DE102020118939A1 - Glaswafer und Glaselement für Drucksensoren - Google Patents

Glaswafer und Glaselement für Drucksensoren Download PDF

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Publication number
DE102020118939A1
DE102020118939A1 DE102020118939.7A DE102020118939A DE102020118939A1 DE 102020118939 A1 DE102020118939 A1 DE 102020118939A1 DE 102020118939 A DE102020118939 A DE 102020118939A DE 102020118939 A1 DE102020118939 A1 DE 102020118939A1
Authority
DE
Germany
Prior art keywords
glass
opening
cross
glass substrate
skewness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102020118939.7A
Other languages
German (de)
English (en)
Inventor
Ulrich Peuchert
Martin Blezinger
Thomas Utz
Christian Breitbach
Matthias Jotz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott AG filed Critical Schott AG
Priority to DE102020118939.7A priority Critical patent/DE102020118939A1/de
Priority to KR1020237005574A priority patent/KR20230038782A/ko
Priority to EP21745324.0A priority patent/EP4162246B1/de
Priority to CN202180060955.4A priority patent/CN116194403A/zh
Priority to JP2023502968A priority patent/JP7852196B2/ja
Priority to PCT/EP2021/069695 priority patent/WO2022013334A1/de
Publication of DE102020118939A1 publication Critical patent/DE102020118939A1/de
Priority to US18/155,196 priority patent/US12596042B2/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00047—Cavities
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0609—Pressure pulsation damping arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Surface Treatment Of Glass (AREA)
  • Glass Compositions (AREA)
DE102020118939.7A 2020-07-17 2020-07-17 Glaswafer und Glaselement für Drucksensoren Pending DE102020118939A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102020118939.7A DE102020118939A1 (de) 2020-07-17 2020-07-17 Glaswafer und Glaselement für Drucksensoren
KR1020237005574A KR20230038782A (ko) 2020-07-17 2021-07-15 압력 센서용 유리 웨이퍼 및 유리 요소
EP21745324.0A EP4162246B1 (de) 2020-07-17 2021-07-15 Glaswafer und glaselement für drucksensoren
CN202180060955.4A CN116194403A (zh) 2020-07-17 2021-07-15 玻璃晶片和用于压力传感器的玻璃元件
JP2023502968A JP7852196B2 (ja) 2020-07-17 2021-07-15 圧力センサ用のガラスウエハおよびガラスエレメント
PCT/EP2021/069695 WO2022013334A1 (de) 2020-07-17 2021-07-15 Glaswafer und glaselement für drucksensoren
US18/155,196 US12596042B2 (en) 2020-07-17 2023-01-17 Glass wafer and glass element for pressure sensors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102020118939.7A DE102020118939A1 (de) 2020-07-17 2020-07-17 Glaswafer und Glaselement für Drucksensoren

Publications (1)

Publication Number Publication Date
DE102020118939A1 true DE102020118939A1 (de) 2022-01-20

Family

ID=77021345

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102020118939.7A Pending DE102020118939A1 (de) 2020-07-17 2020-07-17 Glaswafer und Glaselement für Drucksensoren

Country Status (7)

Country Link
US (1) US12596042B2 (https=)
EP (1) EP4162246B1 (https=)
JP (1) JP7852196B2 (https=)
KR (1) KR20230038782A (https=)
CN (1) CN116194403A (https=)
DE (1) DE102020118939A1 (https=)
WO (1) WO2022013334A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022124863A1 (de) * 2022-09-27 2024-03-28 Schott Ag Glaswafer sowie Verfahren zu dessen Herstellung

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128074A (en) 1981-02-02 1982-08-09 Hitachi Ltd Semiconductor pressure sensor
JPH09126924A (ja) 1995-10-31 1997-05-16 Nippon Seiki Co Ltd 半導体圧力センサ
US20050172724A1 (en) 2004-02-09 2005-08-11 Denso Corporation Pressure sensor
US20050252298A1 (en) 2004-05-17 2005-11-17 Kavlico Corporation Reliable piezo-resistive pressure sensor
US20060288793A1 (en) 2005-06-27 2006-12-28 Denso Corporation Pressure sensor
US20090096040A1 (en) 2007-10-11 2009-04-16 Honeywell International Inc. Sensor geometry for improved package stress isolation
US20110000304A1 (en) 2009-07-06 2011-01-06 Yamatake Corporation Pressure sensor and manufacturing method
US20130089754A1 (en) 2011-10-05 2013-04-11 Hoya Glass Disk (Thailand) Ltd. Glass substrate for magnetic disk and magnetic recording medium
US20150261261A1 (en) 2014-03-14 2015-09-17 Corning Incorporated Sensor embedded in glass and process for making same
US9470593B2 (en) 2013-09-12 2016-10-18 Honeywell International Inc. Media isolated pressure sensor
DE102016213878B3 (de) 2016-07-28 2017-11-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gehäuse für einen Mikrochip mit einem strukturierten Schichtverbund und Herstellungsverfahren dafür
WO2020030222A1 (de) 2018-08-09 2020-02-13 Lpkf Laser & Electronics Ag Verfahren zur herstellung von mikrostrukturen

