexible lead structures and methods of making same
FI98899C (fi) * 1994-10-28 1997-09-10 Jorma Kalevi Kivilahti Menetelmä elektroniikan komponenttien liittämiseksi juottamalla
DE19524739A1 (de) * 1994-11-17 1996-05-23 Fraunhofer Ges Forschung Kernmetall-Lothöcker für die Flip-Chip-Technik
US5763941A (en) * 1995-10-24 1998-06-09 Tessera, Inc. Connection component with releasable leads
US6261863B1 (en) 1995-10-24 2001-07-17 Tessera, Inc. Components with releasable leads and methods of making releasable leads
US6025649A (en) * 1997-07-22 2000-02-15 International Business Machines Corporation Pb-In-Sn tall C-4 for fatigue enhancement
WO2000057472A1 (de) * 1999-03-24 2000-09-28 Infineon Technologies Ag Verfahren zum verbinden eines anschlussdrahtes mit einem anschlusskontakt eines integrierten schaltkreises
JP4293500B2 (ja) * 2001-05-07 2009-07-08 第一電子工業株式会社 電子部品の製造方法
JP2003303842A (ja) * 2002-04-12 2003-10-24 Nec Electronics Corp 半導体装置およびその製造方法
KR100568496B1 (ko) * 2004-10-21 2006-04-07 삼성전자주식회사 주석-인듐 합금층을 갖는 필름 회로 기판
WO2009133625A1 (ja) * 2008-05-02 2009-11-05 富士通株式会社 配線基板およびその製造方法、電子装置の製造方法
US11088308B2 (en) * 2019-02-25 2021-08-10 Tdk Corporation Junction structure

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3401055A (en) * 1964-12-31 1968-09-10 Ibm Vapor depositing solder
US3436818A (en) * 1965-12-13 1969-04-08 Ibm Method of fabricating a bonded joint
US3839727A (en) * 1973-06-25 1974-10-01 Ibm Semiconductor chip to substrate solder bond using a locally dispersed, ternary intermetallic compound
CA1122856A (en) * 1978-09-20 1982-05-04 Nicholas G. Koopman Process for in-situ modification of solder composition

Also Published As

Publication number Publication date
DE3276556D1 (en) 1987-07-16
US4651191A (en) 1987-03-17
EP0073383A2 (en) 1983-03-09
JPS5839047A (ja) 1983-03-07
EP0073383B1 (en) 1987-06-10
EP0073383A3 (en) 1984-08-08

Similar Documents

Publication Publication Date Title
JPH0136254B2 (cg-RX-API-DMAC10.html)
JP3271475B2 (ja) 電気素子の接合材料および接合方法
EP0097833B1 (en) Substrate for integrated circuit packages
US20110067908A1 (en) Method for producing a printed circuit board and use and printed circuit board
JP4136845B2 (ja) 半導体モジュールの製造方法
JPH0365897B2 (cg-RX-API-DMAC10.html)
JPH0936186A (ja) パワー半導体モジュール及びその実装方法
JP2979086B2 (ja) 金属ラミネートおよびそれを用いた熱圧着電子パワーチップ構造
EP1734569B1 (en) Process for producing semiconductor module
JPH0867978A (ja) スパッタリング用ターゲットのはんだ付け方法
JP2001237267A (ja) 半導体装置
US4921158A (en) Brazing material
JP6156693B2 (ja) 半導体装置の製造方法
JPS61181136A (ja) ダイボンデイング方法
JP2846181B2 (ja) 複合リードフレームの製造方法
JP3284034B2 (ja) 半導体装置およびその製造方法
JP2970568B2 (ja) 複合リードフレームの製造方法
JPH07106489A (ja) 半導体装置およびその製造方法
JPS6117394A (ja) 接合材料の製造方法
JPH0595075A (ja) 半導体装置
JPS5811097B2 (ja) ハンドウタイソウチ
JPH05347329A (ja) 半導体装置
JPH11330145A (ja) フレキシブル配線基板上に部材を接合する方法
JPS6342407B2 (cg-RX-API-DMAC10.html)
JPH0734448B2 (ja) 半導体装置の実装方法