JPH01163352U - - Google Patents

Info

Publication number
JPH01163352U
JPH01163352U JP1988059123U JP5912388U JPH01163352U JP H01163352 U JPH01163352 U JP H01163352U JP 1988059123 U JP1988059123 U JP 1988059123U JP 5912388 U JP5912388 U JP 5912388U JP H01163352 U JPH01163352 U JP H01163352U
Authority
JP
Japan
Prior art keywords
emitting diode
chip
type light
light
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988059123U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988059123U priority Critical patent/JPH01163352U/ja
Publication of JPH01163352U publication Critical patent/JPH01163352U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1988059123U 1988-04-30 1988-04-30 Pending JPH01163352U (ar)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988059123U JPH01163352U (ar) 1988-04-30 1988-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988059123U JPH01163352U (ar) 1988-04-30 1988-04-30

Publications (1)

Publication Number Publication Date
JPH01163352U true JPH01163352U (ar) 1989-11-14

Family

ID=31284910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988059123U Pending JPH01163352U (ar) 1988-04-30 1988-04-30

Country Status (1)

Country Link
JP (1) JPH01163352U (ar)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05114751A (ja) * 1991-10-23 1993-05-07 Sharp Corp 光半導体装置
JPH05218507A (ja) * 1992-02-05 1993-08-27 Sanyo Electric Co Ltd 光半導体装置
JPH07115227A (ja) * 1993-10-15 1995-05-02 Rohm Co Ltd 発光装置およびこれを用いた発光ユニット
JPH07131072A (ja) * 1993-10-29 1995-05-19 Rohm Co Ltd 面実装型側面発光器、および、これを用いた発光装置、ならびにこの発光装置を用いた液晶表示装置
JPH08306261A (ja) * 1995-04-28 1996-11-22 Shichizun Denshi:Kk 表面実装型タクトスイッチ及びその製造方法
JPH0936432A (ja) * 1995-07-17 1997-02-07 Sharp Corp 横発光型ｌｅｄおよびその製造方法
JPH09181359A (ja) * 1995-12-27 1997-07-11 Shichizun Denshi:Kk チップ型発光ダイオード
JPH10150138A (ja) * 1996-11-15 1998-06-02 Citizen Electron Co Ltd 下面電極付き側面使用電子部品
JPH10290029A (ja) * 1997-04-14 1998-10-27 Rohm Co Ltd Ｌｅｄチップ部品
JP2000196000A (ja) * 1998-12-25 2000-07-14 Rohm Co Ltd チップ電子部品及びその製造方法
JP2001160630A (ja) * 1999-12-03 2001-06-12 Rohm Co Ltd チップ型半導体装置
JP2006190764A (ja) * 2005-01-05 2006-07-20 Stanley Electric Co Ltd 表面実装型ｌｅｄ
JP2013105784A (ja) * 2011-11-10 2013-05-30 Seiko Instruments Inc 光センサ装置およびその製造方法
JP2019054248A (ja) * 2018-09-19 2019-04-04 日亜化学工業株式会社 発光装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624157B2 (ar) * 1984-10-30 1987-01-28 Sanyo Electric Co
JPS6210456B2 (ar) * 1980-12-10 1987-03-06 Sanyo Denki Kk

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6210456B2 (ar) * 1980-12-10 1987-03-06 Sanyo Denki Kk
JPS624157B2 (ar) * 1984-10-30 1987-01-28 Sanyo Electric Co

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05114751A (ja) * 1991-10-23 1993-05-07 Sharp Corp 光半導体装置
JPH05218507A (ja) * 1992-02-05 1993-08-27 Sanyo Electric Co Ltd 光半導体装置
JPH07115227A (ja) * 1993-10-15 1995-05-02 Rohm Co Ltd 発光装置およびこれを用いた発光ユニット
JPH07131072A (ja) * 1993-10-29 1995-05-19 Rohm Co Ltd 面実装型側面発光器、および、これを用いた発光装置、ならびにこの発光装置を用いた液晶表示装置
JPH08306261A (ja) * 1995-04-28 1996-11-22 Shichizun Denshi:Kk 表面実装型タクトスイッチ及びその製造方法
JPH0936432A (ja) * 1995-07-17 1997-02-07 Sharp Corp 横発光型ｌｅｄおよびその製造方法
JPH09181359A (ja) * 1995-12-27 1997-07-11 Shichizun Denshi:Kk チップ型発光ダイオード
JPH10150138A (ja) * 1996-11-15 1998-06-02 Citizen Electron Co Ltd 下面電極付き側面使用電子部品
JPH10290029A (ja) * 1997-04-14 1998-10-27 Rohm Co Ltd Ｌｅｄチップ部品
JP2000196000A (ja) * 1998-12-25 2000-07-14 Rohm Co Ltd チップ電子部品及びその製造方法
JP2001160630A (ja) * 1999-12-03 2001-06-12 Rohm Co Ltd チップ型半導体装置
JP2006190764A (ja) * 2005-01-05 2006-07-20 Stanley Electric Co Ltd 表面実装型ｌｅｄ
JP2013105784A (ja) * 2011-11-10 2013-05-30 Seiko Instruments Inc 光センサ装置およびその製造方法
JP2019054248A (ja) * 2018-09-19 2019-04-04 日亜化学工業株式会社 発光装置

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