JPS5831543A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5831543A
JPS5831543A JP56130476A JP13047681A JPS5831543A JP S5831543 A JPS5831543 A JP S5831543A JP 56130476 A JP56130476 A JP 56130476A JP 13047681 A JP13047681 A JP 13047681A JP S5831543 A JPS5831543 A JP S5831543A
Authority
JP
Japan
Prior art keywords
disc
pellet
supplied
lead frame
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56130476A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0122981B2 (cg-RX-API-DMAC10.html
Inventor
Naomichi Ito
伊藤　尚道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP56130476A priority Critical patent/JPS5831543A/ja
Publication of JPS5831543A publication Critical patent/JPS5831543A/ja
Publication of JPH0122981B2 publication Critical patent/JPH0122981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/417—
    • H10W72/0711—
    • H10W72/01515—
    • H10W72/0198—
    • H10W72/073—
    • H10W72/07353—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/334—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/884—
    • H10W72/931—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
JP56130476A 1981-08-19 1981-08-19 半導体装置の製造方法 Granted JPS5831543A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56130476A JPS5831543A (ja) 1981-08-19 1981-08-19 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56130476A JPS5831543A (ja) 1981-08-19 1981-08-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5831543A true JPS5831543A (ja) 1983-02-24
JPH0122981B2 JPH0122981B2 (cg-RX-API-DMAC10.html) 1989-04-28

Family

ID=15035155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56130476A Granted JPS5831543A (ja) 1981-08-19 1981-08-19 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5831543A (cg-RX-API-DMAC10.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184027A (ja) * 1984-10-01 1986-04-28 Mitsubishi Electric Corp 半導体装置の組立方法
JPS6381248U (cg-RX-API-DMAC10.html) * 1986-11-18 1988-05-28
JPS63159740A (ja) * 1986-12-23 1988-07-02 Kawasaki Steel Corp レ−ザフラツシユ法熱定数測定装置
JPS6413723U (cg-RX-API-DMAC10.html) * 1987-07-15 1989-01-24
JPH01161141A (ja) * 1987-12-16 1989-06-23 Sanki Eng Kk 熱定数測定装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS567445A (en) * 1979-06-28 1981-01-26 Mitsubishi Electric Corp Bonding head

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS567445A (en) * 1979-06-28 1981-01-26 Mitsubishi Electric Corp Bonding head

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184027A (ja) * 1984-10-01 1986-04-28 Mitsubishi Electric Corp 半導体装置の組立方法
JPS6381248U (cg-RX-API-DMAC10.html) * 1986-11-18 1988-05-28
JPS63159740A (ja) * 1986-12-23 1988-07-02 Kawasaki Steel Corp レ−ザフラツシユ法熱定数測定装置
JPS6413723U (cg-RX-API-DMAC10.html) * 1987-07-15 1989-01-24
JPH01161141A (ja) * 1987-12-16 1989-06-23 Sanki Eng Kk 熱定数測定装置

Also Published As

Publication number Publication date
JPH0122981B2 (cg-RX-API-DMAC10.html) 1989-04-28

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