JPH0123540B2 - - Google Patents

Info

Publication number
JPH0123540B2
JPH0123540B2 JP22565386A JP22565386A JPH0123540B2 JP H0123540 B2 JPH0123540 B2 JP H0123540B2 JP 22565386 A JP22565386 A JP 22565386A JP 22565386 A JP22565386 A JP 22565386A JP H0123540 B2 JPH0123540 B2 JP H0123540B2
Authority
JP
Japan
Prior art keywords
bonding
copper
wire
purity
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22565386A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6379926A (ja
Inventor
Akito Kurosaka
Haruo Tominaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Cable Works Ltd
Original Assignee
Fujikura Cable Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Cable Works Ltd filed Critical Fujikura Cable Works Ltd
Priority to JP61225653A priority Critical patent/JPS6379926A/ja
Publication of JPS6379926A publication Critical patent/JPS6379926A/ja
Publication of JPH0123540B2 publication Critical patent/JPH0123540B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/015—
    • H10W72/01515—
    • H10W72/01551—
    • H10W72/01565—
    • H10W72/07533—
    • H10W72/50—
    • H10W72/522—
    • H10W72/551—
    • H10W72/5522—
    • H10W72/5525—
    • H10W72/555—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP61225653A 1986-09-24 1986-09-24 ボンデイングワイヤ Granted JPS6379926A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61225653A JPS6379926A (ja) 1986-09-24 1986-09-24 ボンデイングワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61225653A JPS6379926A (ja) 1986-09-24 1986-09-24 ボンデイングワイヤ

Publications (2)

Publication Number Publication Date
JPS6379926A JPS6379926A (ja) 1988-04-09
JPH0123540B2 true JPH0123540B2 (esLanguage) 1989-05-02

Family

ID=16832663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61225653A Granted JPS6379926A (ja) 1986-09-24 1986-09-24 ボンデイングワイヤ

Country Status (1)

Country Link
JP (1) JPS6379926A (esLanguage)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2766933B2 (ja) * 1989-06-29 1998-06-18 株式会社日立製作所 電子装置
JP3636815B2 (ja) * 1996-05-15 2005-04-06 松下電器産業株式会社 リフロー式半田付け装置
JP2004064033A (ja) * 2001-10-23 2004-02-26 Sumitomo Electric Wintec Inc ボンディングワイヤー
JP4672373B2 (ja) * 2005-01-05 2011-04-20 新日鉄マテリアルズ株式会社 半導体装置用ボンディングワイヤ
JP2007012776A (ja) * 2005-06-29 2007-01-18 Nippon Steel Materials Co Ltd 半導体装置用ボンディングワイヤ
JP2006216929A (ja) * 2005-01-05 2006-08-17 Nippon Steel Corp 半導体装置用ボンディングワイヤ
JP5393614B2 (ja) * 2010-08-03 2014-01-22 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ

Also Published As

Publication number Publication date
JPS6379926A (ja) 1988-04-09

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