CN116194403A - 玻璃晶片和用于压力传感器的玻璃元件 - Google Patents

玻璃晶片和用于压力传感器的玻璃元件 Download PDF

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Publication number
CN116194403A
CN116194403A CN202180060955.4A CN202180060955A CN116194403A CN 116194403 A CN116194403 A CN 116194403A CN 202180060955 A CN202180060955 A CN 202180060955A CN 116194403 A CN116194403 A CN 116194403A
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CN
China
Prior art keywords
glass
cross
opening
glass substrate
sectional area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180060955.4A
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English (en)
Chinese (zh)
Inventor
U·普切尔特
M·布莱辛格
T·乌茨
C·布雷特巴赫
M·瑶茨
S·利布施
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Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott AG filed Critical Schott AG
Publication of CN116194403A publication Critical patent/CN116194403A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00047—Cavities
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0609—Pressure pulsation damping arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Surface Treatment Of Glass (AREA)
  • Glass Compositions (AREA)
CN202180060955.4A 2020-07-17 2021-07-15 玻璃晶片和用于压力传感器的玻璃元件 Pending CN116194403A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102020118939.7 2020-07-17
DE102020118939.7A DE102020118939A1 (de) 2020-07-17 2020-07-17 Glaswafer und Glaselement für Drucksensoren
PCT/EP2021/069695 WO2022013334A1 (de) 2020-07-17 2021-07-15 Glaswafer und glaselement für drucksensoren

Publications (1)

Publication Number Publication Date
CN116194403A true CN116194403A (zh) 2023-05-30

Family

ID=77021345

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180060955.4A Pending CN116194403A (zh) 2020-07-17 2021-07-15 玻璃晶片和用于压力传感器的玻璃元件

Country Status (7)

Country Link
US (1) US12596042B2 (https=)
EP (1) EP4162246B1 (https=)
JP (1) JP7852196B2 (https=)
KR (1) KR20230038782A (https=)
CN (1) CN116194403A (https=)
DE (1) DE102020118939A1 (https=)
WO (1) WO2022013334A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022124863A1 (de) * 2022-09-27 2024-03-28 Schott Ag Glaswafer sowie Verfahren zu dessen Herstellung

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN87104354A (zh) * 1986-06-23 1988-01-20 罗斯蒙德公司 电容压力传感器
JPH09126924A (ja) * 1995-10-31 1997-05-16 Nippon Seiki Co Ltd 半導体圧力センサ
CN1455234A (zh) * 2002-05-01 2003-11-12 森桑诺尔有限公司 压力传感器
US20050172724A1 (en) * 2004-02-09 2005-08-11 Denso Corporation Pressure sensor
CN104511479A (zh) * 2013-10-04 2015-04-15 Jx日矿日石金属株式会社 轧制铜箔
US20150276533A1 (en) * 2014-01-08 2015-10-01 Amphenol Thermometrics, Inc. Low Pressure Sensor and Flow Sensor
CN106250800A (zh) * 2015-06-05 2016-12-21 旭硝子株式会社 玻璃基板及其制造方法、保护玻璃及其制造方法、以及便携式信息终端
CN107006128A (zh) * 2014-09-16 2017-08-01 Lpkf激光电子股份公司 用于在板状工件内加工至少一个凹槽或穿孔的方法
CN108358461A (zh) * 2017-01-27 2018-08-03 肖特股份有限公司 经结构化的板形玻璃元件及其制造方法
CN109690274A (zh) * 2016-09-06 2019-04-26 株式会社电装 压力传感器

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JPS57128074A (en) 1981-02-02 1982-08-09 Hitachi Ltd Semiconductor pressure sensor
JPH0254137A (ja) * 1988-08-17 1990-02-23 Toshiba Corp 半導体圧力センサー
US7028552B2 (en) 2004-05-17 2006-04-18 Kavlico Corporation Reliable piezo-resistive pressure sensor
JP4556784B2 (ja) 2005-06-27 2010-10-06 株式会社デンソー 圧力センサ
US7798010B2 (en) 2007-10-11 2010-09-21 Honeywell International Inc. Sensor geometry for improved package stress isolation
JP2011013178A (ja) 2009-07-06 2011-01-20 Yamatake Corp 圧力センサ及び製造方法
JP5335983B2 (ja) 2011-10-05 2013-11-06 Ｈｏｙａ株式会社 磁気ディスク用ガラス基板および磁気記録媒体
US9470593B2 (en) 2013-09-12 2016-10-18 Honeywell International Inc. Media isolated pressure sensor
CN106457475A (zh) 2014-03-14 2017-02-22 康宁股份有限公司 嵌入玻璃的传感器及其制造过程
JP6734202B2 (ja) 2015-01-13 2020-08-05 ロフィン−シナール テクノロジーズ エルエルシー 脆性材料をスクライブして化学エッチングする方法およびシステム
US10717670B2 (en) 2015-02-10 2020-07-21 Nippon Sheet Glass Company, Limited Glass for laser processing and method for producing perforated glass using same
DE102016213878B3 (de) 2016-07-28 2017-11-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gehäuse für einen Mikrochip mit einem strukturierten Schichtverbund und Herstellungsverfahren dafür
DE102018110211A1 (de) 2018-04-27 2019-10-31 Schott Ag Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material
CN112512959A (zh) 2018-08-09 2021-03-16 Lpkf激光电子股份公司 用于制造微结构的方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN87104354A (zh) * 1986-06-23 1988-01-20 罗斯蒙德公司 电容压力传感器
JPH09126924A (ja) * 1995-10-31 1997-05-16 Nippon Seiki Co Ltd 半導体圧力センサ
CN1455234A (zh) * 2002-05-01 2003-11-12 森桑诺尔有限公司 压力传感器
US20050172724A1 (en) * 2004-02-09 2005-08-11 Denso Corporation Pressure sensor
CN104511479A (zh) * 2013-10-04 2015-04-15 Jx日矿日石金属株式会社 轧制铜箔
US20150276533A1 (en) * 2014-01-08 2015-10-01 Amphenol Thermometrics, Inc. Low Pressure Sensor and Flow Sensor
CN107006128A (zh) * 2014-09-16 2017-08-01 Lpkf激光电子股份公司 用于在板状工件内加工至少一个凹槽或穿孔的方法
CN106250800A (zh) * 2015-06-05 2016-12-21 旭硝子株式会社 玻璃基板及其制造方法、保护玻璃及其制造方法、以及便携式信息终端
CN109690274A (zh) * 2016-09-06 2019-04-26 株式会社电装 压力传感器
CN108358461A (zh) * 2017-01-27 2018-08-03 肖特股份有限公司 经结构化的板形玻璃元件及其制造方法

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中华人民共和国国家质量监督检验检疫总局 中国国家标准化管理委员会: "中华人民共和国国家标准 产品几何技术规范(GPS) 表面结构 区域法 第2部分：术语、定义及表面结构参数", 1 November 2017, 中国标准出版社, pages: 4 *

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Publication number Publication date
JP7852196B2 (ja) 2026-04-28
WO2022013334A1 (de) 2022-01-20
DE102020118939A1 (de) 2022-01-20
JP2023534485A (ja) 2023-08-09
EP4162246B1 (de) 2025-09-03
KR20230038782A (ko) 2023-03-21
EP4162246A1 (de) 2023-04-12
US20230175906A1 (en) 2023-06-08
US12596042B2 (en) 2026-04-07

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