JPH01190448A - 熱硬化ポリフェニレンオキサイド樹脂系多層板 - Google Patents

熱硬化ポリフェニレンオキサイド樹脂系多層板

Info

Publication number
JPH01190448A
JPH01190448A JP63015566A JP1556688A JPH01190448A JP H01190448 A JPH01190448 A JP H01190448A JP 63015566 A JP63015566 A JP 63015566A JP 1556688 A JP1556688 A JP 1556688A JP H01190448 A JPH01190448 A JP H01190448A
Authority
JP
Japan
Prior art keywords
polyphenylene oxide
sheet
initiator
oxide resin
crosslinking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63015566A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0562589B2 (enrdf_load_stackoverflow
Inventor
Takaaki Sakamoto
坂本 高明
Munehiko Ito
宗彦 伊藤
Shuji Maeda
修二 前田
Takahiro Horiuchi
堀内 隆博
Takayoshi Koseki
高好 小関
Koji Takagi
光司 高木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP63015566A priority Critical patent/JPH01190448A/ja
Publication of JPH01190448A publication Critical patent/JPH01190448A/ja
Publication of JPH0562589B2 publication Critical patent/JPH0562589B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036Multilayers with layers of different types

Landscapes

  • Laminated Bodies (AREA)
JP63015566A 1988-01-26 1988-01-26 熱硬化ポリフェニレンオキサイド樹脂系多層板 Granted JPH01190448A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63015566A JPH01190448A (ja) 1988-01-26 1988-01-26 熱硬化ポリフェニレンオキサイド樹脂系多層板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63015566A JPH01190448A (ja) 1988-01-26 1988-01-26 熱硬化ポリフェニレンオキサイド樹脂系多層板

Publications (2)

Publication Number Publication Date
JPH01190448A true JPH01190448A (ja) 1989-07-31
JPH0562589B2 JPH0562589B2 (enrdf_load_stackoverflow) 1993-09-08

Family

ID=11892296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63015566A Granted JPH01190448A (ja) 1988-01-26 1988-01-26 熱硬化ポリフェニレンオキサイド樹脂系多層板

Country Status (1)

Country Link
JP (1) JPH01190448A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007186620A (ja) * 2006-01-13 2007-07-26 Iwate Univ 接着性複合体組成物とその接着方法並びにその方法を用いた積層板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007186620A (ja) * 2006-01-13 2007-07-26 Iwate Univ 接着性複合体組成物とその接着方法並びにその方法を用いた積層板の製造方法

Also Published As

Publication number Publication date
JPH0562589B2 (enrdf_load_stackoverflow) 1993-09-08

Similar Documents

Publication Publication Date Title
US6146749A (en) Low dielectric composition, insulating material, sealing material, and circuit board
JPS61243844A (ja) 熱硬化性樹脂組成物
WO2000026269A1 (en) Vinyl terminated polybutadienes containing urethane or ester residues
JP2000313818A (ja) 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板
JP2000311518A (ja) 有機絶縁材用組成物、有機絶縁材、封止材および回路基板
JPS63159443A (ja) 積層板
JPH0579686B2 (enrdf_load_stackoverflow)
JPH0583166B2 (enrdf_load_stackoverflow)
JPH01190448A (ja) 熱硬化ポリフェニレンオキサイド樹脂系多層板
JPS62235335A (ja) 金属箔張積層板の製法
JPH0564586B2 (enrdf_load_stackoverflow)
JPH01245053A (ja) ポリフェニレンオキサイド系樹脂基板
JP2563137B2 (ja) 難燃化ポリフェニレンオキサイド系樹脂組成物
JPH0577706B2 (enrdf_load_stackoverflow)
JPS6329598A (ja) フレキシブル回路板の実装方法
JP2965277B2 (ja) ポリフェニレンオキサイド系樹脂組成物とこれを用いた金属箔張積層板
JPH0682927B2 (ja) ポリフェニレンオキサイド樹脂系lcr多層板
JPS63156835A (ja) 積層板
JPH01215851A (ja) 難燃化ポリフェニレンオキサイド系樹脂組成物とその金属張積層板
JPH03165596A (ja) 多層積層板
JPS62121758A (ja) ポリフエニレンオキサイド系樹脂組成物およびこの樹脂組成物からなるシ−ト
JPS62121759A (ja) ポリフエニレンオキサイド系樹脂組成物およびこの樹脂組成物からなるシ−ト
JPH01190449A (ja) ポリフェニレンオキサイド樹脂系多層板
JPH04161454A (ja) ポリフェニレンオキサイド系樹脂組成物
JPH03166255A (ja) 難燃化ポリフェニレンオキサイド系樹脂組成物

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees