JPH0113218B2 - - Google Patents

Info

Publication number
JPH0113218B2
JPH0113218B2 JP15386081A JP15386081A JPH0113218B2 JP H0113218 B2 JPH0113218 B2 JP H0113218B2 JP 15386081 A JP15386081 A JP 15386081A JP 15386081 A JP15386081 A JP 15386081A JP H0113218 B2 JPH0113218 B2 JP H0113218B2
Authority
JP
Japan
Prior art keywords
pellet
wire
mark
bonding
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15386081A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5856347A (ja
Inventor
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56153860A priority Critical patent/JPS5856347A/ja
Publication of JPS5856347A publication Critical patent/JPS5856347A/ja
Publication of JPH0113218B2 publication Critical patent/JPH0113218B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP56153860A 1981-09-30 1981-09-30 ワイヤボンデイング方法 Granted JPS5856347A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56153860A JPS5856347A (ja) 1981-09-30 1981-09-30 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56153860A JPS5856347A (ja) 1981-09-30 1981-09-30 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS5856347A JPS5856347A (ja) 1983-04-04
JPH0113218B2 true JPH0113218B2 (enExample) 1989-03-03

Family

ID=15571680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56153860A Granted JPS5856347A (ja) 1981-09-30 1981-09-30 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS5856347A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2558673B2 (ja) * 1987-01-29 1996-11-27 株式会社東芝 ワイヤボンデイング装置

Also Published As

Publication number Publication date
JPS5856347A (ja) 1983-04-04

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