JPS5831543A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5831543A
JPS5831543A JP56130476A JP13047681A JPS5831543A JP S5831543 A JPS5831543 A JP S5831543A JP 56130476 A JP56130476 A JP 56130476A JP 13047681 A JP13047681 A JP 13047681A JP S5831543 A JPS5831543 A JP S5831543A
Authority
JP
Japan
Prior art keywords
disc
pellet
supplied
lead frame
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56130476A
Other languages
English (en)
Other versions
JPH0122981B2 (ja
Inventor
Naomichi Ito
伊藤　尚道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP56130476A priority Critical patent/JPS5831543A/ja
Publication of JPS5831543A publication Critical patent/JPS5831543A/ja
Publication of JPH0122981B2 publication Critical patent/JPH0122981B2/ja
Granted legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
    • H—ELECTRICITY
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    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 この発明社生産性の向上を目的とし良マルチペレットマ
クント方式の＋ｓ体装置の製造方法ＫＭするものＣある
。
一般に、）ッンジスタ中ＺＣなどの樹脂封止掴牛導体装
皺の親造工程に紘ペレットマクント工程やワイヤボンデ
ィング工程、樹脂モールド工程などかあシ、これら各工
程には量産性１図る目的で複数のリードと被ペレットマ
クント基板【一連に一体化したり−＃：７レームが用い
られる・例えばトランジスタの楊合Ｆｉ第１図及び第２
図に示すようなリードフレーム（１）管用いて次の要領
τ１１１１ｉＩｉされている。但し、リードフレーム＋
１１　Ｋおゆる（２）はＩＩ数のリード、（１）はＦｉ
ｒ定のリード（り　＋１１・・・Ｋかしめ蝮の手段て一
体化されたＩＩ鈑の一達に並ぶ被ベレットマクント基板
で例えば放熱板、（４ｉｔｉｌｌ！数のリード（！ｊ（
幻・・・を連結して一体化すゐタイバ一部である。
まずリード７し一ム（１）を水平に保持して長平方向に
放熱＆（１）の配列ピッチ毎に関歇送シして各放熱板１
１１（：１１−・・七半田供給ポジションとペレット！
クントボジシ曹ンに７枚ずっ賑＠に送シ込む、そして、
７枚の放熱板（ｓ）が半田＆組ボジシ冒ンにくるとこの
放熱板（３）上に定ｉの牛Ｈ１Ｉｊを供給し、次のベレ
ットマクントボジシ璽ンにくると先に供給されて溶融し
た半田１６１上に’Ｐ導体ペレットｃ以下単にペレット
と称す）（ａｌｌ供給してペレットマクントを行う。こ
のように７個ずつのベレットマクントが完了する２１次
はリートッＬ’　−Ａ　（ＩＩ　ｔ　ｌ！１じ姿勢でワ
イヤポンディングポジシロンに聞歇送シして、各ペレッ
ト（８）（６）・・・と対応するリード＋２１　（２１
・・・とに金線等のツイヤ１７）　（７１・・・ｔｍ番
にポンディングすゐ、そして、全てのツイヤ−インディ
ングが完了しぇリードフレームｉｌｌ　ｔ−金型内にセ
ットしてＩｌ！数の要所に外装樹脂材＋８１　＋８１・
