JPH0127982B2 - - Google Patents
Info
- Publication number
- JPH0127982B2 JPH0127982B2 JP59052822A JP5282284A JPH0127982B2 JP H0127982 B2 JPH0127982 B2 JP H0127982B2 JP 59052822 A JP59052822 A JP 59052822A JP 5282284 A JP5282284 A JP 5282284A JP H0127982 B2 JPH0127982 B2 JP H0127982B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- melting point
- low melting
- zirconium silicate
- point glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W76/60—
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
- C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
-
- H10W70/682—
-
- H10W90/756—
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59052822A JPS60204637A (ja) | 1984-03-19 | 1984-03-19 | 低融点封着用組成物 |
| US06/713,000 US4621064A (en) | 1984-03-19 | 1985-03-18 | Low temperature sealing composition with synthetic zircon |
| DE19853509955 DE3509955A1 (de) | 1984-03-19 | 1985-03-19 | Niedrigtemperatur-abdichtungszusammensetzung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59052822A JPS60204637A (ja) | 1984-03-19 | 1984-03-19 | 低融点封着用組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60204637A JPS60204637A (ja) | 1985-10-16 |
| JPH0127982B2 true JPH0127982B2 (index.php) | 1989-05-31 |
Family
ID=12925539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59052822A Granted JPS60204637A (ja) | 1984-03-19 | 1984-03-19 | 低融点封着用組成物 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4621064A (index.php) |
| JP (1) | JPS60204637A (index.php) |
| DE (1) | DE3509955A1 (index.php) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4906311A (en) * | 1985-09-24 | 1990-03-06 | John Fluke Co., Inc. | Method of making a hermetically sealed electronic component |
| US4725480A (en) * | 1985-09-24 | 1988-02-16 | John Fluke Mfg. Co., Inc. | Hermetically sealed electronic component |
| USRE33859E (en) * | 1985-09-24 | 1992-03-24 | John Fluke Mfg. Co., Inc. | Hermetically sealed electronic component |
| JPS62191442A (ja) * | 1986-02-17 | 1987-08-21 | Nippon Electric Glass Co Ltd | 低融点封着用組成物 |
| US4696909A (en) * | 1986-04-07 | 1987-09-29 | Owens-Illinois Television Products Inc. | Platinum corrosion reducing premelted oxide compositions for lead containing solder glasses |
| US4883777A (en) * | 1988-04-07 | 1989-11-28 | Nippon Electric Glass Company, Limited | Sealing glass composition with filler containing Fe and W partially substituted for Ti in PbTiO3 filler |
| US5034358A (en) * | 1989-05-05 | 1991-07-23 | Kaman Sciences Corporation | Ceramic material and method for producing the same |
| US5510300A (en) * | 1992-12-16 | 1996-04-23 | Samsung Corning Co., Ltd. | Sealing glass compositions using ceramic composite filler |
| JPH08139230A (ja) * | 1994-11-11 | 1996-05-31 | Sumitomo Kinzoku Ceramics:Kk | セラミック回路基板とその製造方法 |
| KR970011336B1 (ko) * | 1995-03-31 | 1997-07-09 | 삼성코닝 주식회사 | 접착용 유리조성물 |
| JP3273773B2 (ja) * | 1999-08-12 | 2002-04-15 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ、半導体製造・検査装置用静電チャックおよびウエハプローバ用チャックトップ |
| US6815646B2 (en) | 2000-07-25 | 2004-11-09 | Ibiden Co., Ltd. | Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clampless holder, and substrate for wafer prober |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3119661A (en) * | 1959-06-18 | 1964-01-28 | Nat Distillers Chem Corp | Method for recovery of sio2 and zro2 from zircon |
| US3963505A (en) * | 1973-11-23 | 1976-06-15 | Technology Glass Corporation | Lead-zinc-boron sealing glass compositions |
| US3954486A (en) * | 1974-07-30 | 1976-05-04 | Owens-Illinois, Inc. | Solder glass with refractory filler |
| DE2554651C2 (de) * | 1975-12-05 | 1983-07-14 | Dynamit Nobel Ag, 5210 Troisdorf | Verfahren zum Abtrennen radioaktiver Verunreinigungen aus Baddeleyit |
| US4421947A (en) * | 1977-10-11 | 1983-12-20 | James C. Kyle | Polycrystalline insulating material seals between spaced members such as a terminal pin and a ferrule |
| JPS5510426A (en) * | 1978-07-07 | 1980-01-24 | Asahi Glass Co Ltd | Sealing glass composition |
| JPS5591145A (en) * | 1978-12-28 | 1980-07-10 | Narumi China Corp | Production of ceramic package |
| US4405722A (en) * | 1979-01-23 | 1983-09-20 | Asahi Glass Company Ltd. | Sealing glass compositions |
| US4256463A (en) * | 1979-03-12 | 1981-03-17 | Teledyne Industries, Inc. | Preparation of zirconium oxychloride |
| JPS5649861A (en) * | 1979-09-29 | 1981-05-06 | Matsushita Electric Industrial Co Ltd | Capacity controller for air conditioner |
| JPS56114364A (en) * | 1980-02-13 | 1981-09-08 | Nippon Electric Glass Co Ltd | Composite for covering semiconductor device |
| US4365021A (en) * | 1981-07-22 | 1982-12-21 | Owens-Illinois, Inc. | Low temperature sealant glass |
| US4528212A (en) * | 1982-07-22 | 1985-07-09 | International Business Machines Corporation | Coated ceramic substrates for mounting integrated circuits |
| FR2533907B1 (fr) * | 1982-10-04 | 1985-06-28 | Pechiney Ugine Kuhlmann Uran | Procede de purification de solutions aqueuses uraniferes contenant du zirconium et/ou du hafnium entre autres impuretes |
| US4537863A (en) * | 1983-08-10 | 1985-08-27 | Nippon Electric Glass Company, Ltd. | Low temperature sealing composition |
| JPS6146421A (ja) * | 1984-08-10 | 1986-03-06 | Mitsubishi Motors Corp | エンジン |
-
1984
- 1984-03-19 JP JP59052822A patent/JPS60204637A/ja active Granted
-
1985
- 1985-03-18 US US06/713,000 patent/US4621064A/en not_active Expired - Lifetime
- 1985-03-19 DE DE19853509955 patent/DE3509955A1/de active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| US4621064A (en) | 1986-11-04 |
| JPS60204637A (ja) | 1985-10-16 |
| DE3509955A1 (de) | 1985-09-19 |
| DE3509955C2 (index.php) | 1993-05-13 |
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