JPH01184925A - 洗浄装置および洗浄方法 - Google Patents
洗浄装置および洗浄方法Info
- Publication number
- JPH01184925A JPH01184925A JP984888A JP984888A JPH01184925A JP H01184925 A JPH01184925 A JP H01184925A JP 984888 A JP984888 A JP 984888A JP 984888 A JP984888 A JP 984888A JP H01184925 A JPH01184925 A JP H01184925A
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- substrate
- cleaning
- window
- side wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 77
- 238000000034 method Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 65
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000007788 liquid Substances 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 17
- 238000005406 washing Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- -1 fluorine ions Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP984888A JPH01184925A (ja) | 1988-01-20 | 1988-01-20 | 洗浄装置および洗浄方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP984888A JPH01184925A (ja) | 1988-01-20 | 1988-01-20 | 洗浄装置および洗浄方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01184925A true JPH01184925A (ja) | 1989-07-24 |
| JPH0435900B2 JPH0435900B2 (enrdf_load_stackoverflow) | 1992-06-12 |
Family
ID=11731552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP984888A Granted JPH01184925A (ja) | 1988-01-20 | 1988-01-20 | 洗浄装置および洗浄方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01184925A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006295091A (ja) * | 2005-04-07 | 2006-10-26 | Tsukishima Kankyo Engineering Ltd | 基板の洗浄方法 |
-
1988
- 1988-01-20 JP JP984888A patent/JPH01184925A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006295091A (ja) * | 2005-04-07 | 2006-10-26 | Tsukishima Kankyo Engineering Ltd | 基板の洗浄方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0435900B2 (enrdf_load_stackoverflow) | 1992-06-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5904574A (en) | Process of making semiconductor device and improved semiconductor device | |
| JPS6347137B2 (enrdf_load_stackoverflow) | ||
| JP3343033B2 (ja) | 基板処理装置 | |
| KR20010049878A (ko) | 습식처리장치 | |
| DE102007027112A1 (de) | Verfahren zur Reinigung, Trocknung und Hydrophilierung einer Halbleiterscheibe | |
| JPH01184925A (ja) | 洗浄装置および洗浄方法 | |
| US6752897B2 (en) | Wet etch system with overflow particle removing feature | |
| US6360756B1 (en) | Wafer rinse tank for metal etching and method for using | |
| JPS63110732A (ja) | 半導体基板の洗浄方法 | |
| JPH01184926A (ja) | 洗浄装置および洗浄方法 | |
| JPH04167525A (ja) | 洗浄装置および洗浄方法 | |
| JP3996730B2 (ja) | 半導体部品の製造方法 | |
| KR20050002532A (ko) | 반도체 웨이퍼 습식세정방법 | |
| JPH10189524A (ja) | 洗浄処理装置および洗浄処理方法 | |
| KR0147944B1 (ko) | 반도체 웨이퍼의 세정방법 | |
| JPS63234535A (ja) | 半導体ウエ−ハの洗浄方法 | |
| JP2617610B2 (ja) | ウェーハ処理装置 | |
| JPH10172947A (ja) | 単槽式洗浄方法およびその装置 | |
| KR20010017387A (ko) | 웨이퍼 세정 장치 | |
| JP2009238798A (ja) | 基板処理方法および基板処理装置 | |
| JP3228915B2 (ja) | 半導体処理装置および処理方法 | |
| JPS6151928A (ja) | 半導体薄膜のエツチング装置 | |
| KR100771097B1 (ko) | 기판 처리 방법 | |
| JPS58161328A (ja) | 薄片状物品の洗浄装置 | |
| JPH0136248B2 (enrdf_load_stackoverflow) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |