JPH0126108Y2 - - Google Patents
Info
- Publication number
- JPH0126108Y2 JPH0126108Y2 JP1982009293U JP929382U JPH0126108Y2 JP H0126108 Y2 JPH0126108 Y2 JP H0126108Y2 JP 1982009293 U JP1982009293 U JP 1982009293U JP 929382 U JP929382 U JP 929382U JP H0126108 Y2 JPH0126108 Y2 JP H0126108Y2
- Authority
- JP
- Japan
- Prior art keywords
- die bond
- integrated circuit
- bond land
- chip
- circuit component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP929382U JPS58111966U (ja) | 1982-01-25 | 1982-01-25 | 集積回路部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP929382U JPS58111966U (ja) | 1982-01-25 | 1982-01-25 | 集積回路部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58111966U JPS58111966U (ja) | 1983-07-30 |
| JPH0126108Y2 true JPH0126108Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-08-04 |
Family
ID=30021946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP929382U Granted JPS58111966U (ja) | 1982-01-25 | 1982-01-25 | 集積回路部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58111966U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5210678A (en) * | 1975-07-15 | 1977-01-27 | Kyocera Corp | Ic package |
| JPS55162252A (en) * | 1979-06-05 | 1980-12-17 | Nec Corp | Semiconductor device |
-
1982
- 1982-01-25 JP JP929382U patent/JPS58111966U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58111966U (ja) | 1983-07-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS594873B2 (ja) | 印刷配線板 | |
| JPH022842U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPS63206166A (ja) | 大電力パワ−モジユ−ル | |
| JPH0126108Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPH0617239U (ja) | ハイブリッドic用集合基板 | |
| JPS60160641A (ja) | リ−ドレスパツケ−ジicの基板実装方法 | |
| JPS59175150A (ja) | 電子部品の取付構造 | |
| JP3259217B2 (ja) | ノイズ低減パッケージ | |
| JPH0119395Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPS6073269U (ja) | 電子部品実装構造 | |
| JPS5980957A (ja) | 半導体装置 | |
| JPS59132661U (ja) | 混成集積回路用絶縁基板 | |
| JPS6334997A (ja) | 外部取出し端子パタ−ン | |
| JP2571902Y2 (ja) | 電子部品の実装構造 | |
| JP2502994Y2 (ja) | 半導体集積回路装置 | |
| JPH06350025A (ja) | 半導体装置 | |
| JPH019160Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPS6190203U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPH04303989A (ja) | 厚膜回路基板 | |
| JPS5842961U (ja) | セラミツク配線基板 | |
| JPH0382134A (ja) | 半導体素子の実装構造 | |
| JPS5846473U (ja) | 印刷配線パタ−ン | |
| JPS6146769U (ja) | 電子回路形成チツプ搭載装置 | |
| JPS62264632A (ja) | 半導体装置 | |
| JP2002110891A (ja) | 電子回路ユニット |