JPH01123343U - - Google Patents
Info
- Publication number
- JPH01123343U JPH01123343U JP1988019143U JP1914388U JPH01123343U JP H01123343 U JPH01123343 U JP H01123343U JP 1988019143 U JP1988019143 U JP 1988019143U JP 1914388 U JP1914388 U JP 1914388U JP H01123343 U JPH01123343 U JP H01123343U
- Authority
- JP
- Japan
- Prior art keywords
- heater block
- metal foil
- window hole
- tape guide
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988019143U JPH0526751Y2 (enrdf_load_stackoverflow) | 1988-02-15 | 1988-02-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988019143U JPH0526751Y2 (enrdf_load_stackoverflow) | 1988-02-15 | 1988-02-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01123343U true JPH01123343U (enrdf_load_stackoverflow) | 1989-08-22 |
JPH0526751Y2 JPH0526751Y2 (enrdf_load_stackoverflow) | 1993-07-07 |
Family
ID=31234392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988019143U Expired - Lifetime JPH0526751Y2 (enrdf_load_stackoverflow) | 1988-02-15 | 1988-02-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0526751Y2 (enrdf_load_stackoverflow) |
-
1988
- 1988-02-15 JP JP1988019143U patent/JPH0526751Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0526751Y2 (enrdf_load_stackoverflow) | 1993-07-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS596839U (ja) | 半導体装置 | |
JPH01123343U (enrdf_load_stackoverflow) | ||
JPS5844844U (ja) | 半導体装置 | |
JPS5881937U (ja) | 半導体装置 | |
JPS58433U (ja) | 半導体装置 | |
JPS60113642U (ja) | 半導体装置 | |
JPS5873548U (ja) | 温度ヒユ−ズの取付装置 | |
JPS5889930U (ja) | 半導体装置 | |
JPH0432531U (enrdf_load_stackoverflow) | ||
JPS5856452U (ja) | ハイブリツド型電子部品 | |
JPS58153458U (ja) | 半導体装置 | |
JPS59191744U (ja) | 半導体装置 | |
JPS5811252U (ja) | 半導体装置用パツケ−ジ | |
JPS5899847U (ja) | テ−プキヤリヤ | |
JPS60129124U (ja) | コンデンサ用リ−ド線 | |
JPS614437U (ja) | 半導体装置用リ−ドフレ−ム | |
JPS6068654U (ja) | 半導体装置 | |
JPS5991747U (ja) | 半導体装置 | |
JPS5942044U (ja) | 絶縁型半導体装置 | |
JPS59145083U (ja) | 混成集積回路 | |
JPS5815360U (ja) | 樹脂封止型半導体装置 | |
JPS59107146U (ja) | 絶縁型半導体素子 | |
JPS5996843U (ja) | 半導体装置 | |
JPS588946U (ja) | 半導体装置 | |
JPS5866626U (ja) | 電気機器の保安装置 |