JPS5737842A - Device for gang bonding - Google Patents

Device for gang bonding

Info

Publication number
JPS5737842A
JPS5737842A JP11373580A JP11373580A JPS5737842A JP S5737842 A JPS5737842 A JP S5737842A JP 11373580 A JP11373580 A JP 11373580A JP 11373580 A JP11373580 A JP 11373580A JP S5737842 A JPS5737842 A JP S5737842A
Authority
JP
Japan
Prior art keywords
parallelism
bump
tool
profiling
corrected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11373580A
Other languages
Japanese (ja)
Inventor
Takayuki Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP11373580A priority Critical patent/JPS5737842A/en
Publication of JPS5737842A publication Critical patent/JPS5737842A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable to easily adjust the parallelism when a bonding work is performed by a method wherein the parallelism between the surface of the bump formed on a semiconductor chip and the surface of a tool is corrected by a profiling mechanism consisting of a spherical sliding section. CONSTITUTION:The chip 2 whereon the bump was formed is placed on the heat insulating material fixed on a profiling ball 5 and the pattern 7 formed on a tape 8 and the bump 3 are bonded by applying pressure and heat using a heating tool 1. The bump is conformed to the lower surface of the tool 1 in such a manner that the applied pressure will be equalized without having a sufficient parallelism between the tool 1 and the bump 3 by freely sliding the spherical contact section of the profiling ball support 6. Through these procedures, as the parallelism is corrected, the adjusting work for parallelism is unnecessitated and also a stabilized bonding can be performed even when there is variation in parallelism resulted from thermal deformation and the like.
JP11373580A 1980-08-19 1980-08-19 Device for gang bonding Pending JPS5737842A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11373580A JPS5737842A (en) 1980-08-19 1980-08-19 Device for gang bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11373580A JPS5737842A (en) 1980-08-19 1980-08-19 Device for gang bonding

Publications (1)

Publication Number Publication Date
JPS5737842A true JPS5737842A (en) 1982-03-02

Family

ID=14619802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11373580A Pending JPS5737842A (en) 1980-08-19 1980-08-19 Device for gang bonding

Country Status (1)

Country Link
JP (1) JPS5737842A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111633A (en) * 1986-10-30 1988-05-16 Matsushita Electric Ind Co Ltd Bonding method for chip
US4768702A (en) * 1986-04-30 1988-09-06 Hitachi, Ltd. Die bonding apparatus
JPS63229727A (en) * 1987-03-18 1988-09-26 Mitsubishi Electric Corp Paralleling mechanism of bonding device
JPH02137241A (en) * 1988-10-31 1990-05-25 Internatl Business Mach Corp <Ibm> Orientation regulator
JP2010046988A (en) * 2008-08-25 2010-03-04 Apic Yamada Corp Press machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55160631A (en) * 1979-06-01 1980-12-13 Hashimoto Forming Co Ltd Decorative material for vehicle

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55160631A (en) * 1979-06-01 1980-12-13 Hashimoto Forming Co Ltd Decorative material for vehicle

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4768702A (en) * 1986-04-30 1988-09-06 Hitachi, Ltd. Die bonding apparatus
JPS63111633A (en) * 1986-10-30 1988-05-16 Matsushita Electric Ind Co Ltd Bonding method for chip
JPS63229727A (en) * 1987-03-18 1988-09-26 Mitsubishi Electric Corp Paralleling mechanism of bonding device
JPH02137241A (en) * 1988-10-31 1990-05-25 Internatl Business Mach Corp <Ibm> Orientation regulator
JP2010046988A (en) * 2008-08-25 2010-03-04 Apic Yamada Corp Press machine

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