JP7835997B2 - Ｂｇａ高周波モジュール、ｂｇａ高周波モジュール用基板、および光通信モジュール - Google Patents

Ｂｇａ高周波モジュール、ｂｇａ高周波モジュール用基板、および光通信モジュール

Info

Publication number
JP7835997B2
JP7835997B2 JP2024505722A JP2024505722A JP7835997B2 JP 7835997 B2 JP7835997 B2 JP 7835997B2 JP 2024505722 A JP2024505722 A JP 2024505722A JP 2024505722 A JP2024505722 A JP 2024505722A JP 7835997 B2 JP7835997 B2 JP 7835997B2
Authority
JP
Japan
Prior art keywords
pad
signal
ground
distance
signal pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024505722A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023170818A1 (https=
Inventor
雅之 高橋
健 都築
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
NTT Inc USA
Original Assignee
Nippon Telegraph and Telephone Corp
NTT Inc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp, NTT Inc USA filed Critical Nippon Telegraph and Telephone Corp
Publication of JPWO2023170818A1 publication Critical patent/JPWO2023170818A1/ja
Application granted granted Critical
Publication of JP7835997B2 publication Critical patent/JP7835997B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Lasers (AREA)
JP2024505722A 2022-03-09 2022-03-09 Ｂｇａ高周波モジュール、ｂｇａ高周波モジュール用基板、および光通信モジュール Active JP7835997B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/010287 WO2023170818A1 (ja) 2022-03-09 2022-03-09 Ｂｇａ高周波モジュール、ｂｇａ高周波モジュール用基板、および光通信モジュール

Publications (2)

Publication Number Publication Date
JPWO2023170818A1 JPWO2023170818A1 (https=) 2023-09-14
JP7835997B2 true JP7835997B2 (ja) 2026-03-26

Family

ID=87936292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024505722A Active JP7835997B2 (ja) 2022-03-09 2022-03-09 Ｂｇａ高周波モジュール、ｂｇａ高周波モジュール用基板、および光通信モジュール

Country Status (3)

Country Link
US (1) US20250185153A1 (https=)
JP (1) JP7835997B2 (https=)
WO (1) WO2023170818A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004134647A (ja) 2002-10-11 2004-04-30 Seiko Epson Corp 回路基板、バンプ付き半導体素子の実装構造、及び電気光学装置、並びに電子機器
WO2005098359A1 (ja) 2004-04-07 2005-10-20 Murata Manufacturing Co., Ltd. 角速度計測装置
JP2013172036A (ja) 2012-02-21 2013-09-02 Fujitsu Ltd 多層配線基板及び電子機器
JP2013172017A (ja) 2012-02-21 2013-09-02 Fujitsu Ltd 多層配線基板及び電子機器
US20210057319A1 (en) 2018-09-28 2021-02-25 Juniper Networks, Inc. Multi-pitch ball grid array

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2502535Y2 (ja) * 1990-07-04 1996-06-26 新光電気工業株式会社 Ｐｇａ型セラミックパッケ―ジ
JPH09270477A (ja) * 1996-03-29 1997-10-14 Sumitomo Kinzoku Electro Device:Kk セラミック基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004134647A (ja) 2002-10-11 2004-04-30 Seiko Epson Corp 回路基板、バンプ付き半導体素子の実装構造、及び電気光学装置、並びに電子機器
WO2005098359A1 (ja) 2004-04-07 2005-10-20 Murata Manufacturing Co., Ltd. 角速度計測装置
JP2013172036A (ja) 2012-02-21 2013-09-02 Fujitsu Ltd 多層配線基板及び電子機器
JP2013172017A (ja) 2012-02-21 2013-09-02 Fujitsu Ltd 多層配線基板及び電子機器
US20210057319A1 (en) 2018-09-28 2021-02-25 Juniper Networks, Inc. Multi-pitch ball grid array

Also Published As

Publication number Publication date
US20250185153A1 (en) 2025-06-05
WO2023170818A1 (ja) 2023-09-14
JPWO2023170818A1 (https=) 2023-09-14

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