JP7852196B2 - 圧力センサ用のガラスウエハおよびガラスエレメント - Google Patents

圧力センサ用のガラスウエハおよびガラスエレメント

Info

Publication number
JP7852196B2
JP7852196B2 JP2023502968A JP2023502968A JP7852196B2 JP 7852196 B2 JP7852196 B2 JP 7852196B2 JP 2023502968 A JP2023502968 A JP 2023502968A JP 2023502968 A JP2023502968 A JP 2023502968A JP 7852196 B2 JP7852196 B2 JP 7852196B2
Authority
JP
Japan
Prior art keywords
glass
opening
cross
glass substrate
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023502968A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023534485A5 (https=
JP2023534485A (ja
Inventor
ポイヒャート ウルリヒ
ブレツィンガー マーティン
ウッツ トーマス
ブライトバッハ クリスティアン
ヨッツ マティアス
リープシュ ゼーレン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott AG filed Critical Schott AG
Publication of JP2023534485A publication Critical patent/JP2023534485A/ja
Publication of JP2023534485A5 publication Critical patent/JP2023534485A5/ja
Application granted granted Critical
Publication of JP7852196B2 publication Critical patent/JP7852196B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00047—Cavities
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0609—Pressure pulsation damping arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Surface Treatment Of Glass (AREA)
  • Glass Compositions (AREA)
JP2023502968A 2020-07-17 2021-07-15 圧力センサ用のガラスウエハおよびガラスエレメント Active JP7852196B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102020118939.7 2020-07-17
DE102020118939.7A DE102020118939A1 (de) 2020-07-17 2020-07-17 Glaswafer und Glaselement für Drucksensoren
PCT/EP2021/069695 WO2022013334A1 (de) 2020-07-17 2021-07-15 Glaswafer und glaselement für drucksensoren

Publications (3)

Publication Number Publication Date
JP2023534485A JP2023534485A (ja) 2023-08-09
JP2023534485A5 JP2023534485A5 (https=) 2025-07-01
JP7852196B2 true JP7852196B2 (ja) 2026-04-28

Family

ID=77021345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023502968A Active JP7852196B2 (ja) 2020-07-17 2021-07-15 圧力センサ用のガラスウエハおよびガラスエレメント

Country Status (7)

Country Link
US (1) US12596042B2 (https=)
EP (1) EP4162246B1 (https=)
JP (1) JP7852196B2 (https=)
KR (1) KR20230038782A (https=)
CN (1) CN116194403A (https=)
DE (1) DE102020118939A1 (https=)
WO (1) WO2022013334A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022124863A1 (de) * 2022-09-27 2024-03-28 Schott Ag Glaswafer sowie Verfahren zu dessen Herstellung

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005221453A (ja) 2004-02-09 2005-08-18 Denso Corp 圧力センサ
JP2013093091A (ja) 2011-10-05 2013-05-16 Hoya Corp 磁気ディスク用ガラス基板および磁気記録媒体
WO2016129254A1 (ja) 2015-02-10 2016-08-18 日本板硝子株式会社 レーザ加工用ガラス及びそれを用いた孔付きガラスの製造方法
JP2018050031A (ja) 2016-07-28 2018-03-29 フラウンホーファー−ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン パターニングされた層状複合材
JP2018509298A (ja) 2015-01-13 2018-04-05 ロフィン−ジナール テクノロジーズ インコーポレイテッド 脆性材料をスクライブして化学エッチングする方法およびシステム
JP2018123048A (ja) 2017-01-27 2018-08-09 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 構造化されたプレート状のガラスエレメント、およびその製造方法
JP2019214507A (ja) 2018-04-27 2019-12-19 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 脆性材料から成る基板の容積に微細な構造を形成する方法

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JPS57128074A (en) 1981-02-02 1982-08-09 Hitachi Ltd Semiconductor pressure sensor
US4730496A (en) * 1986-06-23 1988-03-15 Rosemount Inc. Capacitance pressure sensor
JPH0254137A (ja) * 1988-08-17 1990-02-23 Toshiba Corp 半導体圧力センサー
JPH09126924A (ja) 1995-10-31 1997-05-16 Nippon Seiki Co Ltd 半導体圧力センサ
EP1359402B1 (en) * 2002-05-01 2014-10-01 Infineon Technologies AG Pressure sensor
US7028552B2 (en) 2004-05-17 2006-04-18 Kavlico Corporation Reliable piezo-resistive pressure sensor
JP4556784B2 (ja) 2005-06-27 2010-10-06 株式会社デンソー 圧力センサ
US7798010B2 (en) 2007-10-11 2010-09-21 Honeywell International Inc. Sensor geometry for improved package stress isolation
JP2011013178A (ja) 2009-07-06 2011-01-20 Yamatake Corp 圧力センサ及び製造方法
US9470593B2 (en) 2013-09-12 2016-10-18 Honeywell International Inc. Media isolated pressure sensor
CN104511479B (zh) * 2013-10-04 2017-01-11 Jx日矿日石金属株式会社 轧制铜箔
US20150276533A1 (en) * 2014-01-08 2015-10-01 Amphenol Thermometrics, Inc. Low Pressure Sensor and Flow Sensor
CN106457475A (zh) 2014-03-14 2017-02-22 康宁股份有限公司 嵌入玻璃的传感器及其制造过程
KR20170044143A (ko) * 2014-09-16 2017-04-24 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
CN205384625U (zh) * 2015-06-05 2016-07-13 旭硝子株式会社 玻璃基板、保护玻璃、以及便携式信息终端
JP6528745B2 (ja) * 2016-09-06 2019-06-12 株式会社デンソー 圧力センサ
CN112512959A (zh) 2018-08-09 2021-03-16 Lpkf激光电子股份公司 用于制造微结构的方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005221453A (ja) 2004-02-09 2005-08-18 Denso Corp 圧力センサ
JP2013093091A (ja) 2011-10-05 2013-05-16 Hoya Corp 磁気ディスク用ガラス基板および磁気記録媒体
JP2018509298A (ja) 2015-01-13 2018-04-05 ロフィン−ジナール テクノロジーズ インコーポレイテッド 脆性材料をスクライブして化学エッチングする方法およびシステム
WO2016129254A1 (ja) 2015-02-10 2016-08-18 日本板硝子株式会社 レーザ加工用ガラス及びそれを用いた孔付きガラスの製造方法
JP2018050031A (ja) 2016-07-28 2018-03-29 フラウンホーファー−ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン パターニングされた層状複合材
JP2018123048A (ja) 2017-01-27 2018-08-09 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 構造化されたプレート状のガラスエレメント、およびその製造方法
JP2019214507A (ja) 2018-04-27 2019-12-19 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 脆性材料から成る基板の容積に微細な構造を形成する方法

Also Published As

Publication number Publication date
WO2022013334A1 (de) 2022-01-20
DE102020118939A1 (de) 2022-01-20
JP2023534485A (ja) 2023-08-09
EP4162246B1 (de) 2025-09-03
KR20230038782A (ko) 2023-03-21
EP4162246A1 (de) 2023-04-12
US20230175906A1 (en) 2023-06-08
US12596042B2 (en) 2026-04-07
CN116194403A (zh) 2023-05-30

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