JP7786384B2 - ネガ型感光性樹脂組成物 - Google Patents

ネガ型感光性樹脂組成物

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Publication number
JP7786384B2
JP7786384B2 JP2022553777A JP2022553777A JP7786384B2 JP 7786384 B2 JP7786384 B2 JP 7786384B2 JP 2022553777 A JP2022553777 A JP 2022553777A JP 2022553777 A JP2022553777 A JP 2022553777A JP 7786384 B2 JP7786384 B2 JP 7786384B2
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resin composition
ring
mol
polymer
parts
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JP2022553777A
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Japanese (ja)
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JPWO2022070871A1 (https=
Inventor
隆志 堤
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Zeon Corp
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Zeon Corp
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
JP2022553777A 2020-09-29 2021-09-13 ネガ型感光性樹脂組成物 Active JP7786384B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020164168 2020-09-29
JP2020164168 2020-09-29
PCT/JP2021/033611 WO2022070871A1 (ja) 2020-09-29 2021-09-13 ネガ型感光性樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2022070871A1 JPWO2022070871A1 (https=) 2022-04-07
JP7786384B2 true JP7786384B2 (ja) 2025-12-16

Family

ID=80951401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022553777A Active JP7786384B2 (ja) 2020-09-29 2021-09-13 ネガ型感光性樹脂組成物

Country Status (6)

Country Link
US (1) US12601971B2 (https=)
JP (1) JP7786384B2 (https=)
KR (1) KR102786311B1 (https=)
CN (1) CN116075534B (https=)
TW (1) TWI908883B (https=)
WO (1) WO2022070871A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023053976A1 (ja) * 2021-09-29 2023-04-06 日本ゼオン株式会社 樹脂組成物

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006106530A (ja) 2004-10-08 2006-04-20 Sumitomo Bakelite Co Ltd 表示体装置カラーフィルター用感光性樹脂組成物及びこれを用いた表示装置、表示体装置の製造方法
JP2006139284A (ja) 2005-11-10 2006-06-01 Jsr Corp 半導体デバイス製造用感放射線性樹脂組成物
JP2008026600A (ja) 2006-07-21 2008-02-07 Shin Etsu Chem Co Ltd レジスト下層膜形成材料及びパターン形成方法
JP2011154264A (ja) 2010-01-28 2011-08-11 Shibaura Institute Of Technology イオンビーム描画用ネガ型レジスト組成物及びパターン形成方法
WO2012132150A1 (ja) 2011-03-28 2012-10-04 日本ゼオン株式会社 熱硬化性架橋環状オレフィン樹脂組成物、熱硬化性架橋環状オレフィン樹脂フィルム、熱硬化性架橋環状オレフィン樹脂組成物の製造方法及び熱硬化性架橋環状オレフィン樹脂フィルムの製造方法
JP2017525836A (ja) 2014-08-07 2017-09-07 テルヌ エスアーエスＴｅｌｅｎｅ Ｓａｓ 硬化性組成物及びその組成物を含む成形品

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3804138B2 (ja) * 1996-02-09 2006-08-02 Ｊｓｒ株式会社 ＡｒＦエキシマレーザー照射用感放射線性樹脂組成物
DE19742980A1 (de) * 1997-09-29 1999-04-01 Espe Dental Ag Dentalmassen auf der Basis von ROMP-Oligomeren oder -Polymeren
JP2006156821A (ja) 2004-11-30 2006-06-15 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂層、樹脂層付きキャリア材料および回路基板
TWI636330B (zh) * 2013-05-29 2018-09-21 Sumitomo Bakelite Co., Ltd. 負型感光性樹脂組成物、電子裝置及聚合物
JP6530410B2 (ja) * 2013-09-10 2019-06-12 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ オキシムエステル光開始剤
CN105993065B (zh) * 2013-11-28 2019-03-08 国立大学法人东北大学 半导体元件的制造方法
CN110178085B (zh) * 2017-01-10 2022-10-21 住友电木株式会社 负型感光性树脂组合物、树脂膜和电子装置
EP3861032A4 (en) * 2018-10-03 2022-08-03 Materia, Inc. POLYMERS FOR SPECIAL APPLICATIONS

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006106530A (ja) 2004-10-08 2006-04-20 Sumitomo Bakelite Co Ltd 表示体装置カラーフィルター用感光性樹脂組成物及びこれを用いた表示装置、表示体装置の製造方法
JP2006139284A (ja) 2005-11-10 2006-06-01 Jsr Corp 半導体デバイス製造用感放射線性樹脂組成物
JP2008026600A (ja) 2006-07-21 2008-02-07 Shin Etsu Chem Co Ltd レジスト下層膜形成材料及びパターン形成方法
JP2011154264A (ja) 2010-01-28 2011-08-11 Shibaura Institute Of Technology イオンビーム描画用ネガ型レジスト組成物及びパターン形成方法
WO2012132150A1 (ja) 2011-03-28 2012-10-04 日本ゼオン株式会社 熱硬化性架橋環状オレフィン樹脂組成物、熱硬化性架橋環状オレフィン樹脂フィルム、熱硬化性架橋環状オレフィン樹脂組成物の製造方法及び熱硬化性架橋環状オレフィン樹脂フィルムの製造方法
JP2017525836A (ja) 2014-08-07 2017-09-07 テルヌ エスアーエスＴｅｌｅｎｅ Ｓａｓ 硬化性組成物及びその組成物を含む成形品

Also Published As

Publication number Publication date
CN116075534A (zh) 2023-05-05
WO2022070871A1 (ja) 2022-04-07
JPWO2022070871A1 (https=) 2022-04-07
US20230305397A1 (en) 2023-09-28
KR102786311B1 (ko) 2025-03-24
CN116075534B (zh) 2025-08-01
US12601971B2 (en) 2026-04-14
KR20230076126A (ko) 2023-05-31
TWI908883B (zh) 2025-12-21
TW202216820A (zh) 2022-05-01

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