JPH01152735A - 樹脂封止型電子部品の製造方法 - Google Patents

樹脂封止型電子部品の製造方法

Info

Publication number
JPH01152735A
JPH01152735A JP62313328A JP31332887A JPH01152735A JP H01152735 A JPH01152735 A JP H01152735A JP 62313328 A JP62313328 A JP 62313328A JP 31332887 A JP31332887 A JP 31332887A JP H01152735 A JPH01152735 A JP H01152735A
Authority
JP
Japan
Prior art keywords
resin
runner
lead frame
guide hole
resin body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62313328A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0458180B2 (enExample
Inventor
Takaaki Yokoyama
隆昭 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP62313328A priority Critical patent/JPH01152735A/ja
Publication of JPH01152735A publication Critical patent/JPH01152735A/ja
Publication of JPH0458180B2 publication Critical patent/JPH0458180B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP62313328A 1987-12-10 1987-12-10 樹脂封止型電子部品の製造方法 Granted JPH01152735A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62313328A JPH01152735A (ja) 1987-12-10 1987-12-10 樹脂封止型電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62313328A JPH01152735A (ja) 1987-12-10 1987-12-10 樹脂封止型電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPH01152735A true JPH01152735A (ja) 1989-06-15
JPH0458180B2 JPH0458180B2 (enExample) 1992-09-16

Family

ID=18039911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62313328A Granted JPH01152735A (ja) 1987-12-10 1987-12-10 樹脂封止型電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPH01152735A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04276648A (ja) * 1991-03-04 1992-10-01 Rohm Co Ltd 電子部品製造用フレーム、およびこれを用いた電子部品製造方法、ならびにこの製造方法により製造された電子部品
JP2014157855A (ja) * 2013-02-14 2014-08-28 Dainippon Printing Co Ltd 樹脂付きリードフレームの多面付け体、光半導体装置の多面付け体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04276648A (ja) * 1991-03-04 1992-10-01 Rohm Co Ltd 電子部品製造用フレーム、およびこれを用いた電子部品製造方法、ならびにこの製造方法により製造された電子部品
JP2014157855A (ja) * 2013-02-14 2014-08-28 Dainippon Printing Co Ltd 樹脂付きリードフレームの多面付け体、光半導体装置の多面付け体

Also Published As

Publication number Publication date
JPH0458180B2 (enExample) 1992-09-16

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Legal Events

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