JPS567445A - Bonding head - Google Patents

Bonding head

Info

Publication number
JPS567445A
JPS567445A JP8286479A JP8286479A JPS567445A JP S567445 A JPS567445 A JP S567445A JP 8286479 A JP8286479 A JP 8286479A JP 8286479 A JP8286479 A JP 8286479A JP S567445 A JPS567445 A JP S567445A
Authority
JP
Japan
Prior art keywords
spindles
block
fixed
supporting block
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8286479A
Other languages
Japanese (ja)
Other versions
JPS5932059B2 (en
Inventor
Takaharu Matsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP54082864A priority Critical patent/JPS5932059B2/en
Publication of JPS567445A publication Critical patent/JPS567445A/en
Publication of JPS5932059B2 publication Critical patent/JPS5932059B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To conduct bonding accurately by a method wherein attracting spindles in sliding-free shapes are inserted into holes formed to a bearing block unified with a supporting block, fixed pressing force is kept, and the blocks of the lower portions of the spindles are also heated in the same manner as the supporting block. CONSTITUTION:A bearing block 22 is fixed to a lower portion of a supporting block 17 fitted to an arm 15 through a spacer 16, and each hole 17a, 22a is conformed. Attracting spindles 23 are inserted, springs 24 are attached to the holes 17a, and fixed pressing force is given to the spindles 23. Heating blocks 25 are each fitted to portions projecting to the lower portions of the spindles, and connected to the block 22, and turn is stopped while heaters 26 and thermopiles 27 are arranged in the same manner as the block 17. Semiconductor elements 5 in the angular holes of a tray 14 are attracted to the spindles 23 arranged at fixed pitches, and pressed and stuck onto the bonding pads 13a of corresponding frames 13 by means of melted solder. According to this constitution, the block 22 is thermally expanded previously, the pitches of the spindles are regularly corrected, and a plurality of elements can accurately be bonded simultaneously.
JP54082864A 1979-06-28 1979-06-28 bonding head Expired JPS5932059B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54082864A JPS5932059B2 (en) 1979-06-28 1979-06-28 bonding head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54082864A JPS5932059B2 (en) 1979-06-28 1979-06-28 bonding head

Publications (2)

Publication Number Publication Date
JPS567445A true JPS567445A (en) 1981-01-26
JPS5932059B2 JPS5932059B2 (en) 1984-08-06

Family

ID=13786190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54082864A Expired JPS5932059B2 (en) 1979-06-28 1979-06-28 bonding head

Country Status (1)

Country Link
JP (1) JPS5932059B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831543A (en) * 1981-08-19 1983-02-24 Nec Home Electronics Ltd Manufacture of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831543A (en) * 1981-08-19 1983-02-24 Nec Home Electronics Ltd Manufacture of semiconductor device
JPH0122981B2 (en) * 1981-08-19 1989-04-28 Nippon Denki Hoomu Erekutoronikusu Kk

Also Published As

Publication number Publication date
JPS5932059B2 (en) 1984-08-06

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