JPS556900A - Bonding device - Google Patents

Bonding device

Info

Publication number
JPS556900A
JPS556900A JP8853079A JP8853079A JPS556900A JP S556900 A JPS556900 A JP S556900A JP 8853079 A JP8853079 A JP 8853079A JP 8853079 A JP8853079 A JP 8853079A JP S556900 A JPS556900 A JP S556900A
Authority
JP
Japan
Prior art keywords
frame
plates
support base
keep
upper portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8853079A
Other languages
Japanese (ja)
Inventor
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP8853079A priority Critical patent/JPS556900A/en
Publication of JPS556900A publication Critical patent/JPS556900A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent trouble regarding bonding due to the deformation of a lead frame, by mounting frame keep-plates to an upper portion of a frame support base, and by placing the lead frame so that it be held between the keep plates.
CONSTITUTION: Frame keep-plates 3, 4 are installed to an upper portion of a frame support base 2, which can be moved up and down, and a lead frame L is held between the plates. Thus, the frame L surely contact with the upper portion of the support base 2 because the curving of a central portion of the frame L due to pushing force from the side and thermal deformation can be prevented, the frame L is heated at fixed temperature and pellets and wires can positively be bonded. Height with a bonding head becomes fixed because the frame L is not brought to an uneven condition, and tailless in the case when cutting wires after bonding is positively performed.
COPYRIGHT: (C)1980,JPO&Japio
JP8853079A 1979-07-12 1979-07-12 Bonding device Pending JPS556900A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8853079A JPS556900A (en) 1979-07-12 1979-07-12 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8853079A JPS556900A (en) 1979-07-12 1979-07-12 Bonding device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3578874A Division JPS5339307B2 (en) 1974-03-29 1974-03-29

Publications (1)

Publication Number Publication Date
JPS556900A true JPS556900A (en) 1980-01-18

Family

ID=13945385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8853079A Pending JPS556900A (en) 1979-07-12 1979-07-12 Bonding device

Country Status (1)

Country Link
JP (1) JPS556900A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100713727B1 (en) * 1999-06-30 2007-05-03 텍사스 인스트루먼츠 인코포레이티드 Deformation-absorbing leadframe for semiconductor devices
JP2014144368A (en) * 2007-06-22 2014-08-14 Siemens Aktiengesellschaft Collimator device, control method and device therefor and x-ray computerized tomographic device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100713727B1 (en) * 1999-06-30 2007-05-03 텍사스 인스트루먼츠 인코포레이티드 Deformation-absorbing leadframe for semiconductor devices
JP2014144368A (en) * 2007-06-22 2014-08-14 Siemens Aktiengesellschaft Collimator device, control method and device therefor and x-ray computerized tomographic device

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