JPH0122981B2 - - Google Patents

Info

Publication number
JPH0122981B2
JPH0122981B2 JP56130476A JP13047681A JPH0122981B2 JP H0122981 B2 JPH0122981 B2 JP H0122981B2 JP 56130476 A JP56130476 A JP 56130476A JP 13047681 A JP13047681 A JP 13047681A JP H0122981 B2 JPH0122981 B2 JP H0122981B2
Authority
JP
Japan
Prior art keywords
pellet
lead frame
disk
pellets
pellet mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56130476A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5831543A (ja
Inventor
Naomichi Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
Original Assignee
NEC Home Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd filed Critical NEC Home Electronics Ltd
Priority to JP56130476A priority Critical patent/JPS5831543A/ja
Publication of JPS5831543A publication Critical patent/JPS5831543A/ja
Publication of JPH0122981B2 publication Critical patent/JPH0122981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/417—
    • H10W72/0711—
    • H10W72/01515—
    • H10W72/0198—
    • H10W72/073—
    • H10W72/07353—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/334—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/884—
    • H10W72/931—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
JP56130476A 1981-08-19 1981-08-19 半導体装置の製造方法 Granted JPS5831543A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56130476A JPS5831543A (ja) 1981-08-19 1981-08-19 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56130476A JPS5831543A (ja) 1981-08-19 1981-08-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5831543A JPS5831543A (ja) 1983-02-24
JPH0122981B2 true JPH0122981B2 (cg-RX-API-DMAC10.html) 1989-04-28

Family

ID=15035155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56130476A Granted JPS5831543A (ja) 1981-08-19 1981-08-19 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5831543A (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184027A (ja) * 1984-10-01 1986-04-28 Mitsubishi Electric Corp 半導体装置の組立方法
JPH0514200Y2 (cg-RX-API-DMAC10.html) * 1986-11-18 1993-04-15
JPS63159740A (ja) * 1986-12-23 1988-07-02 Kawasaki Steel Corp レ−ザフラツシユ法熱定数測定装置
JPS6413723U (cg-RX-API-DMAC10.html) * 1987-07-15 1989-01-24
JPH01161141A (ja) * 1987-12-16 1989-06-23 Sanki Eng Kk 熱定数測定装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5932059B2 (ja) * 1979-06-28 1984-08-06 三菱電機株式会社 ボンデイングヘツド

Also Published As

Publication number Publication date
JPS5831543A (ja) 1983-02-24

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