・・【一括してモールド成形し、最後に金温からリード
フレーム（ｌｉｔ−取出してリード７レー五〇）のタイ
／（一部（４）を一括し？１ｌｌｌ絵宍して個々に分割
されたｗＩ数の牛導体装置ｌｔ得る。
七ζろて、上記のベレットマクント工程は外部で位置決
めされ九ベレッ）　＋８１を真空吸着プレットなどで取
出して、定ボジシ四ンに送）込まれ九放熱板（３）の定
位１１に供給する動作’に／枚のり一ド７レーム＋１１
に対して複数回繰）返して行う必髪がある丸め、ペレッ
トマクントエ穆のインデックスが農＜、全体の生産性の
改善が麺しかつ良、また、マクシト時のベレット位置ズ
レなどがありて放熱板（ＩＩＪ上にベレン）　（ｉｌｉ
ｌ　ｔ−正確に位置決め固定することが難しく、その丸
め次のワイヤボンディング工程がｍａ化する傾向にあり
、尚更に生産性の改伽が離しかった。
本発明はかかる向融点に鑑みてなされたもので、特にベ
レットマクントエ＆Ｉｔリードフレームの単位で被数部
所一括して行うマルチ方式の製造方法ｔ−開発し、提供
する。以下、本発明を図面ｔ−劇照して説明す石。
例えば、本発明を上記リードフレーム（１１を用いえ牛
導体装置の製造に適用して説明すると。
本尭制の特徴はり一ド７レーム１１１に対応して第３図
及び第１図に示すようなＷｊ根板状金属線ディスク（９
）を用いてペレットマクント工程及びそれ以降の各１程
を行うむとであゐ。このディスク（９）はクロム銅や鉄
−ニッケル合金などの金−薄板て、リードフレームｉｌ
＋の長さとほぼ同じ長さ含有し、オ九輪れペレットｉ６
１の一辺の長さよ抄少し大きい程度ＫＷｋ！１れる。更
にディスク（８１Ｋ　＃ｉリートｙｖ−Ａ（１１０Ｉ！
数の放熱板（ｍｌ　（＄１−−−の被ベレットマクント
箇所に対応すＪ＋複数の部所に表面から裏面にかけてプ
レス加工しぇ凹部−−・・・が形成されゐ、この凹ｓ町
ａ−−−の底１１ａペレットナイズとほぼ一致する矩形
【有しｔ六、凹部顛）鴎・・・の内側面は底ｍｙｂ−ら
外方に向かうチー２１１！面に形成される。を良凹鄭−
−・・・Ｏ鷹面會ての隷さ紘ベレット（６）の高さく厚
み）よシ若干小さ目に設けられゐ。
次に上記リードアレー＾ｔｌＪとディスク（旬【用い大
ペレットマクント工程を第５図を参照して説明すり。ま
ずディスク（−）の各凹部−一・・・Ｏ鷹向に定量の半
田０す０υ・・・を一括供給すゐ（第５図「））・この
牛用供給は、例えばＩｔ図に示すように凹鄭鍮関・・・
七同じ配列ピッチて並ぶ複・敵本一体の真空吸着ペン輌
＃喝・・・の各々の下端で定量の半田片（ｉｌｒｔｌｌ
）’・・・ｔ＠着して凹ｓ　−（１１）・・・Ｋ供給す
るようにすればよい・を九この時のディスク（釦は加熱
台軸上に塔載して加熱しておき、半田片（１１）’（Ｉ
ｔ）’・・・が供給されるとこれｔ−加熱して凹５１１
０１４１０！・・・の底面上て溶融させゐ。次にディス
クｔｓ＋　ｔ　ｍ方向に／ピッチ移動させて、各凹Ｓ−
一・・・にベレットＩｌｌ　１ｍ＋・・・を一括供給し
て半田付線する（第Ｊ図１））。このベレット供給も前
述ａｋ８３供給七同じように被数本一体の真空吸着ペン
（図示せず）會使って行えによい、を喪、このベレット
供給用真空吸着ペンは例えば接着シート上に互いに離隔
させて接着して格子状に配列し九ペレツ）　（＠ｌ　１
１１・・・ｔ−複数個一括緩着して接着シートから取出
してディスク（９）へ供給すゐものや、平板状のトレー
上に一足の同熱て位ｗ１訣め載諏され良麹微のベレツ）
　（＠＋（６）・・・ｔ−複数餉一括吸着して、′トレ
ーから取出してディスク園へ供給す為ものが用いられゐ
。
１１こＯディスク（・）へのベレット供給に除し第２図
ａＳＳで示すようＫ［！！］部−に対してベレット（−
）が位置ズレ【起していても、このベレット（・）れ凹
部−のテーバ内側面ｋｔｆイドされて自ずと位置決めさ
れて半田付けされゐ０首六、ζのペレット半田付けの時
、ペレッ）　（Ｉ）　Ｋ真空吸着ノズルて微振動管与え
為等の工夫ｔ″ｔｔ＋ばよ拳蓚実な半田付け、及び位置
決めが行える。
