JPH0219965Y2 - - Google Patents
Info
- Publication number
- JPH0219965Y2 JPH0219965Y2 JP1985018217U JP1821785U JPH0219965Y2 JP H0219965 Y2 JPH0219965 Y2 JP H0219965Y2 JP 1985018217 U JP1985018217 U JP 1985018217U JP 1821785 U JP1821785 U JP 1821785U JP H0219965 Y2 JPH0219965 Y2 JP H0219965Y2
- Authority
- JP
- Japan
- Prior art keywords
- loop
- wire
- bonding
- height
- loop detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985018217U JPH0219965Y2 (enExample) | 1985-02-12 | 1985-02-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985018217U JPH0219965Y2 (enExample) | 1985-02-12 | 1985-02-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61136538U JPS61136538U (enExample) | 1986-08-25 |
| JPH0219965Y2 true JPH0219965Y2 (enExample) | 1990-05-31 |
Family
ID=30506644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985018217U Expired JPH0219965Y2 (enExample) | 1985-02-12 | 1985-02-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0219965Y2 (enExample) |
-
1985
- 1985-02-12 JP JP1985018217U patent/JPH0219965Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61136538U (enExample) | 1986-08-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4347964A (en) | Wire bonding apparatus | |
| IE49684B1 (en) | Systems for bonding pellets,for example semiconductor chips,to supports | |
| JPH0219965Y2 (enExample) | ||
| US5040293A (en) | Bonding method | |
| JPH05308086A (ja) | 半導体製造装置 | |
| JPH0238450Y2 (enExample) | ||
| JP3404755B2 (ja) | ワイヤボンディング装置 | |
| JPH07302806A (ja) | リードフレームの位置決め装置 | |
| JP3857946B2 (ja) | 電子部品のボンディング方法及びボンディング装置 | |
| JPH10313013A (ja) | ボンディング装置及びボンディング方法並びに半導体装置の製造方法 | |
| JPH04123446A (ja) | 位置決め制御方法 | |
| JP2685137B2 (ja) | ワイヤボンダ | |
| JPH04359526A (ja) | ワイヤボンディング方法 | |
| JPS61148828A (ja) | ワイヤボンデイングの検査方法 | |
| JP2832744B2 (ja) | インナーリードボンディング方法 | |
| JPS62150831A (ja) | ワイヤボンダ | |
| JP3455137B2 (ja) | ワイヤボンディング方法及び装置 | |
| JPH0124931Y2 (enExample) | ||
| JPS61119054A (ja) | 自動ワイヤボンデイング装置 | |
| JPS613417A (ja) | ボンデイング方法 | |
| JPH0110930Y2 (enExample) | ||
| JPH04730A (ja) | ワイヤボンディング装置 | |
| JP2005079412A (ja) | 半導体装置の製造方法およびそれに用いられるワイヤボンダ | |
| JPH04261033A (ja) | ワイヤボンド装置 | |
| JPH0527978B2 (enExample) |