JPH0131296B2 - - Google Patents
Info
- Publication number
- JPH0131296B2 JPH0131296B2 JP56031619A JP3161981A JPH0131296B2 JP H0131296 B2 JPH0131296 B2 JP H0131296B2 JP 56031619 A JP56031619 A JP 56031619A JP 3161981 A JP3161981 A JP 3161981A JP H0131296 B2 JPH0131296 B2 JP H0131296B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- board
- substrate
- positioning table
- bonding tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P72/53—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56031619A JPS57147245A (en) | 1981-03-05 | 1981-03-05 | Positioning method and device for chip bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56031619A JPS57147245A (en) | 1981-03-05 | 1981-03-05 | Positioning method and device for chip bonding |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26044988A Division JPH02249242A (ja) | 1988-10-18 | 1988-10-18 | チツプボンデイングの位置合せ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57147245A JPS57147245A (en) | 1982-09-11 |
| JPH0131296B2 true JPH0131296B2 (show.php) | 1989-06-26 |
Family
ID=12336224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56031619A Granted JPS57147245A (en) | 1981-03-05 | 1981-03-05 | Positioning method and device for chip bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57147245A (show.php) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121733A (ja) * | 1984-07-31 | 1985-06-29 | Shinkawa Ltd | インナ−リ−ドボンダ− |
| JPS6169139A (ja) * | 1984-09-13 | 1986-04-09 | Toshiba Seiki Kk | ペレツトボンデイング装置における認識装置 |
| JP2651519B2 (ja) * | 1987-01-20 | 1997-09-10 | セイコー電子工業株式会社 | Ｉｃのマウント装置 |
| JP4593429B2 (ja) * | 2005-10-04 | 2010-12-08 | キヤノンマシナリー株式会社 | ダイボンダ |
| DE112015006707B4 (de) * | 2015-07-15 | 2024-03-21 | Yamaha Hatsudoki Kabushiki Kaisha | Verfahren zum Erzeugen von Modelldaten |
-
1981
- 1981-03-05 JP JP56031619A patent/JPS57147245A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57147245A (en) | 1982-09-11 |
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