一方、第５図の（ハ）に示すようにリード７レー＾（ｉ
ｃｅ各放熱＆　（１１１３１・・・の被ベレットマクン
ト位館上Ｋｌｌ電性ａ！着材、例えば銀ペース）０３）
輪・・・を定蓋ずク一括供給して付着させる。このｌｊ
４へ、−ス）軸輪・・・の供給は振敞本のノズル【用い
大技用法中、Ｉｌｌ敵の透孔【有す為ｉスタ會用いえド
クターグレード法などで行えばよい。
向して、第５図に）Ｋ示すようにリードフレーム（１３
の各放熱板（副＋３１−・・の銀ペースト１輌・・・上
にディｌｌ偵）の各０凹部（ｌＤｌＯｊ））・・・の表
面【押し尚てて銀ペースト輪部・・・を等厚に拡げディ
スク神＋１位１１訣め錠着する・そして、全体！加熱炉
に送ってａｐｔｕ鳳）の融点よ）低い温度（ＪＪＯ”Ｃ
程度）τ熱処理して一ペース）ＯＩＱＩ・１會加熱乾燥
させて、リードフレームｌｌ）　Ｋディスク挿１ｔ−一
体Ｋｉ！Ｉｌ定化す為。
このようにリードフレーム（１１の各放熱＆　１！１　
（Ｉｌｌ＋０１　＋６）・・・ｔ−ａ定してペレットマ
クントが斃了すると、次に全体をワイヤボンディングボ
ジシ肩ンに送って第１図に示すように各ペレッ）　（４
１（＠１・・・の表面電極と対応す為リード（！＋　（
！ｌ・・・にワイヤ輪輌・・・をボンディングする。こ
のワイヤｄンデイングｈａ数本のボンディングツール（
図示せず）を用意して複Ｗｋ論新同時に行うこｔも可能
だが、最近のボンディング速度ｖ′ｉ６ｍ　化によル、
／零のボンディングツールで彼Ｗｋｆ１１所【順次に行
っても時間的に大Ｉｌ！鉱ない０次にリードフレーム（
１）にディスク（Ｉ）【一定し九まま樹脂モールＦＦＲ
形石金型【用いて、第７図に示すようＫｌｌ数の要所に
外装樹脂材Ｑｌ＆Ｉ〜・・・ｔそ一ルドすゐ、そして、
リードフレーム（１）のタイーー鄭（４）ｔ−切断すゐ
時に外装置１脂材鵠修匈・・・の髄面に沿ってカッター
１入れてディスク（ｓｌ　ＯＩＩ　ｆｆ１部分を切断す
れば、１１０図に示す牛導体蝕皺がＩＩＩ数個一括して
得られ為。
尚、上記ディスク（―）ｔ−用い大製造方法において、
ディスク（１１）の！！ｌ５ａ０−・・・の裏面に銀ペ
ース）を塗着してか−でディスク１ＩｌｔＶ−Ｆ７レー
ム１１）の放熱板ｔ１１　（１１−・・上Ｋｌｉ！ｌｉ
１着するようにしてもよい、また、ディスク１ｓ）の各
日ｅｔＫＩ−・・・の底面ヤｌ１ｆｆに空気抜き用の小
孔【穿設して牛用（１１・（１１）・・・の流鯵性管良
くシ、ベレット＋６１　（Ｉｌｌ・・・との錠着面積の
均−住辛、ペレツ）　Ｉｌｌ　（１）・・・の放熱性の
改善等【図る工夫も可能である。
以上説明し喪ように、本発明によれにディスクの使用に
よってペレットマクントがリードフレーム単位のイルチ
マクント方式て簡単に行えＪｌＯで、生産性が大幅に向
上し、製ｉＭ犀価の低減が図れる・ま大、ディスクの凹
部にベレット１僚めることによ如ペレットの位置決めが
てきゐので、ぺνットマクン）１１ｔｌＫベレツトを正
勢に位置決めする必要がな（、ま六ベレット！タント時
にベレットか装置ズレを起す心配がなくて後工程のツイ
ヤボンディング等が正確に行え渉貿珈向上が図れゐ。
【図面の簡単な説明】
Ｉｌｌ図及び＠コ図は従来の級造方法で製造し喪中導体
装置の一部断面平面図及びムー五線に沿う断面図、第５
図及び艷ダ図は本発明で使用するディスクの一例管示す
平面図及びｌ−ｍ＠に沿う断面図、第５図は本発明によ
ゐベレットマクントエ［１を説明するためのディスクと
り一ド７レームの各段階での要部拡大断面図、艷ご図は
Ｉｌｌ図のビ）の段階におりる半田供給＠ｔ−説明する
ディスクの断面図、第２図は第５図の（ロ）のＲＷ＆に
おけるベレット供給時のディスク一部拡大断面図、第１
図乃至第１θ図は第５図のベレットマクシト工程後のワ
イヤボンディング工程及びＩｉ＆そ−ルド工程及び切断
分離工程にお社る各平面図である。 （１）・争リードフレーム％　ｌ！１１！ｌ・・１・・
リード、　１８１１３１・・・ｅ・被ペレットマクント
基截（放熱板など）　、（６Ｈ６１・・・・・半導体ベ
レット、（９）・・ディスク、、　０ＱＩ−・・・・・
凹部。

