JPH01199440A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPH01199440A
JPH01199440A JP63024219A JP2421988A JPH01199440A JP H01199440 A JPH01199440 A JP H01199440A JP 63024219 A JP63024219 A JP 63024219A JP 2421988 A JP2421988 A JP 2421988A JP H01199440 A JPH01199440 A JP H01199440A
Authority
JP
Japan
Prior art keywords
resin
board
pressure
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63024219A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0519306B2 (enExample
Inventor
Tomohiko Suzuki
知彦 鈴木
Izumi Okamoto
岡本　泉
Shinsuke Nakamoto
中本　伸介
Masayoshi Mihata
御幡　正芳
Kenzo Hatada
畑田　賢造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63024219A priority Critical patent/JPH01199440A/ja
Publication of JPH01199440A publication Critical patent/JPH01199440A/ja
Publication of JPH0519306B2 publication Critical patent/JPH0519306B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07125—Means for controlling the bonding environment, e.g. valves or vacuum pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07341—Controlling the bonding environment, e.g. atmosphere composition or temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP63024219A 1988-02-04 1988-02-04 半導体装置の製造方法 Granted JPH01199440A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63024219A JPH01199440A (ja) 1988-02-04 1988-02-04 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63024219A JPH01199440A (ja) 1988-02-04 1988-02-04 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH01199440A true JPH01199440A (ja) 1989-08-10
JPH0519306B2 JPH0519306B2 (enExample) 1993-03-16

Family

ID=12132174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63024219A Granted JPH01199440A (ja) 1988-02-04 1988-02-04 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH01199440A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6058021A (en) * 1996-07-25 2000-05-02 Sharp Kabushiki Kaisha Structure of mounting a semiconductor element onto a substrate
JP2002359264A (ja) * 2001-05-31 2002-12-13 Sony Corp フリップチップ実装方法及び装置、半導体装置
JP2003077953A (ja) * 2001-09-06 2003-03-14 Sony Corp フリップチップ実装方法及び装置、半導体装置
JP2007184653A (ja) * 2007-04-09 2007-07-19 Hitachi Chem Co Ltd マルチチップモジュールの実装方法
US7456050B2 (en) * 2003-07-01 2008-11-25 Stmicroelectronics, Inc. System and method for controlling integrated circuit die height and planarity

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6058021A (en) * 1996-07-25 2000-05-02 Sharp Kabushiki Kaisha Structure of mounting a semiconductor element onto a substrate
JP2002359264A (ja) * 2001-05-31 2002-12-13 Sony Corp フリップチップ実装方法及び装置、半導体装置
JP2003077953A (ja) * 2001-09-06 2003-03-14 Sony Corp フリップチップ実装方法及び装置、半導体装置
US7456050B2 (en) * 2003-07-01 2008-11-25 Stmicroelectronics, Inc. System and method for controlling integrated circuit die height and planarity
JP2007184653A (ja) * 2007-04-09 2007-07-19 Hitachi Chem Co Ltd マルチチップモジュールの実装方法

Also Published As

Publication number Publication date
JPH0519306B2 (enExample) 1993-03-16

Similar Documents

Publication Publication Date Title
US5221642A (en) Lead-on-chip integrated circuit fabrication method
US5528075A (en) Lead-on-chip integrated circuit apparatus
US6478909B1 (en) Method for surface mounting electrical components to a substrate
US7368818B2 (en) Methods of making microelectronic assemblies including compliant interfaces
JPH01199440A (ja) 半導体装置の製造方法
JPS616833A (ja) 実装体の製造方法
JPH036828A (ja) 半導体装置
JP2903697B2 (ja) 半導体装置の製造方法及び半導体装置の製造装置
JPS63151033A (ja) 半導体装置の製造方法
US3554832A (en) Process for handling and mounting semiconductor dice
KR970067732A (ko) 접착 조성물의 수축으로 인한 파손이 적은 반도체 칩과 기판 사이의 전기적 접속을 갖는 반도체 소자 및 그 실장 방법
JPH08111482A (ja) 電子パワーデバイスのヒートシンクを電気的に絶縁するための方法および装置
JPH02122531A (ja) 電子部品の実装装置
JP2001126851A (ja) 半導体ウエハーにおけるヒータ装置およびその製造方法
JPS62132331A (ja) 半導体装置の製造方法
JPH0425142A (ja) 半導体素子の実装方法
EP0736225A1 (en) Method of attaching integrated circuit dies by rolling adhesives onto semiconductor wafers
JPH02155257A (ja) 半導体実装装置
JP2841846B2 (ja) Ｉｃ半導体素子の接合方法
JPH04254343A (ja) 半導体装置の実装方法
JP3267071B2 (ja) Ｔａｂ−セル圧着装置及び圧着方法
JP2847954B2 (ja) 半導体装置の製造方法
JPS58171233A (ja) 静電吸着装置の製造方法
JP2753112B2 (ja) 半導体装置の製造方法
JPH034541A (ja) 半導体装置の製造方法