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4730496A (en) * 1986-06-23 1988-03-15 Rosemount Inc. Capacitance pressure sensor
JPH0254137A (ja) * 1988-08-17 1990-02-23 Toshiba Corp 半導体圧力センサー
EP1359402B1 (en) * 2002-05-01 2014-10-01 Infineon Technologies AG Pressure sensor
CN104511479B (zh) * 2013-10-04 2017-01-11 Jx日矿日石金属株式会社 轧制铜箔
US20150276533A1 (en) * 2014-01-08 2015-10-01 Amphenol Thermometrics, Inc. Low Pressure Sensor and Flow Sensor
KR20170044143A (ko) * 2014-09-16 2017-04-24 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
JP6734202B2 (ja) 2015-01-13 2020-08-05 ロフィン−シナール テクノロジーズ エルエルシー 脆性材料をスクライブして化学エッチングする方法およびシステム
US10717670B2 (en) 2015-02-10 2020-07-21 Nippon Sheet Glass Company, Limited Glass for laser processing and method for producing perforated glass using same
CN205384625U (zh) * 2015-06-05 2016-07-13 旭硝子株式会社 玻璃基板、保护玻璃、以及便携式信息终端
JP6528745B2 (ja) * 2016-09-06 2019-06-12 株式会社デンソー 圧力センサ
DE102018100299A1 (de) 2017-01-27 2018-08-02 Schott Ag Strukturiertes plattenförmiges Glaselement und Verfahren zu dessen Herstellung
DE102018110211A1 (de) 2018-04-27 2019-10-31 Schott Ag Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128074A (en) 1981-02-02 1982-08-09 Hitachi Ltd Semiconductor pressure sensor
JPH09126924A (ja) 1995-10-31 1997-05-16 Nippon Seiki Co Ltd 半導体圧力センサ
US20050172724A1 (en) 2004-02-09 2005-08-11 Denso Corporation Pressure sensor
US20050252298A1 (en) 2004-05-17 2005-11-17 Kavlico Corporation Reliable piezo-resistive pressure sensor
US20060288793A1 (en) 2005-06-27 2006-12-28 Denso Corporation Pressure sensor
US20090096040A1 (en) 2007-10-11 2009-04-16 Honeywell International Inc. Sensor geometry for improved package stress isolation
US20110000304A1 (en) 2009-07-06 2011-01-06 Yamatake Corporation Pressure sensor and manufacturing method
US20130089754A1 (en) 2011-10-05 2013-04-11 Hoya Glass Disk (Thailand) Ltd. Glass substrate for magnetic disk and magnetic recording medium
US9470593B2 (en) 2013-09-12 2016-10-18 Honeywell International Inc. Media isolated pressure sensor
US20150261261A1 (en) 2014-03-14 2015-09-17 Corning Incorporated Sensor embedded in glass and process for making same
DE102016213878B3 (de) 2016-07-28 2017-11-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gehäuse für einen Mikrochip mit einem strukturierten Schichtverbund und Herstellungsverfahren dafür
WO2020030222A1 (de) 2018-08-09 2020-02-13 Lpkf Laser & Electronics Ag Verfahren zur herstellung von mikrostrukturen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022124863A1 (de) * 2022-09-27 2024-03-28 Schott Ag Glaswafer sowie Verfahren zu dessen Herstellung

Also Published As

Publication number Publication date
JP7852196B2 (ja) 2026-04-28
WO2022013334A1 (de) 2022-01-20
JP2023534485A (ja) 2023-08-09
EP4162246B1 (de) 2025-09-03
KR20230038782A (ko) 2023-03-21
EP4162246A1 (de) 2023-04-12
US20230175906A1 (en) 2023-06-08
US12596042B2 (en) 2026-04-07
CN116194403A (zh) 2023-05-30

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