JPH01114433A - 耐熱積層体 - Google Patents

耐熱積層体

Info

Publication number
JPH01114433A
JPH01114433A JP27168887A JP27168887A JPH01114433A JP H01114433 A JPH01114433 A JP H01114433A JP 27168887 A JP27168887 A JP 27168887A JP 27168887 A JP27168887 A JP 27168887A JP H01114433 A JPH01114433 A JP H01114433A
Authority
JP
Japan
Prior art keywords
heat
laminate
filler
present
resistant laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27168887A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0530381B2 (https=
Inventor
Takeo Kimura
武夫 木村
Shunji Chikamori
近森　俊二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON KOUDOSHI KOGYO KK
Nippon Kodoshi Corp
Original Assignee
NIPPON KOUDOSHI KOGYO KK
Nippon Kodoshi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON KOUDOSHI KOGYO KK, Nippon Kodoshi Corp filed Critical NIPPON KOUDOSHI KOGYO KK
Priority to JP27168887A priority Critical patent/JPH01114433A/ja
Publication of JPH01114433A publication Critical patent/JPH01114433A/ja
Publication of JPH0530381B2 publication Critical patent/JPH0530381B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
JP27168887A 1987-10-29 1987-10-29 耐熱積層体 Granted JPH01114433A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27168887A JPH01114433A (ja) 1987-10-29 1987-10-29 耐熱積層体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27168887A JPH01114433A (ja) 1987-10-29 1987-10-29 耐熱積層体

Publications (2)

Publication Number Publication Date
JPH01114433A true JPH01114433A (ja) 1989-05-08
JPH0530381B2 JPH0530381B2 (https=) 1993-05-07

Family

ID=17503464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27168887A Granted JPH01114433A (ja) 1987-10-29 1987-10-29 耐熱積層体

Country Status (1)

Country Link
JP (1) JPH01114433A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0625614A (ja) * 1992-04-20 1994-02-01 Nippon Koudoshi Kogyo Kk 接着方法及び接着性部材
JP2012507459A (ja) * 2008-10-29 2012-03-29 クラミック エレクトロニクス ゲーエムベーハー 複合材料、複合材料形成方法、及び接着剤又は接合材料

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62199651A (ja) * 1986-02-27 1987-09-03 Nippon Koudoshi Kogyo Kk フレキシブルな耐熱性樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62199651A (ja) * 1986-02-27 1987-09-03 Nippon Koudoshi Kogyo Kk フレキシブルな耐熱性樹脂組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0625614A (ja) * 1992-04-20 1994-02-01 Nippon Koudoshi Kogyo Kk 接着方法及び接着性部材
JP2012507459A (ja) * 2008-10-29 2012-03-29 クラミック エレクトロニクス ゲーエムベーハー 複合材料、複合材料形成方法、及び接着剤又は接合材料

Also Published As

Publication number Publication date
JPH0530381B2 (https=) 1993-05-07

Similar Documents

Publication Publication Date Title
TWI716524B (zh) 覆銅積層體及印刷線路板
EP1266926B1 (en) Adhesive polyimide resin and adhesive laminate
JP5235211B2 (ja) フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム
US5773509A (en) Heat resistant resin composition, heat resistant film adhesive and process for producing the same
JPH06200216A (ja) プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
JPH0359105B2 (https=)
US5510425A (en) Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides
JPS62263692A (ja) 耐熱性フレキシブルプリント配線板
JP5665449B2 (ja) 金属張積層体及び熱伝導性ポリイミドフィルム
JP3523952B2 (ja) ポリイミド−金属箔複合フィルム
JP7648377B2 (ja) ポリアミド酸組成物、ポリイミド組成物、金属張積層板及び回路基板
JP2008251900A (ja) フレキシブル基板用積層体及びその製造方法
JPH01114433A (ja) 耐熱積層体
JPS63239998A (ja) 配線材料の製造方法
JP4976380B2 (ja) 金属積層体
KR100517233B1 (ko) 금속적층체
JP2938227B2 (ja) ポリアミック酸樹脂
JPH0678484B2 (ja) 耐熱性樹脂組成物
JPS6345051A (ja) 耐熱性積層体
JP2014022474A (ja) 高周波回路用基板
JP2797044B2 (ja) 接着方法及び接着性部材
JPH02122697A (ja) フレキシブル金属箔積層板の製造方法
JP2668752B2 (ja) 耐熱性接着剤
JP2021160364A (ja) 金属被覆ポリマーフィルム及び電子デバイス
JP7621112B2 (ja) 金属張積層板及びその製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080507

Year of fee payment: 15