KR20230038782A - 압력 센서용 유리 웨이퍼 및 유리 요소 - Google Patents

압력 센서용 유리 웨이퍼 및 유리 요소 Download PDF

Info

Publication number
KR20230038782A
KR20230038782A KR1020237005574A KR20237005574A KR20230038782A KR 20230038782 A KR20230038782 A KR 20230038782A KR 1020237005574 A KR1020237005574 A KR 1020237005574A KR 20237005574 A KR20237005574 A KR 20237005574A KR 20230038782 A KR20230038782 A KR 20230038782A
Authority
KR
South Korea
Prior art keywords
glass
cross
glass substrate
opening
skewness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237005574A
Other languages
English (en)
Korean (ko)
Inventor
울리히 페우헤르트
마르틴 블레징거
토마스 우츠
크리스티안 브라이트바흐
마티아스 욧츠
쇠렌 리브슈
Original Assignee
쇼오트 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쇼오트 아게 filed Critical 쇼오트 아게
Publication of KR20230038782A publication Critical patent/KR20230038782A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00047—Cavities
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0609—Pressure pulsation damping arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Surface Treatment Of Glass (AREA)
  • Glass Compositions (AREA)
KR1020237005574A 2020-07-17 2021-07-15 압력 센서용 유리 웨이퍼 및 유리 요소 Pending KR20230038782A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102020118939.7 2020-07-17
DE102020118939.7A DE102020118939A1 (de) 2020-07-17 2020-07-17 Glaswafer und Glaselement für Drucksensoren
PCT/EP2021/069695 WO2022013334A1 (de) 2020-07-17 2021-07-15 Glaswafer und glaselement für drucksensoren

Publications (1)

Publication Number Publication Date
KR20230038782A true KR20230038782A (ko) 2023-03-21

Family

ID=77021345

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237005574A Pending KR20230038782A (ko) 2020-07-17 2021-07-15 압력 센서용 유리 웨이퍼 및 유리 요소

Country Status (7)

Country Link
US (1) US12596042B2 (https=)
EP (1) EP4162246B1 (https=)
JP (1) JP7852196B2 (https=)
KR (1) KR20230038782A (https=)
CN (1) CN116194403A (https=)
DE (1) DE102020118939A1 (https=)
WO (1) WO2022013334A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022124863A1 (de) * 2022-09-27 2024-03-28 Schott Ag Glaswafer sowie Verfahren zu dessen Herstellung