Claims (1)

  1. 【特許請求の範囲】 １１１　９赦のリード及び被ペレットマクンＦ基板七多
    連形成しぇリードフレームの被ペレットマタント箇所七
    対応ず為ｍｌ！数の箇所に円部を形成し大帯板状ディス
    ク【用いて、各四部に牛導体ペレットを一括挿入して半
    田付けず為工程、及びリードフレーム０各被ベレヅ゛一
    本マタント基板上に前記ディスクの対応す為各凹部哀ｍ
    ｔ−結して１看す為工程を食むベレツトマクントエ−を
    有すること１＊＊とする牛導体装徽の製造方決。
JP56130476A 1981-08-19 1981-08-19 半導体装置の製造方法 Granted JPS5831543A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56130476A JPS5831543A (ja) 1981-08-19 1981-08-19 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56130476A JPS5831543A (ja) 1981-08-19 1981-08-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5831543A true JPS5831543A (ja) 1983-02-24
JPH0122981B2 JPH0122981B2 (ja) 1989-04-28

Family

ID=15035155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56130476A Granted JPS5831543A (ja) 1981-08-19 1981-08-19 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5831543A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184027A (ja) * 1984-10-01 1986-04-28 Mitsubishi Electric Corp 半導体装置の組立方法
JPS6381248U (ja) * 1986-11-18 1988-05-28
JPS63159740A (ja) * 1986-12-23 1988-07-02 Kawasaki Steel Corp レ−ザフラツシユ法熱定数測定装置
JPS6413723U (ja) * 1987-07-15 1989-01-24
JPH01161141A (ja) * 1987-12-16 1989-06-23 Sanki Eng Kk 熱定数測定装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS567445A (en) * 1979-06-28 1981-01-26 Mitsubishi Electric Corp Bonding head

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS567445A (en) * 1979-06-28 1981-01-26 Mitsubishi Electric Corp Bonding head

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184027A (ja) * 1984-10-01 1986-04-28 Mitsubishi Electric Corp 半導体装置の組立方法
JPH038107B2 (ja) * 1984-10-01 1991-02-05 Mitsubishi Electric Corp
JPS6381248U (ja) * 1986-11-18 1988-05-28
JPH0514200Y2 (ja) * 1986-11-18 1993-04-15
JPS63159740A (ja) * 1986-12-23 1988-07-02 Kawasaki Steel Corp レ−ザフラツシユ法熱定数測定装置
JPH0525304B2 (ja) * 1986-12-23 1993-04-12 Kawasaki Steel Co
JPS6413723U (ja) * 1987-07-15 1989-01-24
JPH01161141A (ja) * 1987-12-16 1989-06-23 Sanki Eng Kk 熱定数測定装置

Also Published As

Publication number Publication date
JPH0122981B2 (ja) 1989-04-28

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