JPH0526751Y2 - - Google Patents
Info
- Publication number
- JPH0526751Y2 JPH0526751Y2 JP1988019143U JP1914388U JPH0526751Y2 JP H0526751 Y2 JPH0526751 Y2 JP H0526751Y2 JP 1988019143 U JP1988019143 U JP 1988019143U JP 1914388 U JP1914388 U JP 1914388U JP H0526751 Y2 JPH0526751 Y2 JP H0526751Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- heater block
- tape
- semiconductor
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 51
- 239000008188 pellet Substances 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 29
- 239000011888 foil Substances 0.000 claims description 28
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019143U JPH0526751Y2 (enrdf_load_stackoverflow) | 1988-02-15 | 1988-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019143U JPH0526751Y2 (enrdf_load_stackoverflow) | 1988-02-15 | 1988-02-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01123343U JPH01123343U (enrdf_load_stackoverflow) | 1989-08-22 |
| JPH0526751Y2 true JPH0526751Y2 (enrdf_load_stackoverflow) | 1993-07-07 |
Family
ID=31234392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988019143U Expired - Lifetime JPH0526751Y2 (enrdf_load_stackoverflow) | 1988-02-15 | 1988-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526751Y2 (enrdf_load_stackoverflow) |
-
1988
- 1988-02-15 JP JP1988019143U patent/JPH0526751Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01123343U (enrdf_load_stackoverflow) | 1989-08-22 |
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