JPS55162252A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55162252A
JPS55162252A JP7034579A JP7034579A JPS55162252A JP S55162252 A JPS55162252 A JP S55162252A JP 7034579 A JP7034579 A JP 7034579A JP 7034579 A JP7034579 A JP 7034579A JP S55162252 A JPS55162252 A JP S55162252A
Authority
JP
Japan
Prior art keywords
semiconductor element
lead
resin body
sides
bevel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7034579A
Other languages
Japanese (ja)
Other versions
JPS6227548B2 (en
Inventor
Koichi Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7034579A priority Critical patent/JPS55162252A/en
Publication of JPS55162252A publication Critical patent/JPS55162252A/en
Publication of JPS6227548B2 publication Critical patent/JPS6227548B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent resin from cracking by the method wherein, the end parts of each side of the main four sides of a resin body sealing a semiconductor element, at least one place is beveled, and at least one lead for supporting the element fixing surface is taken out therefrom. CONSTITUTION:Semiconductor element 3 is mounted on semiconductor element fastening unit 1. These are surrounded by a resin body having radial leads. Next, semiconductor element fastening unit supporting lead 2a is pulled out from the end of each side of the four sides of fastening unit 1 and this is fixed to frame 8 placed outside of the resin body. At this time, at least one place of the ends of each side of the four sides is provided with bevel 7, from which at least one lead 2a is pulled out. In this structure, length l1 of the corner bevel is made larger than width l2 taken by the surface bevel, and thereby the strain applied on the resin body at the time of cutting lead 2a for shaping the product is made even and thereby the occurrence of cracks is prevented.
JP7034579A 1979-06-05 1979-06-05 Semiconductor device Granted JPS55162252A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7034579A JPS55162252A (en) 1979-06-05 1979-06-05 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7034579A JPS55162252A (en) 1979-06-05 1979-06-05 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55162252A true JPS55162252A (en) 1980-12-17
JPS6227548B2 JPS6227548B2 (en) 1987-06-15

Family

ID=13428731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7034579A Granted JPS55162252A (en) 1979-06-05 1979-06-05 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55162252A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861654A (en) * 1981-10-09 1983-04-12 Toshiba Corp Semiconductor device
JPS58111966U (en) * 1982-01-25 1983-07-30 松下電器産業株式会社 integrated circuit components
US7989933B1 (en) * 2008-10-06 2011-08-02 Amkor Technology, Inc. Increased I/O leadframe and semiconductor device including same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS505329U (en) * 1973-05-16 1975-01-21
JPS5116698U (en) * 1974-07-24 1976-02-06
JPS52106674A (en) * 1976-03-05 1977-09-07 Hitachi Ltd Semiconductor device
JPS54180668U (en) * 1978-06-09 1979-12-20

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS505329U (en) * 1973-05-16 1975-01-21
JPS5116698U (en) * 1974-07-24 1976-02-06
JPS52106674A (en) * 1976-03-05 1977-09-07 Hitachi Ltd Semiconductor device
JPS54180668U (en) * 1978-06-09 1979-12-20

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861654A (en) * 1981-10-09 1983-04-12 Toshiba Corp Semiconductor device
JPH0159741B2 (en) * 1981-10-09 1989-12-19 Tokyo Shibaura Electric Co
JPS58111966U (en) * 1982-01-25 1983-07-30 松下電器産業株式会社 integrated circuit components
JPH0126108Y2 (en) * 1982-01-25 1989-08-04
US7989933B1 (en) * 2008-10-06 2011-08-02 Amkor Technology, Inc. Increased I/O leadframe and semiconductor device including same

Also Published As

Publication number Publication date
JPS6227548B2 (en) 1987-06-15

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