JPH01155668U - - Google Patents

Info

Publication number
JPH01155668U
JPH01155668U JP5249088U JP5249088U JPH01155668U JP H01155668 U JPH01155668 U JP H01155668U JP 5249088 U JP5249088 U JP 5249088U JP 5249088 U JP5249088 U JP 5249088U JP H01155668 U JPH01155668 U JP H01155668U
Authority
JP
Japan
Prior art keywords
terminal
plate member
pad
soldered
terminal fittings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5249088U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5249088U priority Critical patent/JPH01155668U/ja
Publication of JPH01155668U publication Critical patent/JPH01155668U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の構成図で、aは斜
視図、bは側断面図、第2図は本考案の他の実施
例の側断面図、第3図は従来例の側断面図である
。 図において、1はプリント板、2はチツプ部品
、3は電極、5は導体パターン、5A,9はパツ
ド、6,6A,7は半田、10,20は端子、2
1は上部水平板部材、22は垂直板部材、23は
下部水平板部材、25は端子金具、27は固着片
、28は合成樹脂体をそれぞれ示す。
Fig. 1 is a block diagram of an embodiment of the present invention, a is a perspective view, b is a side sectional view, Fig. 2 is a side sectional view of another embodiment of the invention, and Fig. 3 is a side view of a conventional example. FIG. In the figure, 1 is a printed board, 2 is a chip component, 3 is an electrode, 5 is a conductor pattern, 5A, 9 are pads, 6, 6A, 7 are solder, 10, 20 are terminals, 2
1 is an upper horizontal plate member, 22 is a vertical plate member, 23 is a lower horizontal plate member, 25 is a terminal fitting, 27 is a fixing piece, and 28 is a synthetic resin body.

Claims (1)

【実用新案登録請求の範囲】 上面にチツプ部品2を半田付け搭載する上部水
平板部材21、及びプリント板1の導体パターン
5に繋がるパツド5Aに、半田付け固着する下部
水平板部材23を有する、コ形或いはほぼZ形の
一対の端子金具25と、 該端子金具25の垂直板部材22部分をインサ
ート成形して、所望の間隔を保持し対向した状態
で、一対の該端子金具25を一体に固定する合成
樹脂体28と、 該端子金具25の中間で該合成樹脂体28の下
面にインサート成形されてなり、該端子金具25
が固着したパツド5Aとは異なるパツド9に半田
付けする固着片27とより、構成されたことを特
徴とするチツプ部品用端子。
[Claims for Utility Model Registration] It has an upper horizontal plate member 21 on which the chip component 2 is soldered and mounted, and a lower horizontal plate member 23 that is fixedly soldered to the pad 5A connected to the conductor pattern 5 of the printed board 1. A pair of U-shaped or almost Z-shaped terminal fittings 25 and a portion of the vertical plate member 22 of the terminal fittings 25 are insert-molded, and the pair of terminal fittings 25 are integrally formed while maintaining a desired spacing and facing each other. It is insert-molded on the lower surface of the synthetic resin body 28 between the synthetic resin body 28 to be fixed and the terminal metal fitting 25, and the terminal metal fitting 25
A terminal for a chip component, characterized in that it is constituted by a fixing piece 27 soldered to a pad 9 different from the pad 5A to which the chip 5A is fixed.
JP5249088U 1988-04-19 1988-04-19 Pending JPH01155668U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5249088U JPH01155668U (en) 1988-04-19 1988-04-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5249088U JPH01155668U (en) 1988-04-19 1988-04-19

Publications (1)

Publication Number Publication Date
JPH01155668U true JPH01155668U (en) 1989-10-25

Family

ID=31278491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5249088U Pending JPH01155668U (en) 1988-04-19 1988-04-19

Country Status (1)

Country Link
JP (1) JPH01155668U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014042037A (en) * 2010-12-28 2014-03-06 Murata Mfg Co Ltd Electronic component
US9241408B2 (en) 2010-12-28 2016-01-19 Murata Manufacturing Co., Ltd. Electronic component
JP2020004831A (en) * 2018-06-27 2020-01-09 株式会社村田製作所 Multilayer ceramic electronic component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014042037A (en) * 2010-12-28 2014-03-06 Murata Mfg Co Ltd Electronic component
US9241408B2 (en) 2010-12-28 2016-01-19 Murata Manufacturing Co., Ltd. Electronic component
JP2020004831A (en) * 2018-06-27 2020-01-09 株式会社村田製作所 Multilayer ceramic electronic component

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