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128074A (en) 1981-02-02 1982-08-09 Hitachi Ltd Semiconductor pressure sensor
US4730496A (en) * 1986-06-23 1988-03-15 Rosemount Inc. Capacitance pressure sensor
JPH0254137A (ja) * 1988-08-17 1990-02-23 Toshiba Corp 半導体圧力センサー
JPH09126924A (ja) 1995-10-31 1997-05-16 Nippon Seiki Co Ltd 半導体圧力センサ
EP1359402B1 (en) * 2002-05-01 2014-10-01 Infineon Technologies AG Pressure sensor
JP2005221453A (ja) 2004-02-09 2005-08-18 Denso Corp 圧力センサ
US7028552B2 (en) 2004-05-17 2006-04-18 Kavlico Corporation Reliable piezo-resistive pressure sensor
JP4556784B2 (ja) 2005-06-27 2010-10-06 株式会社デンソー 圧力センサ
US7798010B2 (en) 2007-10-11 2010-09-21 Honeywell International Inc. Sensor geometry for improved package stress isolation
JP2011013178A (ja) 2009-07-06 2011-01-20 Yamatake Corp 圧力センサ及び製造方法
JP5335983B2 (ja) 2011-10-05 2013-11-06 Ｈｏｙａ株式会社 磁気ディスク用ガラス基板および磁気記録媒体
US9470593B2 (en) 2013-09-12 2016-10-18 Honeywell International Inc. Media isolated pressure sensor
CN104511479B (zh) * 2013-10-04 2017-01-11 Jx日矿日石金属株式会社 轧制铜箔
US20150276533A1 (en) * 2014-01-08 2015-10-01 Amphenol Thermometrics, Inc. Low Pressure Sensor and Flow Sensor
CN106457475A (zh) 2014-03-14 2017-02-22 康宁股份有限公司 嵌入玻璃的传感器及其制造过程
KR20170044143A (ko) * 2014-09-16 2017-04-24 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
JP6734202B2 (ja) 2015-01-13 2020-08-05 ロフィン−シナール テクノロジーズ エルエルシー 脆性材料をスクライブして化学エッチングする方法およびシステム
US10717670B2 (en) 2015-02-10 2020-07-21 Nippon Sheet Glass Company, Limited Glass for laser processing and method for producing perforated glass using same
CN205384625U (zh) * 2015-06-05 2016-07-13 旭硝子株式会社 玻璃基板、保护玻璃、以及便携式信息终端
DE102016213878B3 (de) 2016-07-28 2017-11-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gehäuse für einen Mikrochip mit einem strukturierten Schichtverbund und Herstellungsverfahren dafür
JP6528745B2 (ja) * 2016-09-06 2019-06-12 株式会社デンソー 圧力センサ
DE102018100299A1 (de) 2017-01-27 2018-08-02 Schott Ag Strukturiertes plattenförmiges Glaselement und Verfahren zu dessen Herstellung
DE102018110211A1 (de) 2018-04-27 2019-10-31 Schott Ag Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material
CN112512959A (zh) 2018-08-09 2021-03-16 Lpkf激光电子股份公司 用于制造微结构的方法

Also Published As

Publication number Publication date
JP7852196B2 (ja) 2026-04-28
WO2022013334A1 (de) 2022-01-20
DE102020118939A1 (de) 2022-01-20
JP2023534485A (ja) 2023-08-09
EP4162246B1 (de) 2025-09-03
EP4162246A1 (de) 2023-04-12
US20230175906A1 (en) 2023-06-08
US12596042B2 (en) 2026-04-07
CN116194403A (zh) 2023-05-30

Similar Documents

Publication Publication Date Title
US12017943B2 (en) Structured plate-like glass element and process for the production thereof
JP3770326B2 (ja) 分析装置
US7304800B2 (en) Optical tunable filter and method of manufacturing the same
JP7826605B2 (ja) 構造化壁を有するガラスエレメントおよびその製造方法
US9534925B2 (en) Hemitoroidal resonator gyroscope
US9620375B2 (en) Production method
JP6548566B2 (ja) 貫通配線基板の作製方法、及び電子デバイスの作製方法
KR20230038782A (ko) 압력 센서용 유리 웨이퍼 및 유리 요소
JP2009206291A (ja) 半導体基板、半導体装置、およびその製造方法
US20070180672A1 (en) Resonant-oscillating-device fabrication method
CN115461880A (zh) 用于制造电光转换器构件的间隔晶片、间隔件、用于制造间隔晶片的方法以及包括间隔件的电光转换器构件
JP2001091262A (ja) 半導体センサの製造方法、及び半導体センサ
JP6267549B2 (ja) 光センサ
CN109890551A (zh) 二氧化硅测试探针和其他此类装置
US11577992B2 (en) Methods and apparatus for forming shaped articles, shaped articles, methods for manufacturing liquid lenses, and liquid lenses
JP2017112187A (ja) 貫通配線を有する基板に素子を設けたデバイス及びその製造方法
JP4830545B2 (ja) 細胞電気生理センサの製造方法
KR100892066B1 (ko) 초소형 미러 및 그 제조방법
JP2004085869A (ja) Ｍｅｍｓ素子及びこれを用いた光減衰器、光スイッチ及び光スキャナ
JP2005173504A (ja) 波長可変フィルタの製造方法および波長可変フィルタ
JPH03128463A (ja) 半導体式加速度センサ

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902