JPH01100467U - - Google Patents
Info
- Publication number
- JPH01100467U JPH01100467U JP19569687U JP19569687U JPH01100467U JP H01100467 U JPH01100467 U JP H01100467U JP 19569687 U JP19569687 U JP 19569687U JP 19569687 U JP19569687 U JP 19569687U JP H01100467 U JPH01100467 U JP H01100467U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- pattern lands
- integrated circuit
- disposed
- support protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 1
- 230000008054 signal transmission Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Waveguides (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
本考案の他の実施例の平面図、第３図は従来構造
の断面図である。
１……厚膜基板、２……パツケージ、３……接
地導体膜、４……金ワイヤ、５……パターンラン
ド、６……支持突起。
FIG. 1 is a cross-sectional view of one embodiment of the present invention, FIG. 2 is a plan view of another embodiment of the present invention, and FIG. 3 is a cross-sectional view of a conventional structure. DESCRIPTION OF SYMBOLS 1... Thick film substrate, 2... Package cage, 3... Ground conductor film, 4... Gold wire, 5... Pattern land, 6... Support protrusion.
Claims (1)
これらパターンランドに渡つて金属ワイヤをボン
デイングして信号伝送路を構成してなる厚膜混成
集積回路において、前記パターンランド間に絶縁
材からなる１個以上の支持突起を配設し、この支
持突起により前記金属ワイヤの中間部を支持した
ことを特徴とする厚膜混成集積回路。 Forming multiple pattern lands on a thick film substrate,
In a thick film hybrid integrated circuit in which a signal transmission path is constructed by bonding metal wires across these pattern lands, one or more support protrusions made of an insulating material are disposed between the pattern lands, and the support protrusions are disposed between the pattern lands. A thick film hybrid integrated circuit characterized in that an intermediate portion of the metal wire is supported by a metal wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19569687U JPH01100467U (en) | 1987-12-25 | 1987-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19569687U JPH01100467U (en) | 1987-12-25 | 1987-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01100467U true JPH01100467U (en) | 1989-07-05 |
Family
ID=31486360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19569687U Pending JPH01100467U (en) | 1987-12-25 | 1987-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01100467U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100579441B1 (en) * | 2003-11-21 | 2006-05-12 | 학교법인 동국대학교 | microstrip transmission line upon porous silicon substrate using surface MEMS technique |
| JP2015517209A (en) * | 2012-03-30 | 2015-06-18 | ノキア コーポレイション | Deformable apparatus and method |
-
1987
- 1987-12-25 JP JP19569687U patent/JPH01100467U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100579441B1 (en) * | 2003-11-21 | 2006-05-12 | 학교법인 동국대학교 | microstrip transmission line upon porous silicon substrate using surface MEMS technique |
| JP2015517209A (en) * | 2012-03-30 | 2015-06-18 | ノキア コーポレイション | Deformable apparatus and method |